ATE205998T1 - Siloxan und siloxanderivate als einkapslungsmaterial für lichtemittierende organische bauelemente - Google Patents

Siloxan und siloxanderivate als einkapslungsmaterial für lichtemittierende organische bauelemente

Info

Publication number
ATE205998T1
ATE205998T1 AT96918817T AT96918817T ATE205998T1 AT E205998 T1 ATE205998 T1 AT E205998T1 AT 96918817 T AT96918817 T AT 96918817T AT 96918817 T AT96918817 T AT 96918817T AT E205998 T1 ATE205998 T1 AT E205998T1
Authority
AT
Austria
Prior art keywords
siloxane
light
encapsulating material
organic components
emitting organic
Prior art date
Application number
AT96918817T
Other languages
English (en)
Inventor
Hans Biebuyck
Eliav Haskal
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE205998T1 publication Critical patent/ATE205998T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/917—Electroluminescent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
AT96918817T 1996-07-10 1996-07-10 Siloxan und siloxanderivate als einkapslungsmaterial für lichtemittierende organische bauelemente ATE205998T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB1996/000665 WO1998002019A1 (en) 1996-07-10 1996-07-10 Siloxane and siloxane derivatives as encapsulants for organic light emitting devices

Publications (1)

Publication Number Publication Date
ATE205998T1 true ATE205998T1 (de) 2001-10-15

Family

ID=11004450

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96918817T ATE205998T1 (de) 1996-07-10 1996-07-10 Siloxan und siloxanderivate als einkapslungsmaterial für lichtemittierende organische bauelemente

Country Status (9)

