JP5188952B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP5188952B2 JP5188952B2 JP2008502809A JP2008502809A JP5188952B2 JP 5188952 B2 JP5188952 B2 JP 5188952B2 JP 2008502809 A JP2008502809 A JP 2008502809A JP 2008502809 A JP2008502809 A JP 2008502809A JP 5188952 B2 JP5188952 B2 JP 5188952B2
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- 239000000758 substrate Substances 0.000 title claims abstract description 183
- 238000012545 processing Methods 0.000 title claims abstract description 123
- 230000007246 mechanism Effects 0.000 claims abstract description 131
- 230000032258 transport Effects 0.000 claims description 114
- 230000002093 peripheral effect Effects 0.000 claims description 23
- 230000007723 transport mechanism Effects 0.000 claims description 20
- 238000005498 polishing Methods 0.000 abstract description 247
- 239000004065 semiconductor Substances 0.000 abstract description 18
- 235000012431 wafers Nutrition 0.000 description 600
- 238000012546 transfer Methods 0.000 description 496
- 238000004140 cleaning Methods 0.000 description 144
- 239000000126 substance Substances 0.000 description 53
- 239000007788 liquid Substances 0.000 description 36
- 239000000243 solution Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 230000008569 process Effects 0.000 description 21
- 238000003825 pressing Methods 0.000 description 17
- 238000005406 washing Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000012423 maintenance Methods 0.000 description 13
- 239000004744 fabric Substances 0.000 description 10
- 238000011109 contamination Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 229910003460 diamond Inorganic materials 0.000 description 7
- 239000010432 diamond Substances 0.000 description 7
- 230000001174 ascending effect Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000011068 loading method Methods 0.000 description 4
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 4
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 230000009191 jumping Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000008155 medical solution Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 235000020004 porter Nutrition 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
各研磨ユニット30A,30B,30C,30Dは、それぞれ隔壁で仕切られて密閉されており、密閉されたそれぞれの研磨ユニット30A,30B,30C,30Dから個別に排気が行われている。したがって、半導体ウェハは、密閉された研磨ユニット30A,30B,30C,30D内で処理され、スラリの雰囲気の影響を受けないため、良好な研磨を実現することができる。各研磨ユニット30A,30B,30C,30D間の隔壁には、図1に示すように、リニアトランスポータ5,6が通るための開口が開けられている。この開口にはそれぞれシャッタを設けて、ウェハが通過する時だけシャッタを開けるようにしてもよい。
(1)ウェハが収納されたカセット200をそのまま載置台へ置く方法。これはクリーンルームのフロントロード部20に面している部屋が比較的清浄な状態にある場合、例えば、クラス100以下のときにとられる方法である。
(2)クリーンルームのフロントロード部20に面した部屋が比較的ダーティな(汚れた)状態にある場合、例えば、クラス1000以上のときにはカセット200をクラス100程度に管理された箱の中に入れ、クリーンルーム内を搬送し、そのままフロントロード部20へ載置する方法がとられる。
1)ウェハロード時
まず、プッシャ33の上方に第1リニアトランスポータ5によってウェハWが搬送される。トップリング301Aがプッシャ33の上方のウェハロード位置(第2搬送位置)にあってウェハを保持していないとき、シリンダ347よりガイドステージ331周りの構成品一式が上昇していく。上昇途中で第1リニアトランスポータ5の搬送ステージのウェハ保持位置を通過する。このとき、通過と同時にウェハWをトップリングガイド337のテーパでウェハWを求芯し、プッシュステージ333によりウェハWの(エッジ以外の)パターン面を保持する。
