WO2010101144A1 - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物 Download PDFInfo
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- WO2010101144A1 WO2010101144A1 PCT/JP2010/053327 JP2010053327W WO2010101144A1 WO 2010101144 A1 WO2010101144 A1 WO 2010101144A1 JP 2010053327 W JP2010053327 W JP 2010053327W WO 2010101144 A1 WO2010101144 A1 WO 2010101144A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
Definitions
- the present invention relates to an epoxy resin composition having a low viscosity and excellent workability, and a cured epoxy resin obtained by curing the epoxy resin composition and excellent in heat-resistant mechanical properties.
- Epoxy resins are generally cured with various curing agents, resulting in cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc., adhesives, paints, laminates, moldings It is used in a wide range of fields such as materials and casting materials.
- bisphenol A type epoxy resin or bisphenol F type epoxy resin is mainly used as an epoxy resin in a liquid epoxy resin composition, but a reactive diluent may be added because the viscosity of the resin is relatively high. There were many.
- reactive diluents butyl glycidyl ether, allyl glycidyl ether, and phenyl glycidyl ether have been representatively used.
- Patent Document 2 proposes compounds having a cyclohexyl group, but the viscosity of these compounds is 240 cps to 3200 cps, which is higher than that of a conventional reactive diluent, and the function as a diluent is sufficient. Not.
- the viscosity of the entire composition can be lowered, it has the same reactivity as epichlorohydrin type epoxy, and does not deteriorate the heat resistance and mechanical properties of the cured product.
- the appearance of agents is desired. Epoxy resins having a low chlorine concentration are desired for use in electrical and electronic parts, and the emergence of reactive diluents having a low chlorine content is awaited. *
- the present inventors have intensively studied for a reactive diluent having a sufficiently low viscosity and not lowering the heat resistance and mechanical properties of the cured product and having a low chlorine content. It was found that the epoxy compound represented by) satisfies these requirements, and the present invention was completed.
- the present invention includes an epoxy resin having a viscosity at 25 ° C. of 1000 mPa ⁇ s or more and an epoxy compound represented by the following formula (1), and the content of the epoxy compound is 100 parts by weight of the epoxy resin.
- the present invention relates to an epoxy resin composition characterized by being 1 part by weight or more and 90 parts by weight or less. (Wherein G represents an epoxy group, R represents hydrogen or an alkyl group, and n represents an integer of 2 to 4)
- the present invention relates to a cured epoxy resin characterized by blending the above epoxy resin composition with a curing agent and curing it.
- the epoxy resin composition of this invention contains the epoxy resin whose viscosity in 25 degreeC is 1000 mPa * s or more, and the epoxy compound represented by the said Formula (1).
- the epoxy compound represented by the formula (1) a compound obtained by epoxidizing a corresponding vinyl compound with a peroxide can be used.
- the epoxy compound obtained by this method has a feature that the chlorine content is low because epichlorohydrin is not used in the synthesis.
- a peroxide used for epoxidation a normal peracid or an organic peroxide can be used.
- G represents an epoxy group
- R represents hydrogen or an alkyl group
- n represents an integer of 2 to 4
- n is preferably 2
- R is preferably hydrogen, a methyl group or an ethyl group.
- Peracid is obtained, for example, by a reaction between carboxylic acid and hydrogen peroxide.
- carboxylic acid formic acid, acetic acid, propionic acid, benzoic acid and the like can be used.
- formic acid and acetic acid are preferable from the viewpoint of oxidation efficiency.
- Hydrogen peroxide having a concentration of 25 to 75% can be used, but it is particularly preferable to use 50 to 70%.
- the peracid an isolated one can be used, but an in-situ method in which epoxidation is carried out after the production of peracid in a reaction system for epoxidation can also be used.
- the epoxidation of the vinyl compound is performed by a method in which a vinyl compound and a carboxylic acid are charged and a hydrogen peroxide solution is dropped into the mixed solution to epoxidize the peroxide at the same time as the peroxide is generated.