Country Link
US (3) US5855994A (de)
EP (1) EP0910931B1 (de)
JP (1) JP3957760B2 (de)
AT (1) ATE205998T1 (de)
DE (1) DE69615410T2 (de)
ES (1) ES2164250T3 (de)
IL (1) IL126993A (de)
TW (1) TW421774B (de)
WO (1) WO1998002019A1 (de)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6133933A (en) * 1997-01-13 2000-10-17 Xerox Corporation Color Xerographic printing system with multicolor printbar
US6525386B1 (en) * 1998-03-10 2003-02-25 Masimo Corporation Non-protruding optoelectronic lens
JP2000150149A (ja) * 1998-11-13 2000-05-30 Rohm Co Ltd 有機ｅｌ素子の製造方法
US6552488B1 (en) * 1999-08-24 2003-04-22 Agilent Technologies, Inc. Organic electroluminescent device
US20010053559A1 (en) * 2000-01-25 2001-12-20 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating display device
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6538375B1 (en) * 2000-08-17 2003-03-25 General Electric Company Oled fiber light source
KR100477784B1 (ko) * 2000-08-31 2005-03-22 매그나칩 반도체 유한회사 트렌치 내부의 공기로 이루어지는 집광층을 구비하는이미지 센서 및 그 제조 방법
JP4053260B2 (ja) * 2000-10-18 2008-02-27 シャープ株式会社 有機エレクトロルミネッセンス表示素子
US6692326B2 (en) 2001-06-16 2004-02-17 Cld, Inc. Method of making organic electroluminescent display
JP4766218B2 (ja) * 2001-07-09 2011-09-07 セイコーエプソン株式会社 有機ｅｌアレイ露光ヘッドとその作製方法及びそれを用いた画像形成装置
US6656611B2 (en) 2001-07-20 2003-12-02 Osram Opto Semiconductors Gmbh Structure-defining material for OLEDs
JP2003054030A (ja) * 2001-08-10 2003-02-26 Sharp Corp 発光素子および発光素子アレイ並びに発光素子アレイを用いたプリンタ
WO2003022010A1 (fr) * 2001-08-30 2003-03-13 Fujitsu Limited Procede de fabrication d'un dispositif electroluminescent organique et dispositif electroluminescent organique correspondant
JP4104339B2 (ja) * 2002-02-06 2008-06-18 松下電器産業株式会社 発光素子及びその製造方法、並びに表示装置
CN101336021A (zh) * 2002-02-12 2008-12-31 出光兴产株式会社 有机el显示装置及其制造方法
FR2836584B1 (fr) * 2002-02-27 2004-05-28 Thomson Licensing Sa Panneau electroluminescent dote d'elements d'extractions de lumiere
KR100475849B1 (ko) * 2002-04-17 2005-03-10 한국전자통신연구원 습식 공정에 의하여 형성된 엔캡슐레이션 박막을 갖춘유기 전기발광 소자 및 그 제조 방법
US6670772B1 (en) * 2002-06-27 2003-12-30 Eastman Kodak Company Organic light emitting diode display with surface plasmon outcoupling
US7011420B2 (en) * 2002-09-04 2006-03-14 Eastman Kodak Company Planar directed light source
US7224116B2 (en) * 2002-09-11 2007-05-29 Osram Opto Semiconductors Gmbh Encapsulation of active electronic devices
US6887733B2 (en) * 2002-09-11 2005-05-03 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Method of fabricating electronic devices
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
JP4208526B2 (ja) * 2002-09-12 2009-01-14 キヤノン株式会社 有機ｅｌディスプレイ装置及び該ディスプレイ装置を有する電子機器
US7193364B2 (en) * 2002-09-12 2007-03-20 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Encapsulation for organic devices
US7699482B2 (en) 2002-09-25 2010-04-20 Fujifilm Corporation Light-emitting element
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
US7086918B2 (en) * 2002-12-11 2006-08-08 Applied Materials, Inc. Low temperature process for passivation applications
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US7344901B2 (en) * 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
TWI224295B (en) * 2003-08-21 2004-11-21 Ritdisplay Corp Color tunable panel of organic electroluminescent displays
US20050057176A1 (en) * 2003-08-21 2005-03-17 Ritdisplay Corporation Color tunable panel of organic electroluminscent display
US20050069713A1 (en) * 2003-09-30 2005-03-31 Rahul Gupta Capillary coating method
JP4093943B2 (ja) * 2003-09-30 2008-06-04 三洋電機株式会社 発光素子およびその製造方法
US20050088084A1 (en) * 2003-10-27 2005-04-28 Eastman Kodak Company Organic polarized light emitting diode display with polarizer
KR100563059B1 (ko) 2003-11-28 2006-03-24 삼성에스디아이 주식회사 유기 전계 발광 디스플레이 장치 및 이의 제조에 사용되는레이저 열전사용 도너 필름
US20050200796A1 (en) * 2004-02-09 2005-09-15 Hiroki Iwanaga LED lighting apparatus
US20060035092A1 (en) * 2004-08-10 2006-02-16 Shin-Etsu Chemical Co., Ltd. Resin composition for sealing LED elements and cured product generated by curing the composition
JPWO2006022273A1 (ja) * 2004-08-24 2008-05-08 東北デバイス株式会社 有機ｅｌ素子と、有機ｅｌ素子の保護膜及びその製法
JP4511440B2 (ja) * 2004-10-05 2010-07-28 三星モバイルディスプレイ株式會社 有機発光素子及び有機発光素子の製造方法
WO2006067368A1 (en) * 2004-12-24 2006-06-29 Cambridge Display Technology Limited Organic electroluminescent device
US20060145599A1 (en) * 2005-01-04 2006-07-06 Reza Stegamat OLEDs with phosphors
JP4791083B2 (ja) * 2005-05-30 2011-10-12 信越化学工業株式会社 光関連デバイス封止用樹脂組成物およびその硬化物
KR20140072135A (ko) * 2006-01-31 2014-06-12 다우 코닝 코포레이션 유기 발광 다이오드용 표면 릴리프 출력 커플러의 소프트 리소그래픽 몰딩
TWI314025B (en) * 2006-04-13 2009-08-21 Au Optronics Corp Method for fabricating active illumination apparatus
US20070272934A1 (en) * 2006-05-23 2007-11-29 Kee Yean Ng LED device with improved life performance
US20080124558A1 (en) * 2006-08-18 2008-05-29 Heather Debra Boek Boro-silicate glass frits for hermetic sealing of light emitting device displays
US8029904B2 (en) * 2006-12-01 2011-10-04 Rohm And Haas Company Aryl (thio)ether aryl polysiloxane composition and methods for making and using same
JP2010514139A (ja) * 2006-12-20 2010-04-30 ダウ・コーニング・コーポレイション 陽イオン感受性層を含む複合品
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
WO2009120434A1 (en) * 2008-03-26 2009-10-01 Dow Corning Corporation Silicone composition and organic light-emitting diode
US8451122B2 (en) 2008-08-08 2013-05-28 Tyfone, Inc. Smartcard performance enhancement circuits and systems
GB2464111B (en) * 2008-10-02 2011-06-15 Cambridge Display Tech Ltd Organic electroluminescent device
US20100095705A1 (en) 2008-10-20 2010-04-22 Burkhalter Robert S Method for forming a dry glass-based frit
CN102341431B (zh) * 2009-03-04 2014-04-30 思研（Sri）国际顾问与咨询公司 用于有机电装置的封装方法和介电层
US20120032141A1 (en) * 2009-04-02 2012-02-09 Hcf Partners, Lp Compositions Comprising QD Sol-Gel Composites and Methods for Producing and Using the Same
WO2010137355A1 (ja) * 2009-05-28 2010-12-02 シャープ株式会社 有機エレクトロルミネセンス表示装置、その製造方法、カラーフィルタ基板及びその製造方法
KR101056432B1 (ko) * 2009-09-14 2011-08-11 삼성모바일디스플레이주식회사 유기 전계 발광 표시장치 및 이의 밀봉용 충전재
TWI407535B (zh) * 2009-09-15 2013-09-01 Ind Tech Res Inst 環境敏感電子元件之封裝體
US9660218B2 (en) 2009-09-15 2017-05-23 Industrial Technology Research Institute Package of environmental sensitive element
US9101005B2 (en) 2009-09-15 2015-08-04 Industrial Technology Research Institute Package of environmental sensitive element
JP2012038631A (ja) * 2010-08-10 2012-02-23 Canon Inc 有機エレクトロルミネッセンス表示装置
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
JP2014525146A (ja) 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
US10211380B2 (en) * 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
TWI528608B (zh) 2011-11-21 2016-04-01 財團法人工業技術研究院 環境敏感電子元件之封裝體
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US20130236681A1 (en) * 2012-03-06 2013-09-12 Chang Min Lee Photocurable composition, barrier layer including the same, and encapsulated apparatus including the same
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
US11581487B2 (en) 2017-04-26 2023-02-14 Oti Lumionics Inc. Patterned conductive coating for surface of an opto-electronic device
CN108198844A (zh) * 2018-01-03 2018-06-22 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
CN110783367B (zh) * 2018-07-31 2022-05-24 京东方科技集团股份有限公司 显示面板
KR20200099651A (ko) * 2019-02-14 2020-08-25 삼성디스플레이 주식회사 유기 발광 소자 및 이를 포함한 발광 장치
KR20230019506A (ko) * 2019-03-25 2023-02-08 시노비아 테크놀로지스 비평형 열경화 공정

