JP5189429B2 - 半導体装置及びその作製方法 - Google Patents

半導体装置及びその作製方法 Download PDF

Info

Publication number
JP5189429B2
JP5189429B2 JP2008191272A JP2008191272A JP5189429B2 JP 5189429 B2 JP5189429 B2 JP 5189429B2 JP 2008191272 A JP2008191272 A JP 2008191272A JP 2008191272 A JP2008191272 A JP 2008191272A JP 5189429 B2 JP5189429 B2 JP 5189429B2
Authority
JP
Japan
Prior art keywords
antenna
integrated circuit
structures
film
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008191272A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009054145A (ja
JP2009054145A5 (enExample
Inventor
舜平 山崎
潤 小山
清 加藤
貴章 高縁
裕人 八窪
真 柳澤
久 大谷
栄二 杉山
のぞみ 堀越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2008191272A priority Critical patent/JP5189429B2/ja
Publication of JP2009054145A publication Critical patent/JP2009054145A/ja
Publication of JP2009054145A5 publication Critical patent/JP2009054145A5/ja
Application granted granted Critical
Publication of JP5189429B2 publication Critical patent/JP5189429B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07735—Physical layout of the record carrier the record carrier comprising means for protecting against electrostatic discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Credit Cards Or The Like (AREA)
JP2008191272A 2007-07-27 2008-07-24 半導体装置及びその作製方法 Expired - Fee Related JP5189429B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008191272A JP5189429B2 (ja) 2007-07-27 2008-07-24 半導体装置及びその作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007195497 2007-07-27
JP2007195497 2007-07-27
JP2008191272A JP5189429B2 (ja) 2007-07-27 2008-07-24 半導体装置及びその作製方法

Publications (3)

Publication Number Publication Date
JP2009054145A JP2009054145A (ja) 2009-03-12
JP2009054145A5 JP2009054145A5 (enExample) 2011-07-07
JP5189429B2 true JP5189429B2 (ja) 2013-04-24

Family

ID=39929604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008191272A Expired - Fee Related JP5189429B2 (ja) 2007-07-27 2008-07-24 半導体装置及びその作製方法

Country Status (6)