- the amount of peracid used with respect to the vinyl compound is not particularly limited, but it is usually preferably 0.1 to 5 mole times, more preferably 1 to 2 mole times the vinyl group of the vinyl compound.
- the amount of the peracid used is less than 0.1 mol times, the yield of the epoxidized product is remarkably lowered and the amount of unreacted product increases.
- the influence on the yield of an epoxidized substance is hardly recognized, but it exists in the tendency for economical efficiency to be impaired for collection
- the reaction temperature is preferably 0 to 150 ° C, and preferably 20 to 100 ° C. Below 0 ° C., the reaction is slow, and above 150 ° C., the problem of peracid safety arises. Also, sulfuric acid or the like can be used as a peracid reaction accelerator.
- R 1 OOH a compound represented by R 1 OOH
- R 1 is preferably an alkyl group or an aralkyl group, and preferably has 1 to 12 carbon atoms, more preferably 2 to 10 carbon atoms.
- t-butyl hydroperoxide t-amyl hydroperoxide, t-hexyl hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, ethylbenzene hydroperoxide, cumene hydroperoxide , Diisopropylbenzene monohydroperoxide, diisopropylbenzene dihydroperoxide and the like, or a mixture of two or more thereof.
- preferred organic hydroperoxides are t-butyl hydroperoxides because alcohols produced after the reaction have a low boiling point and are easy to separate and purify after the epoxidation reaction.
- organic hydroperoxides are produced by hydrogen peroxide oxidation of olefins or tertiary alcohols, or oxygen oxidation of hydrocarbons having at least one of secondary hydrogen and tertiary hydrogen.
- the organic hydroperoxide may contain olefins, tertiary alcohols, hydrocarbons and alcohols by-produced from the organic hydroperoxide used as raw materials during production.
- olefins tertiary alcohols
- hydrocarbons hydrocarbons and alcohols by-produced from the organic hydroperoxide used as raw materials during production.
- t-butyl hydroperoxide containing t-butanol and isobutane cumene hydroperoxide containing cumyl alcohol and cumene
- ethylbenzene hydroperoxide containing ⁇ -phenylethyl alcohol and ethylbenzene and the like can be used.
- it may be a high-purity organic hydroperoxide obtained by treating this with a known concentration method or purification method.
- the amount of the organic hydroperoxide used with respect to the vinyl compound is not particularly limited, but is preferably 0.8 to 5 mole times, more preferably 1 to 2 mole times the vinyl group of the vinyl compound vinyl compound.
- the amount of the peracid used is less than 0.8 mole times, the yield of the epoxidized product is remarkably lowered and the amount of unreacted product increases.
- the influence on the yield of an epoxidized substance is hardly recognized, but it exists in the tendency for economical efficiency to be impaired for collection
- Examples of the catalyst used for epoxidation with organic hydroperoxide include molybdenum acetylacetonate, ammonium molybdate, molybdenum chloride, and molybdenum oxide as the molybdenum compound, but molybdenum acetylacetonate and ammonium molybdate as the catalysts having high reaction activity.
- Ammonium molybdate is more preferable from the viewpoints of catalyst separation, recovery and economy.
- the amount of the catalyst used varies depending on the charging ratio of the vinyl compound and the organic hydroperoxide, but is usually 0.1 to 70% by weight based on the organic hydroperoxide. If the amount is less than 0.1% by weight, the reaction is slowed down, so that the reaction is continued for a long time, the side reaction products increase, and the yield of the epoxy compound decreases. If it exceeds 70% by weight, side reactions increase and the selectivity tends to decrease.
- the epoxidation reaction can be carried out without a solvent, but an aromatic hydrocarbon solvent such as benzene or chlorobenzene; an aliphatic hydrocarbon solvent such as octane or decane; an inert solvent such as alcohols, esters or ethers.
- aromatic hydrocarbon solvent such as benzene or chlorobenzene
- aliphatic hydrocarbon solvent such as octane or decane
- an inert solvent such as alcohols, esters or ethers.
- a known solvent can also be used.