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3965280A (en) * 1973-03-07 1976-06-22 Rhone-Poulenc S.A. Use of organopolysiloxane compositions which cure at ambient temperature in coating electrical and electronic devices
US4125510A (en) * 1977-03-01 1978-11-14 Dow Corning Corporation Method of improving crack resistance of siloxane molding compositions
JPS56111833A (en) * 1980-02-08 1981-09-03 Sharp Corp Liquid-crystal display element
US4417174A (en) * 1980-10-03 1983-11-22 Alps Electric Co., Ltd. Electroluminescent cell and method of producing the same
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
GB8523166D0 (en) * 1985-09-19 1985-10-23 Yarsley Technical Centre Ltd Scratch resistant coatings
JPH086087B2 (ja) * 1988-02-09 1996-01-24 信越化学工業株式会社 電界発光素子
KR910001849B1 (ko) * 1988-10-26 1991-03-28 삼성전관 주식회사 El 소자
US5063102A (en) * 1989-12-01 1991-11-05 Dow Corning Corporation Radiation curable organosiloxane gel compositions
US5260398A (en) * 1990-04-05 1993-11-09 The Dow Chemical Company Aromatic cyanate-siloxane
US5213864A (en) * 1991-12-05 1993-05-25 At&T Bell Laboratories Silicone encapsulant
CA2085445A1 (en) * 1991-12-30 1993-07-01 Jon E. Littman Efficient organic electroluminescent device of simplified construction
US5294869A (en) * 1991-12-30 1994-03-15 Eastman Kodak Company Organic electroluminescent multicolor image display device
US5233007A (en) * 1992-04-14 1993-08-03 Allergan, Inc. Polysiloxanes, methods of making same and high refractive index silicones made from same
DE4328466C1 (de) * 1993-08-24 1995-04-13 Siemens Ag Siloxanhaltiges Gießharzsystem
US5514627A (en) * 1994-01-24 1996-05-07 Hewlett-Packard Company Method and apparatus for improving the performance of light emitting diodes

Also Published As

Publication number Publication date
IL126993A0 (en) 1999-09-22
JP3957760B2 (ja) 2007-08-15
US5855994A (en) 1999-01-05
US6337381B1 (en) 2002-01-08
DE69615410T2 (de) 2002-06-20
EP0910931B1 (de) 2001-09-19
US20020004577A1 (en) 2002-01-10
EP0910931A1 (de) 1999-04-28
US6468590B2 (en) 2002-10-22
TW421774B (en) 2001-02-11
WO1998002019A1 (en) 1998-01-15
DE69615410D1 (de) 2001-10-25
IL126993A (en) 2002-12-01
ES2164250T3 (es) 2002-02-16

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