JP4988141B2 - エポキシ樹脂組成物、該組成物で封止された固体素子、並びに方法 - Google Patents
エポキシ樹脂組成物、該組成物で封止された固体素子、並びに方法 Download PDFInfo
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Description
次の手順を用いて、表1に示す試料1を製造した。小型ジャーに、11.4グラムのZ6018(Dow Chemicals社製のフェニルプロピルヒドロキシシリコーン)、7.5グラムのヘキサヒドロフタル酸無水物(HHPA)(Ciba Geigy社製)及び0.4グラムのSF1488(General Electric社製のポリジメチルシロキサン界面活性剤)を入れた。ジャーに蓋を取付け、マイクロ波オーブンを用いて内容物を温度約80℃に加熱し、全ての成分が完全に溶解するまで混合した。溶解完了後、試料を50℃未満に冷却し、15グラムのCY179(Ciba Geigy社製の脂環式エポキシ樹脂)、0.1グラムのIrganox 1010(Ciba社製の酸化防止剤)及び0.3グラムのエチル−ヘキサン酸スズを加えた。この材料をブレンドし、公称5ミクロン径のフィルターで濾過して清浄なジャーに移した。濾過後、エポキシブレンドを60℃未満に設定した真空オーブン内に入れ、減圧して約30分脱ガスした。脱ガス後、材料を用いて部品を封止した。ブレンドをアルミニウム皿に流し込んで、覆いをし、80℃で1時間エポキシを硬化させ、1時間かけて180℃に加熱し、その温度に2時間維持することによって、上記材料の円盤状試料を製造した。その他のエポキシ樹脂封止材料は、試料1の手順を用いて、各種エポキシ及びシリコーン樹脂、硬化剤その他の成分を混合し、表1に示す特定の条件下で硬化させることによって製造した。量は全てグラムで表す。試料1〜3は減圧脱ガスし、140℃で1時間硬化させて明澄で硬い透明試料を得たが、試料4、5、6及び7は濾過し、脱ガスし、150℃で70分ベーキングして明澄な淡橙色の試料を得た。全ての試料はポリシング可能であり、衝撃で割れなかった。
Claims (13)
- 固体素子の封止用硬化性エポキシ樹脂組成物であって、(A)次式の構造(I)のシリコーン樹脂、(B)1種類以上のエポキシ樹脂、(C)1種類以上の無水物硬化剤、(D)1種類以上のシロキサン界面活性剤及び(E)有機金属塩、スルホニウム塩、及びヨードニウム塩からなる群から選択される1種類以上の補助硬化触媒を含んでなる組成物。
- 前記エポキシ樹脂が、脂肪族エポキシ樹脂、環式脂肪族エポキシ樹脂、ビスフェノール−Aエポキシ樹脂、ビスフェノール−Fエポキシ樹脂、フェノールノボラックエポキシ樹脂、クレゾール−ノボラックエポキシ樹脂、ビフェニルエポキシ樹脂、4,4’−ビフェニルエポキシ樹脂、ジビニルベンゼンジオキシド、2−グリシジルフェニルグリシジルエーテル及びこれらの組み合わせからなる群から選択される、請求項1記載の組成物。
- 前記無水物硬化剤が、ビシクロ[2.2.1]ヘプタ−5−エン−2,3−ジカルボン酸無水物、メチルビシクロ[2.2.1]ヘプタ−5−エン−2,3−ジカルボン酸無水物、フタル酸無水物、ピロメリト酸二無水物、ヘキサヒドロフタル酸無水物、ヘキサヒドロ−4−メチルフタル酸無水物、ドデセニルコハク酸無水物、ジクロロマレイン酸無水物、クロレンド酸無水物、テトラクロロフタル酸無水物及びこれらの組合せからなる群から選択される、請求項1又は請求項2記載の組成物。
- 前記補助硬化触媒(E)が、金属カルボン酸塩、金属アセチルアセトナート、オクタン酸亜鉛、オクタン酸第一スズ、ヘキサフルオロリン酸トリアリールスルホニウム、ヘキサフルオロアンチモン酸トリアリールスルホニウム、ヘキサフルオロアンチモン酸ジアリールヨードニウム、テトラキス(ペンタフルオロフェニル)ホウ酸ジアリールヨードニウム及びこれらの組合せからなる群から選択される、請求項1乃至請求項4のいずれか1項記載の組成物。
- 固体素子の封止用硬化性エポキシ樹脂組成物であって、当該組成物が、(A)次式の構造(I)のシリコーン樹脂、(B)ビスフェノールAエポキシ樹脂からなるエポキシ樹脂、(C)ヘキサヒドロ−4−メチルフタル酸無水物からなる無水物硬化剤、(D)エチレンオキシド官能化シロキサンからなるシロキサン界面活性剤及び(E)補助硬化触媒のオクタン酸亜鉛を含んでなり、シリコーン樹脂(A)、エポキシ樹脂(B)、無水物硬化剤(C)、シロキサン界面活性剤(D)及び補助硬化触媒(E)の合計重量を基準にして、成分(A)が40重量%を超えるレベルで存在し、成分(B)が1〜20重量%のレベルで存在し、成分(C)が1〜40重量%未満のレベルで存在し、成分(D)及び(E)が0.008〜10重量%のレベルで存在する、組成物。
- さらに、1種類以上の熱安定剤、UV安定剤又はこれらの組合せを含む、請求項1乃至請求項6のいずれか1項記載の組成物。
- (a)パッケージ、(b)チップ(4)及び(c)封止材料(11)を含んでなるパッケージ型固体素子であって、封止材料(11)が、請求項1乃至請求項6のいずれか1項記載の硬化性エポキシ樹脂組成物からなる、パッケージ型固体素子。