Country Link
US (3) US7932589B2 (enExample)
EP (1) EP2019425A1 (enExample)
JP (1) JP5189429B2 (enExample)
KR (2) KR101489167B1 (enExample)
CN (1) CN101354755B (enExample)
TW (1) TWI442536B (enExample)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2019425A1 (en) 2007-07-27 2009-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8284557B2 (en) * 2007-10-18 2012-10-09 Kyocera Corporation Circuit board, mounting structure, and method for manufacturing circuit board
CN102057488B (zh) * 2008-06-06 2013-09-18 株式会社半导体能源研究所 半导体装置的制造方法
JP2010041040A (ja) * 2008-07-10 2010-02-18 Semiconductor Energy Lab Co Ltd 光電変換装置および光電変換装置の製造方法
WO2010032611A1 (en) * 2008-09-19 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2010035625A1 (en) 2008-09-25 2010-04-01 Semiconductor Energy Laboratory Co., Ltd. Semi conductor device
KR101611643B1 (ko) * 2008-10-01 2016-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2011003522A (ja) 2008-10-16 2011-01-06 Semiconductor Energy Lab Co Ltd フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法
US8089418B2 (en) * 2008-12-04 2012-01-03 Intel Corporation Antenna structure
WO2010140522A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and manufacturing method thereof
KR101677076B1 (ko) * 2009-06-05 2016-11-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광전 변환 디바이스 및 그 제조 방법
WO2010140539A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and method for manufacturing the same
TWI517268B (zh) * 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5501174B2 (ja) * 2009-09-17 2014-05-21 株式会社半導体エネルギー研究所 半導体装置
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
US8895950B2 (en) 2009-10-23 2014-11-25 Nantero Inc. Methods for passivating a carbonic nanolayer
WO2011093151A1 (en) 2010-01-29 2011-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device including the same
CN102236814A (zh) * 2010-04-26 2011-11-09 永奕科技股份有限公司 射频识别标签模组
CN102236815A (zh) * 2010-04-26 2011-11-09 永奕科技股份有限公司 射频识别标签模组、容置体与堆叠容置体结构
KR101678055B1 (ko) * 2010-06-15 2016-11-22 삼성전자 주식회사 전자파 간섭 제거 장치 및 이를 포함하는 반도체 패키지
CN101937885B (zh) * 2010-08-12 2013-03-20 日月光半导体制造股份有限公司 半导体封装件及其制造方法
KR20120077473A (ko) * 2010-12-30 2012-07-10 삼성모바일디스플레이주식회사 플렉서블 기판 및 상기 플렉서블 기판을 포함하는 표시 장치
DE102011056323A1 (de) * 2011-12-13 2013-06-13 Infineon Technologies Ag Booster-Antennenstruktur für eine Chipkarte
JP5850784B2 (ja) 2012-03-29 2016-02-03 Ｄｏｗａエレクトロニクス株式会社 ブースターアンテナおよびその製造方法
CN104428946B (zh) * 2012-06-26 2018-04-06 东洋制罐集团控股株式会社 Rf标签
JP5929549B2 (ja) * 2012-06-26 2016-06-08 東洋製罐株式会社 Ｒｆタグ
US9324020B2 (en) * 2012-08-30 2016-04-26 Nxp B.V. Antenna structures and methods for omni directional radiation patterns
CN104769661B (zh) 2012-11-05 2017-07-18 佛罗里达大学研究基金会有限公司 显示器中的亮度补偿
EP2926376B1 (en) * 2012-11-30 2017-11-08 University of Florida Research Foundation, Inc. Ambipolar vertical field effect transistor
JP2014119784A (ja) * 2012-12-13 2014-06-30 Toppan Printing Co Ltd Ｉｃ付冊子及びその製造方法
US20140203912A1 (en) * 2013-01-23 2014-07-24 King's Metal Fiber Technologies Co., Ltd. Radio frequency identification tag
JP6119325B2 (ja) * 2013-03-14 2017-04-26 セイコーエプソン株式会社 干渉フィルター、干渉フィルターの製造方法、光学モジュール、電子機器、及び接合基板
KR102068093B1 (ko) * 2013-11-04 2020-01-20 엘지디스플레이 주식회사 플렉서블 표시장치 제조 방법
US10839975B2 (en) * 2014-03-10 2020-11-17 The Boeing Company Graphene coated electronic components
JP2015216072A (ja) 2014-05-13 2015-12-03 株式会社ジャパンディスプレイ 有機ｅｌ装置及びその製造方法
CN207320328U (zh) * 2015-02-16 2018-05-04 株式会社村田制作所 天线装置及通信终端装置
CN107210370A (zh) * 2015-03-06 2017-09-26 富士胶片株式会社 光电转换元件、太阳能电池及组合物
FR3042296B1 (fr) * 2015-10-09 2018-11-30 Fenotag Produit, procede et outil industriel permettant la fabrication de tags rfid dans le domaine de la tracabilite de produits textiles comme par exemple dans les blanchisseries industrielles
US10371129B2 (en) * 2016-02-26 2019-08-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and sensor system
JP6251770B2 (ja) * 2016-04-15 2017-12-20 株式会社エスケーエレクトロニクス Ｒｆｉｄタグ
GB2562043B (en) * 2017-04-28 2020-04-29 Drayson Tech Europe Ltd Loop RF Power Harvester
WO2019079441A1 (en) * 2017-10-18 2019-04-25 Commscope Technologies Llc RADIANT ELEMENTS WITH WIDEBAND STACKED PLATES AND PHASE CONTROL NETWORK ANTENNAS THEREFOR
JP6360611B1 (ja) * 2017-12-05 2018-07-18 ユニチカ株式会社 不燃性シート、該不燃性シートを含む防煙垂壁
EP4266017B1 (en) * 2018-12-06 2025-05-14 Avery Dennison Retail Information Services LLC Temperature-sensing rfid device
US11259443B1 (en) * 2019-03-11 2022-02-22 Smartrac Investment B.V. Heat resistant RFID tags
KR102752195B1 (ko) * 2020-09-16 2025-01-10 삼성전자주식회사 패치 안테나 및 코일 안테나를 포함하는 전자 장치
WO2022163679A1 (ja) * 2021-01-27 2022-08-04 日新電機株式会社 ダイヤモンドセンサユニット
DE102021102349A1 (de) 2021-02-02 2022-08-04 Manfred Rietzler RFID-Funketikett zum Befestigen an einer Textilie
CN115706082A (zh) * 2021-08-13 2023-02-17 联华电子股份有限公司 具有蛇状金属导线的金属内连线结构
CN116162341A (zh) * 2023-02-28 2023-05-26 广东省亚克迪新材料科技有限公司 一种5g天线罩