- the temperature of the epoxidation reaction is usually 50 to 120 ° C., more preferably 80 to 110 ° C. Below 50 ° C, the reaction rate is slow and the reaction time becomes long. When it exceeds 120 ° C, the organic hydroperoxide itself decomposes, and the selectivity of the epoxidized product is increased by side reactions such as the ring-opening reaction of the epoxy group. It tends to decrease.
- the epoxidation reaction time varies depending on the concentration of the organic hydroperoxide, the reaction temperature, and the amount of catalyst used, but is usually 0.5 to 10 hours, preferably 2 to 5 hours.
- the reaction method is carried out by any known method such as a batch reaction or a multistage continuous reaction having a plurality of reaction kettles.
- peroxycarboxyimidine acid represented by the following formula (2) can be used as the organic oxide.
- Peroxycarboxyimidine acid is neutral or weakly alkaline and is produced by reacting nitriles with hydrogen peroxide.
- An epoxidized product is produced by reacting peroxycarboxyimidine acid with a vinyl compound. This is performed by adding hydrogen peroxide in the presence of a nitrile and a vinyl compound.
- R 2 represents an alkyl group
- nitrile acetonitrile is generally used and is preferable.
- the amount of nitrile used is not particularly limited, but usually 0.8 to 20 mole times the vinyl group is preferred, and when the amount of nitrile used is less than 0.8 mole times the vinyl compound used , The yield of the epoxidized product tends to be extremely low. Moreover, even if it uses exceeding 20 mol times amount, the influence on the yield of an epoxidized substance is hardly recognized, but it exists in the tendency for economical efficiency to be impaired for collection
- the amount of hydrogen peroxide used is not particularly limited, it is preferably 0.8 to 5 mole times the vinyl group, and the amount of hydrogen peroxide used is 0.8 mole times the vinyl compound used. If it is less than the amount, the yield of the epoxidized product tends to be remarkably lowered. Moreover, even if it uses exceeding 5 mol times amount, the influence on the yield of an epoxidized substance is hardly recognized, but it exists in the tendency for economical efficiency to be impaired.
- alcohols are generally used as a solvent.
- it is methanol.
- the temperature of the epoxidation reaction is usually 20 to 120 ° C., more preferably 30 to 60 ° C. If the reaction temperature is lower than 20 ° C, the reaction time is slow and the reaction time becomes longer. If the reaction temperature exceeds 120 ° C, decomposition of the organic peroxycarboxyimidine acid occurs, and selection of epoxidized products by side reactions such as ring-opening reaction of epoxy groups. Tend to decrease.
- the time for the epoxidation reaction varies depending on the concentration of peroxycarboxyimidine acid and the reaction temperature, but is usually 0.5 to 10 hours, preferably 2 to 5 hours.
- the reaction method is carried out by any known method such as a batch reaction or a multistage continuous reaction having a plurality of reaction kettles.
- the epoxy resin having a viscosity at 25 ° C. of 1000 mPa ⁇ s or higher used in the epoxy resin composition of the present invention is not particularly limited as long as the viscosity is 1000 mPa ⁇ s or higher.
- glycidyl ether type epoxy resins such as bisphenol A, bisphenol F, bisphenol AD, bromo-containing bisphenol A, phenol novolac, cresol novolac, polyphenol, straight chain aliphatic, butadiene, urethane, etc .
- heterocyclic epoxy resin glycidyl amine type epoxy resin such as triglycid
- epoxy resins such as cycloaliphatic epoxy resin, naphthalene novolac epoxy resin, diglycidyloxynaphthalene epoxy resin
- bisphenol A type, bisphenol F type, bisphenol AD type, and cresol novolac type glycidyl ether type epoxy resins are particularly preferable in view of performance and economy.
- the epoxy resin having a viscosity at 25 ° C. of less than 1000 mPa ⁇ s the effect of reducing the viscosity by the epoxy compound of the formula (1) is low.
- the epoxy compound represented by the formula (1) used in the epoxy resin composition of the present invention has a function of reducing the viscosity of the epoxy resin composition.
- an epoxy resin having a viscosity at 25 ° C. of 1000 mPa ⁇ s or higher is a relatively general epoxy resin and has performance specific to the epoxy resin, but has a high viscosity.
