GB2083478B - Epoxy resins moulding composition - Google Patents
Epoxy resins moulding compositionInfo
- Publication number
- GB2083478B GB2083478B GB8121134A GB8121134A GB2083478B GB 2083478 B GB2083478 B GB 2083478B GB 8121134 A GB8121134 A GB 8121134A GB 8121134 A GB8121134 A GB 8121134A GB 2083478 B GB2083478 B GB 2083478B
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resins
- moulding composition
- resins moulding
- composition
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18576580A | 1980-09-10 | 1980-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2083478A GB2083478A (en) | 1982-03-24 |
| GB2083478B true GB2083478B (en) | 1984-03-07 |
Family
ID=22682373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8121134A Expired GB2083478B (en) | 1980-09-10 | 1981-07-08 | Epoxy resins moulding composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS6056749B2 (en) |
| CH (1) | CH646723A5 (en) |
| DE (1) | DE3135526C2 (en) |
| GB (1) | GB2083478B (en) |
| NL (1) | NL8102948A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2129002A (en) * | 1982-09-13 | 1984-05-10 | Brian Bennett | Filled thermosetting resin compositions |
| JPH0261947U (en) * | 1988-10-29 | 1990-05-09 | ||
| CA2083868A1 (en) * | 1990-11-14 | 1993-06-12 | Chong Soo Lee | Coated abrasive having a coating of an epoxy resin coatable from water |
| CA2054554A1 (en) * | 1990-11-14 | 1992-05-15 | Chong Soo Lee | Coated abrasive having an overcoating of an epoxy resin coatable from water and a grinding aid |
| JPH06325955A (en) * | 1993-05-13 | 1994-11-25 | Hitachi Ltd | Ignition device for internal combustion engine, and ignition device mounting type distributor |
| TWI494363B (en) * | 2009-09-04 | 2015-08-01 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
| US8206819B2 (en) * | 2010-01-27 | 2012-06-26 | Iteq Corporation | Varnish, prepreg, and substrate thereof |
| RU2598861C1 (en) * | 2015-09-28 | 2016-09-27 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) | Electric insulating filling compound |
| CN115805714A (en) * | 2022-12-16 | 2023-03-17 | 毫厘机电(苏州)有限公司 | Process method for eliminating multi-material combined thermal expansion |
-
1981
- 1981-06-18 NL NL8102948A patent/NL8102948A/en unknown
- 1981-07-07 JP JP10617681A patent/JPS6056749B2/en not_active Expired
- 1981-07-08 GB GB8121134A patent/GB2083478B/en not_active Expired
- 1981-09-01 CH CH562681A patent/CH646723A5/en not_active IP Right Cessation
- 1981-09-08 DE DE19813135526 patent/DE3135526C2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3135526A1 (en) | 1982-04-22 |
| NL8102948A (en) | 1982-04-01 |
| JPS6056749B2 (en) | 1985-12-11 |
| DE3135526C2 (en) | 1983-11-03 |
| GB2083478A (en) | 1982-03-24 |
| JPS5749647A (en) | 1982-03-23 |
| CH646723A5 (en) | 1984-12-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |