SG10201405978QA - Lifting device, substrate processing apparatus provided with lifting device, and method of conveying unit - Google Patents

Lifting device, substrate processing apparatus provided with lifting device, and method of conveying unit

Info

Publication number
SG10201405978QA
SG10201405978QA SG10201405978QA SG10201405978QA SG10201405978QA SG 10201405978Q A SG10201405978Q A SG 10201405978QA SG 10201405978Q A SG10201405978Q A SG 10201405978QA SG 10201405978Q A SG10201405978Q A SG 10201405978QA SG 10201405978Q A SG10201405978Q A SG 10201405978QA
Authority
SG
Singapore
Prior art keywords
lifting device
processing apparatus
substrate processing
apparatus provided
conveying unit
Prior art date
Application number
SG10201405978QA
Inventor
Hiroyuki Shinozaki
Kenji Shinkai
Tadakazu Sone
Hideo Aizawa
Hiroshi Aono
Toshio Yokoyama
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013197742A external-priority patent/JP6220205B2/en
Priority claimed from JP2014091507A external-priority patent/JP6317171B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201405978QA publication Critical patent/SG10201405978QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
SG10201405978QA 2013-09-25 2014-09-23 Lifting device, substrate processing apparatus provided with lifting device, and method of conveying unit SG10201405978QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013197742A JP6220205B2 (en) 2013-09-25 2013-09-25 Leveling device and substrate processing apparatus provided with leveling device
JP2014091507A JP6317171B2 (en) 2014-04-25 2014-04-25 Lifting device and unit conveying method

Publications (1)

Publication Number Publication Date
SG10201405978QA true SG10201405978QA (en) 2015-04-29

Family

ID=52689668

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405978QA SG10201405978QA (en) 2013-09-25 2014-09-23 Lifting device, substrate processing apparatus provided with lifting device, and method of conveying unit

Country Status (2)

Country Link
US (1) US9666469B2 (en)
SG (1) SG10201405978QA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117832153A (en) * 2023-12-29 2024-04-05 江苏新智达新能源设备有限公司 Gantry type die bonder

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3803130B2 (en) 1994-12-06 2006-08-02 株式会社荏原製作所 Polishing apparatus and polishing method
JP2000254857A (en) * 1999-01-06 2000-09-19 Tokyo Seimitsu Co Ltd Flat face machining device and machining of flat face
US7097534B1 (en) * 2000-07-10 2006-08-29 Applied Materials, Inc. Closed-loop control of a chemical mechanical polisher
JP3768399B2 (en) * 2000-11-17 2006-04-19 株式会社荏原製作所 Dressing device and polishing device
JP3920720B2 (en) * 2002-03-29 2007-05-30 株式会社荏原製作所 Substrate delivery method, substrate delivery mechanism, and substrate polishing apparatus
US6921317B2 (en) * 2002-11-21 2005-07-26 The Boeing Company Automated lapping system
JP4744250B2 (en) * 2005-09-14 2011-08-10 株式会社岡本工作機械製作所 Double-side polishing apparatus and double-side polishing method for square substrate
KR101075053B1 (en) 2006-02-22 2011-10-21 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus
JP5306065B2 (en) * 2009-06-04 2013-10-02 株式会社荏原製作所 Dressing apparatus and dressing method

Also Published As

Publication number Publication date
US9666469B2 (en) 2017-05-30
US20150082613A1 (en) 2015-03-26

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