- an epoxy resin having a viscosity at 25 ° C. of 1000 mPa ⁇ s or more is also referred to as a high viscosity epoxy resin.
- the addition amount of the epoxy compound represented by the formula (1) needs to be in the range of 1 to 90 parts by weight with respect to 100 parts by weight of the high viscosity epoxy resin.
- the amount is preferably 5 to 80 parts by weight, more preferably 10 to 60 parts by weight.
- the addition amount is less than 1 part by weight, the effect of reducing the viscosity is not sufficient, and when it exceeds 90 parts by weight, the physical properties of the original epoxy resin are reduced.
- the epoxy resin composition may be added with a flexible agent, a coupling agent, a flame retardant, a flame retardant aid, a colorant, a filler, etc. that are generally blended in the application field as necessary.
- An agent may be added within a range not impairing the performance of the present invention.
- a cured epoxy resin is obtained by adding a curing agent to the epoxy resin composition of the present invention and curing it.
- the curing agent used in the epoxy resin composition of the present invention may be a known curing agent as a general epoxy resin curing agent, for example, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine.
- Primary amines such as diethylaminopropylamine, metaphenylenediamine, p, p'-diaminodiphenylmethane, diaminodiphenylsulfone; secondary amines such as diethanolamine, N-methylethanolamine, bishydroxyethyldiethylenetriamine; triethylamine, piperidine, Tertiary amines such as benzyldimethylamine 2- (dimethylaminomethyl) phenol; phthalic anhydride, hexahydrophthalic anhydride, dodecenyl succinic anhydride, trimelli anhydride DOO acid, pyromellitic acid anhydride, include acid anhydrides such as HET acid, or these one or are formulated.
- secondary amines such as diethanolamine, N-methylethanolamine, bishydroxyethyldiethylenetriamine; triethylamine, piperidine, Tertiary amines such as benzyldi
- the blending ratio of the epoxy resin and the curing agent is preferably in the range of 0.8 to 1.5 in terms of equivalent ratio of the epoxy group and the functional group in the curing agent. Outside this range, unreacted epoxy groups or functional groups in the curing agent remain even after curing, and the physical properties of the cured product deteriorate.
- the epoxy compound represented by Formula (1) is handled as an epoxy resin.
- epoxy resin composition of the present invention examples include paints, injection materials, cast products, composite materials such as CFRP, molded products, laminates and insulating materials such as printed boards, sealing materials for electrical and electronic parts, adhesion Agents, laminates, FRP molded products, repair materials, flooring materials, road paving materials for civil engineering and the like.
- DEpEB is an epoxy compound in which all Rs are H and n is 2 in the formula (1).
- Synthesis example 2 1,3,5-triethylbenzene (manufactured by Tokyo Chemical Industry Co., Ltd.) was subjected to vapor phase dehydrogenation reaction to obtain crude trivinylbenzene containing about 38% trivinylbenzene.
- a 3 L reactor was charged with 300 g of crude trivinylbenzene and 1200 g of ethyl acetate and stirred.
- 1640 g of an ethyl acetate solution containing 30% peracetic acid was added dropwise over 3 hours. During the dropping, the reaction temperature was controlled to 30 ° C. After dropping, the mixture was further stirred at 30 ° C. for 3 hours.
- TEpEB triepoxyethylbenzene
- Examples 1 to 3 10 parts by weight, 25 parts by weight and 50 parts by weight of DEpEB obtained in Synthesis Example 1 are added to 100 parts by weight of bisphenol A type epoxy resin (YD-128; manufactured by Tohto Kasei Co., Ltd.) and mixed to form an epoxy resin composition. I got a thing.
- the viscosity of the resin composition at 25 ° C. was measured with a B-type viscometer.
- Rikacid MH-700 manufactured by Shin Nippon Rika Co., Ltd.
- Tg TMA method
- bending elastic modulus bending strength of the cured product were measured.
- the flexural modulus and flexural strength were measured in accordance with JIS K6911 “General Thermosetting Plastic Testing Method”. The results are shown in Table 1.