- 前記固体素子が半導体素子又はオプトエレクトロニクス素子である、請求項8記載のパッケージ型固体素子。
- (a)パッケージ、(b)LEDチップ(4)及び(c)封止材料(11)を含んでなるLED(1)素子であって、封止材料(11)が、請求項1乃至請求項6のいずれか1項記載の硬化性エポキシ樹脂組成物からなる、LED(1)素子。
- 固体素子を封止する方法であって、固体素子をパッケージに入れ、(A)次式の構造(I)のシリコーン樹脂と(B)1種類以上のエポキシ樹脂と(C)1種類以上の無水物硬化剤と(D)1種類以上のシロキサン界面活性剤と(E)有機金属塩、スルホニウム塩、及びヨードニウム塩からなる群から選択される1種類以上の補助硬化触媒とを含む封止材料(11)を供給することを含んでなる方法。
- LED(1)素子を封止する方法であって、LED(1)素子をパッケージ内に入れ、(A)次式の構造(I)のシリコーン樹脂と(B)ビスフェノールFを含むエポキシ樹脂と(C)ヘキサヒドロ−4−メチルフタル酸無水物を含む無水物硬化剤と(D)エチレンオキシド官能化シロキサンを含むシロキサン界面活性剤と(E)オクタン酸亜鉛を含む補助硬化触媒を含んでなる封止材料(11)であって、シリコーン樹脂(A)とエポキシ樹脂(B)とシロキサン界面活性剤(C)と硬化剤(D)と補助硬化触媒(E)との合計重量を基準にして、成分(A)が40重量%を超えるレベルで存在し、成分(B)が1〜20重量%のレベルで存在し、成分(C)が1〜40重量%未満のレベルで存在し、成分(D)及び(E)が0.008〜10重量%のレベルで存在する封止材料(11)を供給することを含んでなる方法。
- 固体素子の封止用硬化性エポキシ樹脂組成物であって、(A)次式の構造(I)のシリコーン樹脂、(B)1種類以上のエポキシ樹脂、(C)1種類以上の無水物硬化剤、(D)1種類以上のシロキサン界面活性剤及び(E)有機金属塩、スルホニウム塩、及びヨードニウム塩からなる群から選択される1種類以上の補助硬化触媒、並びに、1種類以上の熱安定剤、UV安定剤又はこれらの組合せを含んでなる組成物。
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US10/265,422 US6800373B2 (en) | 2002-10-07 | 2002-10-07 | Epoxy resin compositions, solid state devices encapsulated therewith and method |
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CN (2) | CN100480352C (ja) |
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JP2010202880A (ja) * | 2002-10-07 | 2010-09-16 | Momentive Performance Materials Inc | エポキシ樹脂組成物、該組成物で封止された固体素子、並びに方法 |
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JP2010202880A (ja) * | 2002-10-07 | 2010-09-16 | Momentive Performance Materials Inc | エポキシ樹脂組成物、該組成物で封止された固体素子、並びに方法 |
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ES2292912T3 (es) | 2008-03-16 |
TWI304415B (en) | 2008-12-21 |
US6800373B2 (en) | 2004-10-05 |
CN101307183A (zh) | 2008-11-19 |
CN101307183B (zh) | 2011-06-29 |
US20040067366A1 (en) | 2004-04-08 |
JP2010202880A (ja) | 2010-09-16 |
JP2004277697A (ja) | 2004-10-07 |
ATE375380T1 (de) | 2007-10-15 |
DE60316759T2 (de) | 2008-07-17 |
DE60316759D1 (de) | 2007-11-22 |
EP1408087B1 (en) | 2007-10-10 |
TW200415019A (en) | 2004-08-16 |
CN100480352C (zh) | 2009-04-22 |
EP1408087A1 (en) | 2004-04-14 |
CN1534074A (zh) | 2004-10-06 |
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