JP2014520172A - 絶縁配合物 - Google Patents
絶縁配合物 Download PDFInfo
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- JP2014520172A JP2014520172A JP2014511369A JP2014511369A JP2014520172A JP 2014520172 A JP2014520172 A JP 2014520172A JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014520172 A JP2014520172 A JP 2014520172A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
角度のある切り込みを有する2個の約355mm角金属プレート上で、1つの端を各DUOFOIL(商標)(約330mm×355mm×0.38mm)上に取り付ける。約3.175mmID×約4.75mmOD(ガスケットとして使用される)のチューブを付けている約3.05mmの厚さおよびシリコーンゴムのU−スペーサー棒をプレート間に置き、鋳型をC−クランプで閉めて保持する。鋳型は、その使用より前に約65℃の炉内で予熱する。
充填剤の必要量を終夜真空炉内にて約70℃の温度で乾燥させる。エポキシ樹脂および無水物ハードナーを約60℃に別々に予熱する。広口プラスチック容器中に、温かいエポキシ樹脂、温かい無水物ハードナー、および1−メチルイミダゾールの指定量を負荷し、これらを温かい充填剤中に添加する前に手でかき混ぜる。容器の内容物を次いで、FlackTek SpeedMixer(商標)上にて、約1〜2分の持続期間約800rpmから約2350rpmの複数のサイクルで混合する。
硬化エポキシ配合物の一分量を示差走査熱量計(DSC)中に置き、10℃/分にて0℃から250℃の第1加熱走査から0℃から250℃の第2加熱走査で加熱および冷却する。Tgを0℃から250℃の第2の加熱走査上のハーフハイト値として報告する。
引張特性測定を、硬化エポキシ配合物についてASTM D638に従って1型引張試験片を使用して行う。
熱伝導率測定を、硬化エポキシ配合物についてISO22007−2(遷移平面熱源(ホットディスク)法)に従って行う。
体積抵抗率を室温でHewlett−Packard High Resistivity Meter上にて、115ミルから130ミルのプラーク厚を範囲として測定した。
誘電強度も、115〜130ミルプラーク上にてAC破壊Testerを使用してASTM D149によって、試料破壊まで500V/secの傾斜アップ電圧速度で測定した。
充填エポキシ樹脂注型物を、上記されている通りの一般的方法および下記の表Iに記載されている配合物を使用して調製する。生じた注型物の特性を上に記載されている方法によって測定し、特性結果を下記の表IIに記載する。
Claims (14)
- (a)少なくとも1種のジビニルアレーンジオキシド、(b)構成成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂、(c)少なくとも1種の無水物ハードナー、(d)少なくとも1種の充填剤、および(e)少なくとも1種の硬化触媒を含む、電気装置のための電気絶縁物としての硬化性エポキシ樹脂配合組成物であって、硬化時に、Tg、引張強度、誘電強度および体積抵抗率を含む特性のバランスを有する硬化生成物を提供する、エポキシ樹脂配合組成物。
- 充填剤が熱伝導性および電気絶縁性充填剤である、請求項1に記載のエポキシ樹脂配合組成物。
- 硬化時に、少なくとも約80℃のTg、少なくとも約65MPaの引張強度、少なくとも約20kV/mmの誘電強度、および少なくとも約5E+15オーム−cmの体積抵抗率を含む特性のバランスを有する硬化生成物を提供する、請求項1に記載のエポキシ樹脂配合組成物。
- 充填剤が充填剤処理で処理された充填剤を含む、請求項1に記載のエポキシ樹脂配合組成物。
- 充填剤がシランで処理された充填剤を含む、請求項4に記載のエポキシ樹脂配合組成物。
- 反応性希釈剤、柔軟化剤、加工助剤または強化剤を含める、請求項1に記載のエポキシ樹脂配合組成物。
- 約200mPa−sから約20,000mPa−s未満の注型温度での粘度を有する、請求項1に記載のエポキシ樹脂配合組成物。
- (a)少なくとも1種のジビニルアレーンジオキシド、(b)構成成分(a)のジビニルアレーンジオキシドと異なる少なくとも1種のエポキシ樹脂、(c)少なくとも1種の無水物ハードナー、(d)少なくとも1種の充填剤、および(e)少なくとも1種の硬化触媒を添加混合することを含む、電気装置のための電気絶縁物としての硬化性エポキシ樹脂配合組成物を調製するためのプロセスであって、エポキシ樹脂配合組成物が硬化時に、Tg、引張強度、誘電強度および体積抵抗率を含む特性のバランスを有する硬化生成物を提供する、プロセス。
- (i)請求項1に記載の組成物を提供するステップ、
(ii)前記請求項1に記載の組成物を基材に適用するステップ、および
(iii)前記基材および組成物を硬化することで絶縁材料を形成するステップ
を含む、電気装置のためのエポキシ絶縁性材料を調製するためのプロセスであって、生じる絶縁材料が、約70℃以上の運転温度に必要とされる電気的、機械的および熱的特性を含めた必要特性のバランスを有する、プロセス。 - 請求項9のプロセスによって作製される生成物。
- 約70℃以上の運転温度に必要とされる電気的、機械的および熱的特性を含めた特性のバランスを有する、絶縁材料、ポッティング材料または注型材料を含む、請求項10に記載の生成物。
- 電気装置を含む、請求項13に記載の生成物。
- 電気装置が電力変圧器を含む、請求項12に記載の生成物。
- 電気装置が乾式変圧器を含む、請求項13に記載の生成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161485841P | 2011-05-13 | 2011-05-13 | |
US61/485,841 | 2011-05-13 | ||
PCT/US2012/033417 WO2012158291A1 (en) | 2011-05-13 | 2012-04-13 | Insulation formulations |
Publications (3)
Publication Number | Publication Date |
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JP2014520172A true JP2014520172A (ja) | 2014-08-21 |
JP2014520172A5 JP2014520172A5 (ja) | 2016-07-21 |
JP6030125B2 JP6030125B2 (ja) | 2016-11-24 |