- PGE phenyl glycidyl ether
- Yield 100 parts by weight
- YD-128 bisphenol A type epoxy resin
- Francecid MH-700 was added so as to have an equivalent ratio of 0.9 and mixed uniformly, and then heat-cured at 120 ° C. for 1 hour, then at 150 ° C. for 3 hours to obtain a cured product. It was.
- the Tg, bending elastic modulus, and bending strength of the cured product were measured.
- Comparative Examples 4-6 10 parts by weight, 25 parts by weight and 50 parts by weight of butyl glycidyl ether (BGE; manufactured by Tokyo Chemical Industry Co., Ltd.) are added to 100 parts by weight of bisphenol A type epoxy resin (YD-128), and mixed to form an epoxy resin composition.
- BGE butyl glycidyl ether
- YD-128 bisphenol A type epoxy resin
- Italycid MH-700 was added so as to have an equivalent ratio of 0.9 and mixed uniformly, and then heat-cured at 120 ° C. for 1 hour, then at 150 ° C. for 3 hours to obtain a cured product. It was.
- the Tg, bending elastic modulus, and bending strength of the cured product were measured.
- Example 4 50 parts by weight of DEpEB obtained in Synthesis Example 1 was added to 100 parts by weight of bisphenol F type epoxy resin (YD-170; manufactured by Toto Kasei Co., Ltd.) and mixed to obtain an epoxy resin composition.
- Jamaicacid MH-700 was added to the epoxy resin composition so that the equivalent ratio was 0.9 and mixed uniformly, and then heat-cured at 120 ° C. for 1 hour, then at 150 ° C. for 3 hours to obtain a cured product. .
- the Tg, bending elastic modulus, and bending strength of the cured product were measured.
- Example 5 50 parts by weight of DEpEB obtained in Synthesis Example 1 was added to 100 parts by weight of phenol novolac type epoxy resin (YDPN-638; manufactured by Tohto Kasei Co., Ltd.) and mixed to obtain an epoxy resin composition.
- phenol novolac type epoxy resin YDPN-638; manufactured by Tohto Kasei Co., Ltd.
- Colombiacid MH-700 was added so as to have an equivalent ratio of 0.9 and mixed uniformly, and then heat-cured at 120 ° C. for 1 hour, then at 150 ° C. for 3 hours to obtain a cured product. It was.
- the Tg, bending elastic modulus, and bending strength of the cured product were measured.
- Tables 1 and 2 show the compositions of the resin compositions of Examples 1 to 5 and Comparative Examples 1 to 6, the viscosities measured at 25 ° C. with a B-type viscometer, and the measured physical properties of the cured products.
- the addition amount is a compounding amount of the epoxy compound with respect to 100 parts by weight of the epoxy resin.
- Comparative Example 7 Jamaicacid MH-700 was added to bisphenol A type epoxy resin (YD-128) so that the equivalent ratio was 0.9 and mixed uniformly, and then heat-cured at 120 ° C. for 1 hour, then at 150 ° C. for 3 hours. A cured product was obtained. The Tg, bending elastic modulus, and bending strength of the cured product were measured.
- Comparative Example 8 Jamaicacid MH-700 was added to bisphenol F-type epoxy resin (YD-170) so that the equivalent ratio was 0.9 and mixed uniformly, and then heat-cured at 120 ° C. for 1 hour, then at 150 ° C. for 3 hours. A cured product was obtained. The Tg, bending elastic modulus, and bending strength of the cured product were measured.
- Table 3 shows the viscosity of the epoxy resins used in Comparative Examples 7 to 9 at 25 ° C. and 50 ° C. and the measured physical properties of the cured products.
- Examples 6-8 DEpEB obtained in Synthesis Example 1 and TEpEB obtained in Synthesis Example 2 were added to 100 parts by weight of bisphenol A type epoxy resin (YD-128).
- DEpEB 0 parts by weight
- TEpEB 50 parts by weight
- DEpEB 25 parts by weight
- TEpEB 25 parts by weight
- DEpEB 40 parts by weight
- TEpEB 10 parts by weight, respectively, to obtain an epoxy resin composition.