プッシャ上方のウェハアンロード位置にトップリング301AによってウェハWが搬送される。第1リニアトランスポータ5の搬送ステージがプッシャ33の上方にあってウェハを搭載していないとき、シリンダ347によりガイドステージ331周りの構成品一式が上昇し、トップリングガイド337のテーパ338aによってガイドリング3104を呼び込む。リニアウェイ346による位置合わせでトップリング301Aに求芯し、トップリングガイド337の上段部338がガイドリング3104の下面と接触することでガイドステージ331の上昇は終了する。
まず、搬送ユニット46のアーム471a,471bが水平方向に移動し、ウェハWが洗浄機42に搬入される(図35)。次に、アーム471a,471bが下降し、ウェハWがローラ481,482,483,484の肩部481b,482b,483b,484bの上に載置される(図36)。アーム471a,471bが開くと同時に、第1及び第2ローラ(位置保持ローラ)481,482がウェハWに向かって移動する(図37)。このとき、位置決めガイド490によりウェハWの水平方向の位置はほぼ一定に維持されつつ、肩部481b,482b,483b,484bの傾斜に沿ってウェハWが僅かに上方に移動する。そして、第3及び第4ローラ(押圧ローラ)483,484がウェハWに向かって移動してウェハWを保持する。このときも、位置決めガイド490によりウェハWの水平方向の位置はほぼ一定に維持されつつ、肩部481b,482b,483b,484bの傾斜に沿ってウェハWが僅かに上方に移動する。ウェハWがローラ481,482,483,484に保持されると同時にシャッタ411が閉じ、その後ウェハWの処理が開始される(図38)。ウェハWの処理が終了した後は、上述と逆の順序で同じステップが繰り返され、ウェハWが洗浄機42から搬出される。
Claims (6)
- 基板に対して所定の処理を行う複数の処理部と、前記複数の処理部間で前記基板を搬送する基板搬送機構とを有する基板処理装置であって、
前記基板搬送機構は、
前記基板を把持する基板把持機構と、
前記複数の処理部のうち1つの処理部の筐体のフレームを中心として前記基板把持機構を旋回させる旋回アームを有する旋回機構と、
前記基板把持機構および前記旋回機構を前記フレームに沿って上下動させる上下動機構とを備え、
前記旋回機構は、前記旋回アームに接続されたモータを有しており、前記モータで前記旋回アームおよび前記基板把持機構を旋回させることにより前記基板を前記複数の処理部間で搬送することを特徴とする基板処理装置。 - 前記旋回アームは伸縮しない構造であることを特徴とする請求項1に記載の基板処理装置。
- 前記基板把持機構は、
基板の外周部に接触する少なくとも2つのチャック機構を有し、前記基板の中心を挟んで互いに対向する一対の把持部と、
前記一対の把持部を互いに近接する方向または互いに離間する方向に開閉させる開閉機構と、
を備えたことを特徴とする請求項1または2に記載の基板処理装置。 - 前記チャック機構は、前記基板の外周部に点接触するコマであることを特徴とする請求項3に記載の基板処理装置。
- 前記チャック機構は、前記基板の外周部に線接触するチャック部であることを特徴とする請求項3に記載の基板処理装置。
- 前記チャック機構は、
前記基板の径方向内側から外側に向かって次第に高くなる傾斜面と、
前記傾斜面の最外周に設けられた突起部と、
を有することを特徴とする請求項3に記載の基板処理装置。
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- 2007-02-21 EP EP07715034A patent/EP1988568A4/en not_active Ceased
- 2007-02-26 TW TW096106357A patent/TWI446476B/zh active
-
2012
- 2012-02-24 US US13/404,409 patent/US20120193506A1/en not_active Abandoned
- 2012-07-17 JP JP2012158786A patent/JP2012209589A/ja active Pending
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KR20170114946A (ko) | 2016-04-04 | 2017-10-16 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 반송 장치 및 기판 처리 장치와 결로 억제 방법 |
US10816259B2 (en) | 2016-04-04 | 2020-10-27 | Ebara Corporation | Substrate transport apparatus, substrate processing apparatus, and dew condensation suppression method |
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TWI796709B (zh) * | 2021-06-16 | 2023-03-21 | 盛詮科技股份有限公司 | 晶圓懸浮手臂 |
Also Published As
Publication number | Publication date |
---|---|
CN101390197B (zh) | 2011-02-23 |
KR20110022050A (ko) | 2011-03-04 |
US20120193506A1 (en) | 2012-08-02 |
KR20080106933A (ko) | 2008-12-09 |
US20090067959A1 (en) | 2009-03-12 |
JPWO2007099976A1 (ja) | 2009-07-23 |
TWI446476B (zh) | 2014-07-21 |
KR101075053B1 (ko) | 2011-10-21 |
CN101390197A (zh) | 2009-03-18 |
CN102117736A (zh) | 2011-07-06 |
CN102117736B (zh) | 2013-06-05 |
TW200739794A (en) | 2007-10-16 |
EP1988568A4 (en) | 2011-10-26 |
EP1988568A1 (en) | 2008-11-05 |
KR101106203B1 (ko) | 2012-01-20 |
WO2007099976A1 (ja) | 2007-09-07 |
JP2012209589A (ja) | 2012-10-25 |
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