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Application Number | Title | Priority Date | Filing Date |
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JP2014511369A Active JP6030125B2 (ja) | 2011-05-13 | 2012-04-13 | 絶縁配合物 |
Country Status (10)
Country | Link |
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US (1) | US20140079953A1 (ja) |
EP (1) | EP2707411B1 (ja) |
JP (1) | JP6030125B2 (ja) |
KR (1) | KR101901473B1 (ja) |
CN (1) | CN103649158B (ja) |
BR (1) | BR112013029224B1 (ja) |
CA (1) | CA2835651A1 (ja) |
MX (1) | MX349112B (ja) |
TW (1) | TWI540146B (ja) |
WO (1) | WO2012158291A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014518921A (ja) * | 2011-05-13 | 2014-08-07 | ダウ グローバル テクノロジーズ エルエルシー | 絶縁配合物 |
JP2018514937A (ja) * | 2016-04-07 | 2018-06-07 | チャン ソン カンパニー リミテッドChang Sung Co.,Ltd | 軟磁性モールディング液を用いたコイル埋め込み型インダクタの製造方法及びそのコイル埋め込み型インダクタ |
JP2018206985A (ja) * | 2017-06-06 | 2018-12-27 | 三菱電機株式会社 | 静止誘導器 |
KR20200004999A (ko) * | 2018-07-05 | 2020-01-15 | (주)제니스월드 | 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척 |
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DE102013205117A1 (de) * | 2013-03-22 | 2014-09-25 | Siemens Aktiengesellschaft | Vergussmasse, Verwendung der Vergussmasse, thermisch gehärteter Komposit erhältlich aus der Vergussmasse und elektrische Maschine mit der Vergussmasse |
JP6321934B2 (ja) * | 2013-09-30 | 2018-05-09 | マツダ株式会社 | エンジン燃焼室に臨む部材表面の断熱層の製造方法 |
US11161979B2 (en) * | 2014-07-18 | 2021-11-02 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board |
CN104200876A (zh) * | 2014-08-09 | 2014-12-10 | 张传良 | 一种防火电缆用氧化镁填充料的制备方法 |
KR102212920B1 (ko) * | 2018-09-03 | 2021-02-08 | 주식회사 엘지화학 | 봉지 필름 |
CN109401200A (zh) * | 2018-10-29 | 2019-03-01 | 江苏宏鹏电气科技有限公司 | 一种用于母线槽内绝缘衬垫材料的制备配方 |
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JP2014518921A (ja) * | 2011-05-13 | 2014-08-07 | ダウ グローバル テクノロジーズ エルエルシー | 絶縁配合物 |
JP2018514937A (ja) * | 2016-04-07 | 2018-06-07 | チャン ソン カンパニー リミテッドChang Sung Co.,Ltd | 軟磁性モールディング液を用いたコイル埋め込み型インダクタの製造方法及びそのコイル埋め込み型インダクタ |
JP2018206985A (ja) * | 2017-06-06 | 2018-12-27 | 三菱電機株式会社 | 静止誘導器 |
KR20200004999A (ko) * | 2018-07-05 | 2020-01-15 | (주)제니스월드 | 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척 |
KR102094296B1 (ko) * | 2018-07-05 | 2020-03-27 | (주)제니스월드 | 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척 |
Also Published As
Publication number | Publication date |
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EP2707411A1 (en) | 2014-03-19 |
CA2835651A1 (en) | 2012-11-22 |
WO2012158291A1 (en) | 2012-11-22 |
CN103649158A (zh) | 2014-03-19 |
MX2013013272A (es) | 2014-07-09 |
KR20140040150A (ko) | 2014-04-02 |
US20140079953A1 (en) | 2014-03-20 |
BR112013029224B1 (pt) | 2021-03-09 |
EP2707411B1 (en) | 2015-09-30 |
BR112013029224A2 (pt) | 2017-03-14 |
TWI540146B (zh) | 2016-07-01 |
MX349112B (es) | 2017-07-12 |
KR101901473B1 (ko) | 2018-09-21 |
JP6030125B2 (ja) | 2016-11-24 |
TW201307421A (zh) | 2013-02-16 |
CN103649158B (zh) | 2016-04-06 |
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