- the viscosity of the resin composition at 25 ° C. and 50 ° C. was measured with a B-type viscometer.
- Jamaicacid MH-700 was added to the epoxy resin composition so that the equivalent ratio was 0.9 and mixed uniformly, and then heat-cured at 120 ° C. for 1 hour, then at 150 ° C. for 3 hours to obtain a cured product. .
- the Tg, bending elastic modulus, and bending strength of the cured product were measured. The results are shown in Table 4.
- Reference Example Table 5 shows hydrolyzable chlorine concentrations of phenyl glycidyl ether, butyl glycidyl ether, DEpEB and TEpB.
- the hydrolyzable chlorine content was analyzed by the following method. That is, about 1 g of a sample is put in a 100 mL Erlenmeyer flask and accurately weighed to a unit of 1 mg. 30 mL of dioxane was added and dissolved completely using an ultrasonic cleaner. After correctly adding 5 mL of 1N potassium hydroxide / ethanol solution and shaking well, boiling stones were added and a condenser tube was attached. The mixture was heated to about 180 ° C. and refluxed. The reflux time was correctly set to 30 minutes after boiling started. After cooling to room temperature, the cooling tube was washed with 5 mL of methanol, and the washing solution was added to the sample solution.
- the Erlenmeyer flask was removed from the condenser, and the sample solution was transferred to a 200 mL beaker. The inside of the flask was washed three times with 50 mL of 80% acetone water, and the washing solution was added to the sample solution. 5 mL of N / 400 sodium chloride solution was added correctly and a rotator was added. After adding 3 mL of acetic acid and stirring for 2 minutes, potentiometric titration was performed using the N / 100 silver nitrate solution under the following conditions. A blank test was performed by the same operation as above. The hydrolyzable chlorine concentration was determined by the following formula.
- Hydrolyzable chlorine (%) F ⁇ (V ⁇ B) ⁇ 0.0355 / S F; Factor V of N / 100 silver nitrate solution; Amount of N / 100 silver nitrate solution required for titration of sample B; Amount of N / 100 silver nitrate solution required for titration of blank test S; Amount of sample (g)
- the epoxy resin composition of the present invention has a low viscosity and excellent workability, and the cured epoxy resin obtained by curing it has excellent heat resistance and mechanical properties.
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Abstract
Description
(式中、Gはエポキシ基、Rは水素又はアルキル基、nは2~4の整数を表す)
本発明のエポキシ樹脂組成物は、25℃での粘度が1000mPa・s以上であるエポキシ樹脂と、上記式(1)で表されるエポキシ化合物とを含む。
