GB2072190B - Siloxane-modified epoxy resin composition - Google Patents
Siloxane-modified epoxy resin compositionInfo
- Publication number
- GB2072190B GB2072190B GB8009609A GB8009609A GB2072190B GB 2072190 B GB2072190 B GB 2072190B GB 8009609 A GB8009609 A GB 8009609A GB 8009609 A GB8009609 A GB 8009609A GB 2072190 B GB2072190 B GB 2072190B
- Authority
- GB
- United Kingdom
- Prior art keywords
- siloxane
- resin composition
- epoxy resin
- modified epoxy
- modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8009609A GB2072190B (en) | 1980-03-21 | 1980-03-21 | Siloxane-modified epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8009609A GB2072190B (en) | 1980-03-21 | 1980-03-21 | Siloxane-modified epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2072190A GB2072190A (en) | 1981-09-30 |
GB2072190B true GB2072190B (en) | 1983-12-21 |
Family
ID=10512278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8009609A Expired GB2072190B (en) | 1980-03-21 | 1980-03-21 | Siloxane-modified epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2072190B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3671028D1 (en) * | 1985-11-07 | 1990-06-13 | Uvexs Inc | UV-curable polymer compounds based on epoxies and siloxanes. |
US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
CN111518498A (en) * | 2020-05-25 | 2020-08-11 | 湖北航泰科技有限公司 | Epoxy resin adhesive for bonding rubber materials and formula thereof |
CN111944478A (en) * | 2020-05-25 | 2020-11-17 | 湖北航泰科技有限公司 | Epoxy resin adhesive for bonding rubber materials and preparation method thereof |
-
1980
- 1980-03-21 GB GB8009609A patent/GB2072190B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2072190A (en) | 1981-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3174368D1 (en) | Resin compositions | |
GB2121045B (en) | Epoxy resin composition | |
DE3371090D1 (en) | Resin composition | |
DE3176159D1 (en) | Vinyl-type resin composition | |
GB2067582B (en) | Silicone resin coating composition | |
DE3377430D1 (en) | Photo-curable epoxy resin composition | |
JPS56159215A (en) | Thermosetting polyepoxide resin composition | |
JPS56115315A (en) | Epoxy resin composition | |
DE3372625D1 (en) | Photo-curable epoxy resin composition | |
DE3367399D1 (en) | Epoxy resin composition | |
JPS57125211A (en) | Tertiary nitrogen-containing epoxy resin composition | |
GB8332126D0 (en) | Acetal resin composition | |
EP0089206A3 (en) | Resin composition | |
JPS5734119A (en) | Chemically resistant epoxy resin composition | |
DE3263963D1 (en) | Photo-curable epoxy resin composition | |
EP0138209A3 (en) | Epoxy resin composition | |
IL69209A0 (en) | Thermoplastic-modified epoxy resin compositions | |
JPS57111308A (en) | Post-formable resin composition | |
GB2145095B (en) | Acetal resin composition | |
DE3364191D1 (en) | Epoxy resin composition | |
DE3175759D1 (en) | Thermoplastic resin compositions | |
GB2115424B (en) | Adhesive epoxy resin composition | |
DE3265840D1 (en) | Epoxy resin composition | |
GB2083478B (en) | Epoxy resins moulding composition | |
JPS56155218A (en) | Polymeric resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Effective date: 20000320 |