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4602051A (en) * 1983-09-07 1986-07-22 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition having electromagnetic wave shielding effort
KR930003894B1 (ko) 1989-01-25 1993-05-15 아사히가세이고오교가부시끼가이샤 신규한 프리프레그와 복합 성형체, 및 복합 성형체의 제조방법
DE3907757A1 (de) 1989-03-10 1990-09-13 Mtu Muenchen Gmbh Schutzfolie
JPH05190582A (ja) 1992-01-08 1993-07-30 Oki Electric Ind Co Ltd 樹脂封止半導体装置及びその製造方法
JP3024399B2 (ja) 1992-11-13 2000-03-21 松下電器産業株式会社 半導体集積回路
JP3523718B2 (ja) 1995-02-06 2004-04-26 株式会社ルネサステクノロジ 半導体装置
JP3364081B2 (ja) 1995-02-16 2003-01-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
US5757456A (en) 1995-03-10 1998-05-26 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating involving peeling circuits from one substrate and mounting on other
CN1107922C (zh) 1995-06-16 2003-05-07 罗姆股份有限公司 半导体器件,使用同样器件的ic卡和通信系统
JPH1092980A (ja) 1996-09-13 1998-04-10 Toshiba Corp 無線カードおよびその製造方法
JPH10307898A (ja) 1997-05-09 1998-11-17 Toppan Printing Co Ltd 充電式非接触ｉｃカードシステム
JP3646472B2 (ja) 1997-05-19 2005-05-11 株式会社日立製作所 非接触型ｉｃカードおよび送受信回路
JP3566056B2 (ja) 1997-12-26 2004-09-15 セイコーインスツルメンツ株式会社 電子機器
US6414318B1 (en) 1998-11-06 2002-07-02 Bridge Semiconductor Corporation Electronic circuit
TW484101B (en) 1998-12-17 2002-04-21 Hitachi Ltd Semiconductor device and its manufacturing method
US6224965B1 (en) 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling
JP4423779B2 (ja) 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
US6509217B1 (en) 1999-10-22 2003-01-21 Damoder Reddy Inexpensive, reliable, planar RFID tag structure and method for making same
DE10004922A1 (de) 2000-02-04 2001-08-09 Giesecke & Devrient Gmbh Transponder, insbesondere für eine kontaktlose Chipkarte
JP2001229355A (ja) * 2000-02-17 2001-08-24 Tamura Electric Works Ltd 非接触ｉｃカード
JP3835968B2 (ja) 2000-03-06 2006-10-18 松下電器産業株式会社 半導体集積回路
JP3614747B2 (ja) 2000-03-07 2005-01-26 Ｎｅｃエレクトロニクス株式会社 昇圧回路、それを搭載したｉｃカード及びそれを搭載した電子機器
US20020049714A1 (en) 2000-05-11 2002-04-25 Shunpei Yamazaki Communication system
JP2002231545A (ja) 2001-02-02 2002-08-16 Matsushita Electric Ind Co Ltd 非接触電源装置
US6870516B2 (en) * 2001-02-16 2005-03-22 Integral Technologies, Inc. Low cost antennas using conductive plastics or conductive composites
JP3905418B2 (ja) 2001-05-18 2007-04-18 セイコーインスツル株式会社 電源装置および電子機器
JP2003006592A (ja) 2001-06-21 2003-01-10 Matsushita Electric Ind Co Ltd 情報送受信装置
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
JP2003070187A (ja) 2001-08-27 2003-03-07 Toshiba Eng Co Ltd 非接触データキャリア装置並びに内蔵二次電池の充電方法
JP2003123033A (ja) 2001-10-12 2003-04-25 Nec Eng Ltd Ｉｃチップ及びそれを用いる商品管理システム並びに商品管理方法
US6737302B2 (en) 2001-10-31 2004-05-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for field-effect transistor
KR100430001B1 (ko) 2001-12-18 2004-05-03 엘지전자 주식회사 다층기판의 제조방법, 그 다층기판의 패드 형성방법 및 그다층기판을 이용한 반도체 패키지의 제조방법