3L反応器にジビニルベンゼン(新日鐵化学製DVB-960ジビニルベンゼン含有量97%、m-体/p-体=62:38)300g、酢酸エチル1200gを装入し撹拌した。次いで、過酢酸30%含有酢酸エチル溶液1640gを3時間かけて滴下した。滴下中は反応温度を30℃になるように制御を行った。滴下後、さらに30℃にて3時間撹拌を行った。反応液を室温まで冷却した後、20%NaOH水溶液1208gを加え、1時間撹拌後、水層を分離し、未反応の過酢酸及び、生成した酢酸の除去を行った。エバポレーターにて、酢酸エチルを減圧留去した後、精製蒸留(10torr、150℃)を行い、ジエポキシエチルベンゼン(DEpEB)151.6gを得た。得られたジエポキシエチルベンゼンのエポキシ当量は81g/eq、25℃における粘度は18mPa・s、純度は97.1%(ガスクロマトグラフィー面積%)、m-体/p-体=64:36(1H-NMR積分比)であった。加水分解性塩素は検出されなかった。DEpEBは、式(1)において、全部のRがHであり、nが2であるエポキシ化合物である。
1,3,5-トリエチルベンゼン(東京化成工業株式会社製)を、気相脱水素反応により、約38%のトリビニルベンゼンを含む粗トリビニルベンゼンを得た。
3L反応器に粗トリビニルベンゼン300g、酢酸エチル1200gを装入し撹拌した。次いで、過酢酸30%含有酢酸エチル溶液1640gを3時間かけて滴下した。滴下中は反応温度を30℃になるように制御を行った。滴下後、さらに30℃にて3時間撹拌を行った。反応液を室温まで冷却した後、20%NaOH水溶液1208gを加え、1時間撹拌後、水層を分離し、未反応の過酢酸及び、生成した酢酸の除去を行った。エバポレーターにて、酢酸エチルを減圧留去した後、精製蒸留(5torr、194℃)を行い、トリエポキシエチルベンゼン(TEpEB)90.6gを得た。得られたトリエポキシエチルベンゼンのエポキシ当量は75g/eq、融点は38℃の白色結晶であり、純度は98.2%(ガスクロマトグラフィー面積%)であった。加水分解性塩素は検出されなかった。TEpEBは、式(1)において、全部のRがHであり、nが3であるエポキシ化合物である。
ビスフェノールA型エポキシ樹脂(YD-128;東都化成株式会社製)100重量部に対し、合成例1で得たDEpEBを、10重量部、25重量部、50重量部加えて、混合しエポキシ樹脂組成物を得た。B型粘度計にて、25℃における樹脂組成物の粘度を測定した。エポキシ樹脂組成物に、リカシッドMH-700(新日本理化株式会社製)を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg(TMA法)、曲げ弾性率及び曲げ強度を測定した。曲げ弾性率及び曲げ強度は、JISK6911「熱硬化性プラスチック一般試験法」に従い測定した。結果を表1に示す。
ビスフェノールA型エポキシ樹脂(YD-128)100重量部に対し、フェニルグリシジルエーテル(PGE;東京化成化学工業製)を、10重量部、25重量部、50重量部加えて、混合しエポキシ樹脂組成物を得た。このエポキシ樹脂組成物に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。
ビスフェノールA型エポキシ樹脂(YD-128)100重量部に対し、ブチルグリシジルエーテル(BGE;東京化成化学工業製)を、10重量部、25重量部、50重量部加えて、混合しエポキシ樹脂組成物を得た。このエポキシ樹脂組成物に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。
ビスフェノールF型エポキシ樹脂(YD-170;東都化成株式会社製)100重量部に対し、合成例1で得たDEpEBを50重量部加えて、混合しエポキシ樹脂組成物を得た。エポキシ樹脂組成物に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。
フェノールノボラック型エポキシ樹脂(YDPN-638;東都化成株式会社製)100重量部に対し、合成例1で得たDEpEBを50重量部加えて、混合しエポキシ樹脂組成物を得た。このエポキシ樹脂組成物に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。
ビスフェノールA型エポキシ樹脂(YD-128)に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。
ビスフェノールF型エポキシ樹脂(YD-170)に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。
フェノールノボラック型エポキシ樹脂(YDPN-638)に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。
ビスフェノールA型エポキシ樹脂(YD-128)100重量部に対し、合成例1で得たDEpEB及び合成例2で得たTEpEBを、DEpEB=0重量部及びTEpEB=50重量部、DEpEB=25重量部及びTEpEB=25重量部、DEpEB=40重量部及びTEpEB=10重量部の割合でそれぞれ混合しエポキシ樹脂組成物を得た。B型粘度計にて、25℃及び50℃における樹脂組成物の粘度を測定した。エポキシ樹脂組成物に、リカシッドMH-700を当量比が0.9となるように加えて均一に混合した後、120℃、1時間、次いで150℃、3時間加熱硬化させ、硬化物を得た。硬化物のTg、曲げ弾性率、曲げ強度を測定した。結果を表4に示す。
フェニルグリシジルエーテル、ブチルグリシジルエーテル、DEpEB及びTEpBの加水分解性塩素濃度を表5に示す。
次式により、加水分解性塩素濃度を求めた。
加水分解性塩素(%)=F×(V-B)×0.0355/S
F;N/100硝酸銀溶液のファクター
V;試料の滴定に要したN/100硝酸銀溶液の量
B;空試験の滴定に要したN/100硝酸銀溶液の量
S;試料量(g)
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