JPS5749647A - Epoxy forming material and manufacture - Google Patents

Epoxy forming material and manufacture

Info

Publication number
JPS5749647A
JPS5749647A JP10617681A JP10617681A JPS5749647A JP S5749647 A JPS5749647 A JP S5749647A JP 10617681 A JP10617681 A JP 10617681A JP 10617681 A JP10617681 A JP 10617681A JP S5749647 A JPS5749647 A JP S5749647A
Authority
JP
Japan
Prior art keywords
manufacture
forming material
epoxy forming
epoxy
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10617681A
Other languages
Japanese (ja)
Other versions
JPS6056749B2 (en
Inventor
Shinohara Makoto
Jiei Miyashiro Jieemuzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ATK Launch Systems LLC
Original Assignee
Morton Norwich Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton Norwich Products Inc filed Critical Morton Norwich Products Inc
Publication of JPS5749647A publication Critical patent/JPS5749647A/en
Publication of JPS6056749B2 publication Critical patent/JPS6056749B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP10617681A 1980-09-10 1981-07-07 Epoxy molding material and its manufacturing method Expired JPS6056749B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18576580A 1980-09-10 1980-09-10
US185765 1980-09-10

Publications (2)

Publication Number Publication Date
JPS5749647A true JPS5749647A (en) 1982-03-23
JPS6056749B2 JPS6056749B2 (en) 1985-12-11

Family

ID=22682373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10617681A Expired JPS6056749B2 (en) 1980-09-10 1981-07-07 Epoxy molding material and its manufacturing method

Country Status (5)

Country Link
JP (1) JPS6056749B2 (en)
CH (1) CH646723A5 (en)
DE (1) DE3135526C2 (en)
GB (1) GB2083478B (en)
NL (1) NL8102948A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5549719A (en) * 1990-11-14 1996-08-27 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water
US5556437A (en) * 1990-11-14 1996-09-17 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129002A (en) * 1982-09-13 1984-05-10 Brian Bennett Filled thermosetting resin compositions
JPH0261947U (en) * 1988-10-29 1990-05-09
JPH06325955A (en) * 1993-05-13 1994-11-25 Hitachi Ltd Ignition device for internal combustion engine, and ignition device mounting type distributor
TWI494363B (en) * 2009-09-04 2015-08-01 Iteq Corp An epoxy resin composition and a film and a substrate made of the epoxy resin composition
US8206819B2 (en) * 2010-01-27 2012-06-26 Iteq Corporation Varnish, prepreg, and substrate thereof
RU2598861C1 (en) * 2015-09-28 2016-09-27 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Electric insulating filling compound
CN115805714A (en) * 2022-12-16 2023-03-17 毫厘机电(苏州)有限公司 Process method for eliminating multi-material combined thermal expansion

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5549719A (en) * 1990-11-14 1996-08-27 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water
US5556437A (en) * 1990-11-14 1996-09-17 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water

Also Published As

Publication number Publication date
GB2083478B (en) 1984-03-07
NL8102948A (en) 1982-04-01
JPS6056749B2 (en) 1985-12-11
CH646723A5 (en) 1984-12-14
DE3135526C2 (en) 1983-11-03
GB2083478A (en) 1982-03-24
DE3135526A1 (en) 1982-04-22

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