JP3915092B2 (ja) 2002-01-21 2007-05-16 株式会社エフ・イー・シー Ｉｃカード用のブースタアンテナ
JP4007932B2 (ja) 2002-03-19 2007-11-14 株式会社タキオン マイクロ波送電法、マイクロ波受電装置及びｉｄタグシステム
JP2003299255A (ja) 2002-04-02 2003-10-17 Nippon Telegr & Teleph Corp <Ntt> 携帯型充電装置
JP2003317058A (ja) * 2002-04-19 2003-11-07 Oji Paper Co Ltd Ｉｃチップ実装体
US7485489B2 (en) 2002-06-19 2009-02-03 Bjoersell Sten Electronics circuit manufacture
AU2003253227A1 (en) 2002-06-19 2004-01-06 Sten Bjorsell Electronics circuit manufacture
JP2004023765A (ja) 2002-06-20 2004-01-22 Sanyo Electric Co Ltd 無線型データ伝送装置
JP2004064937A (ja) 2002-07-31 2004-02-26 Nec Corp チャージポンプ型昇圧回路
JP4719852B2 (ja) 2002-10-18 2011-07-06 シンボル テクノロジーズ， インコーポレイテッド パッシブｒｆｉｄタグの不必要な再交渉を最小化するためのシステムおよび方法
JP4015008B2 (ja) 2002-11-21 2007-11-28 株式会社ルネサステクノロジ 通信用半導体集積回路および無線通信システム
US7652359B2 (en) 2002-12-27 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Article having display device
JP2004343410A (ja) 2003-05-15 2004-12-02 Hitachi Maxell Ltd 非接触通信式情報担体
JP4828088B2 (ja) 2003-06-05 2011-11-30 凸版印刷株式会社 Ｉｃタグ
JP3902769B2 (ja) 2003-08-29 2007-04-11 松下電器産業株式会社 降圧電圧出力回路
US7737658B2 (en) 2003-10-27 2010-06-15 Sony Corporation Battery packs having a charging mode and a discharging mode
US7768405B2 (en) 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
JP2005229098A (ja) 2003-12-12 2005-08-25 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
US7494066B2 (en) * 2003-12-19 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2005210843A (ja) 2004-01-23 2005-08-04 Toyota Motor Corp 電力供給システム、車載電源装置及び路側電源装置
CN1918708B (zh) * 2004-02-06 2013-07-17 株式会社半导体能源研究所 半导体装置
JP2005235615A (ja) 2004-02-20 2005-09-02 Hitachi Maxell Ltd アダプタパネル、電子機器、及びケーブルコネクタ認識システム
JP2005252853A (ja) 2004-03-05 2005-09-15 Fec Inc Ｒｆ−ｉｄ用アンテナ
US20050233122A1 (en) 2004-04-19 2005-10-20 Mikio Nishimura Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
JP2005316724A (ja) 2004-04-28 2005-11-10 Matsushita Electric Works Ltd アクティブ型ｒｆｉｄタグ
JP2005321911A (ja) 2004-05-07 2005-11-17 Dainippon Printing Co Ltd 発光素子付き透明ｉｃカード
JP2005352434A (ja) 2004-05-11 2005-12-22 Seiko Epson Corp 電気光学装置、電気光学装置の製造方法および電子機器
JP4611093B2 (ja) 2004-05-12 2011-01-12 セイコーインスツル株式会社 電波発電回路
JP2006004015A (ja) 2004-06-15 2006-01-05 Ts Photon:Kk バッテリーレス型プログラム制御可能な論理回路付きｒｆｉｄ応答器
JP2006024087A (ja) 2004-07-09 2006-01-26 Nec Corp 無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法
JP4749074B2 (ja) * 2004-07-30 2011-08-17 株式会社半導体エネルギー研究所 Ｉｃチップの作製方法及び装置
WO2006011665A1 (en) 2004-07-30 2006-02-02 Semiconductor Energy Laboratory Co., Ltd. Laminating system, ic sheet, scroll of ic sheet, and method for manufacturing ic chip
CN101084616B (zh) 2004-09-09 2012-06-27 株式会社半导体能源研究所 无线芯片
KR101176027B1 (ko) 2004-10-19 2012-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 안테나를 구비한 반도체장치 및 그 제조 방법
JP2006180073A (ja) 2004-12-21 2006-07-06 Okayama Prefecture 無線ｉｃタグ
JP4541246B2 (ja) 2004-12-24 2010-09-08 トッパン・フォームズ株式会社 非接触ｉｃモジュール
JP2006293690A (ja) 2005-04-11 2006-10-26 Sanyo Electric Co Ltd 集積回路及び無線ｉｃタグ
CN100412881C (zh) * 2005-04-30 2008-08-20 仁宝电脑工业股份有限公司 无线射频识别系统
WO2007016433A2 (en) * 2005-07-29 2007-02-08 Foster-Miller, Inc. Electromechanical structure and method of making same
US7863188B2 (en) * 2005-07-29 2011-01-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7776656B2 (en) 2005-07-29 2010-08-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
EP1758439A1 (en) 2005-08-23 2007-02-28 THOMSON Licensing Peripheral skirt intended to be attached underneath the bottom panel of a device, and corresponding device
JP2007059821A (ja) * 2005-08-26 2007-03-08 Shinko Electric Ind Co Ltd 配線基板の製造方法
EP1977481B1 (en) * 2006-01-24 2013-08-21 NDS Limited Chip attack protection
WO2007105607A1 (en) 2006-03-10 2007-09-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN101385039B (zh) 2006-03-15 2012-03-21 株式会社半导体能源研究所 半导体器件
TWI431726B (zh) 2006-06-01 2014-03-21 Semiconductor Energy Lab 非揮發性半導體記憶體裝置
CN101479747B (zh) 2006-06-26 2011-05-18 株式会社半导体能源研究所 包括半导体器件的纸及其制造方法
JP4382783B2 (ja) * 2006-08-09 2009-12-16 富士通株式会社 Ｒｆｉｄタグ
KR101349880B1 (ko) 2006-10-02 2014-01-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치
EP2019425A1 (en) * 2007-07-27 2009-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
US9412060B2 (en) 2016-08-09
TW200924154A (en) 2009-06-01
KR20130090392A (ko) 2013-08-13
CN101354755A (zh) 2009-01-28
KR101489173B1 (ko) 2015-02-05
KR20090012173A (ko) 2009-02-02
US7932589B2 (en) 2011-04-26
TWI442536B (zh) 2014-06-21
US20090085182A1 (en) 2009-04-02
JP2009054145A (ja) 2009-03-12
KR101489167B1 (ko) 2015-02-03
EP2019425A1 (en) 2009-01-28
CN101354755B (zh) 2013-07-31
US8872331B2 (en) 2014-10-28
US20110186949A1 (en) 2011-08-04
US20150014419A1 (en) 2015-01-15

Similar Documents

Publication Publication Date Title
JP5189429B2 (ja) 半導体装置及びその作製方法
JP5770325B2 (ja) 半導体装置
CN102156901B (zh) 包括半导体器件的纸及具有该纸的物品
KR101161361B1 (ko) 반도체장치
US7994617B2 (en) Semiconductor device
US8159043B2 (en) Semiconductor device
JP5464914B2 (ja) 半導体装置の作製方法
JP4566794B2 (ja) 半導体装置
CN101233531B (zh) 半导体装置的制造方法
US7465596B2 (en) Manufacturing method of semiconductor device
JP4545617B2 (ja) 半導体装置
HK1127934A (en) Semiconductor device and method for manufacturing the same

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110523

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110523

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121228

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130124

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160201

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160201

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees