JP6478449B2 - 装置の製造方法及び機器の製造方法 - Google Patents
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Description
Claims (20)
- デバイスを含む装置の製造方法であって、
デバイスが配された基板を準備する工程と、
前記基板の上に、透明板と、前記透明板と前記基板との間にて前記透明板に接触する樹脂と、を配する工程と、
前記透明板を介して前記樹脂に紫外線を照射して前記樹脂を硬化させることにより、前記デバイスを覆う樹脂部材を形成する工程と、
前記基板、前記透明板及び前記樹脂部材を切断する工程と、
を有し、
前記紫外線の照射は、第1の紫外線照射と、前記第1の紫外線照射の後の、前記第1の紫外線照射より強い第2の紫外線照射と、を含むことを特徴とする製造方法。 - 前記透明板の弾性率は、前記基板の弾性率よりも高いことを特徴とする請求項1に記載の製造方法。
- 前記透明板と前記樹脂とを配する工程では、前記基板の上に前記透明板を配置した後に、前記樹脂を前記基板と前記透明板との間に注入することを特徴とする請求項1又は2に記載の製造方法。
- 前記デバイスは、前記デバイスと前記基板との間に配された結合部材によって前記基板に固定されていることを特徴とする請求項1乃至3の何れか1項に記載の製造方法。
- デバイスを含む装置の製造方法であって、
基板の上に、接着剤を挟んでデバイスを配する工程と、
前記接着剤を硬化させることで前記基板と前記デバイスとを結合する結合部材を形成する工程と、
前記デバイスが配された前記基板の上に、透明板と、前記透明板と前記基板との間にて前記透明板に接触する樹脂と、を配する工程と、
前記透明板を介して前記樹脂に紫外線を照射して前記樹脂を硬化させることにより、前記デバイスを覆う樹脂部材を形成する工程と、
前記基板、前記透明板及び前記樹脂部材を切断する工程と、
を有し、
前記紫外線の照射は、第1の紫外線照射と、前記第1の紫外線照射の後の、前記第1の紫外線照射より強い第2の紫外線照射と、を含み、
前記樹脂部材の弾性率が前記結合部材の弾性率よりも低いことを特徴とする製造方法。 - 前記接着剤は熱硬化性を有し、前記接着剤の硬化温度は前記基板のガラス転移点以下であることを特徴とする請求項5に記載の製造方法。
- 前記樹脂部材の硬化収縮率は2%以上5%以下であることを特徴とする請求項1乃至6の何れか1項に記載の製造方法。
- 前記デバイスが、ボンディングワイヤによって、前記基板に電気的に接続されており、前記樹脂部材が前記ボンディングワイヤに接触していることを特徴とする請求項1乃至7の何れか1項に記載の製造方法。
- 前記デバイスは光デバイスであり、前記樹脂部材の弾性率は0.01GPa以下であり、以下の条件(a)、(b)及び(c)の少なくとも何れかを満足することを特徴とする請求項1乃至8の何れか1項に記載の製造方法。
(a)前記デバイスの厚さは0.2mm以上0.3mm以下である。
(b)前記透明板の厚さは1.5mm以下である。
(c)前記基板の厚さは0.2mm以上である。 - 前記基板を準備する工程において、前記デバイスを含む複数のデバイスが前記基板に配されており、
前記切断する工程では、前記基板、前記透明板及び前記樹脂部材を前記複数のデバイスごとに個片化することを特徴とする請求項1乃至9の何れか1項に記載の製造方法。 - 切断する前の前記基板の各辺の長さは200mm以下であり、
前記切断する工程において、前記デバイスの縁からの距離が0.25mm以上2.5mm以下である位置で前記基板を切断することを特徴とする請求項1乃至10の何れか1項に記載の製造方法。 - 前記接着剤は、ポリテトラフルオロエチレンのフィラーを35wt%以上45wt%以下の範囲で分散させたビスマレイミド樹脂であることを特徴とする請求項5又は6に記載の製造方法。
- 前記結合部材の弾性率は1GPa以下であることを特徴とする請求項4、5、6及び12の何れか1項に記載の製造方法。
- 前記樹脂部材は、前記デバイスと前記透明板との間に位置する第1部分と、前記第1部分以外の第2部分とを有し、前記第1部分の厚さが前記第2部分の厚さよりも小さく、前記第2部分の幅が前記第1部分の幅よりも小さいことを特徴とする請求項1乃至13の何れか1項に記載の製造方法。
- 前記デバイスの線膨張係数が、前記基板の線膨張係数よりも小さいことを特徴とする請求項1乃至14の何れか1項に記載の製造方法。
- 前記基板の厚さをTs(mm)とし、前記基板の弾性率をEs(GPa)とし、前記透明板の厚さをTt(mm)とし、前記透明板の弾性率をEt(GPa)とした場合に、
(Es)×(Ts)3≦2.5
及び
(Et)×(Tt)3≧9
の少なくとも一方を満たすことを特徴とする請求項1乃至15の何れか1項に記載の製造方法。 - 前記樹脂を配する工程の前に、前記デバイスの端子が前記基板の端子へ電気的に接続されていることを特徴とする請求項1乃至16の何れか1項に記載の製造方法。
- 前記結合部材の弾性率は、100MPaよりも大きく、500MPaよりも小さいことを特徴とする請求項5、6、12又は13に記載の製造方法。
- 前記デバイスはセンサであることを特徴とする請求項1乃至18の何れか1項に記載の製造方法。
- 請求項1乃至19の何れか1項に記載の製造方法によって製造された装置を搭載した機器の製造方法であって、前記装置を、はんだを介して配線板に実装する工程を有することを特徴とする製造方法。
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US14/444,121 US9570632B2 (en) | 2013-08-21 | 2014-07-28 | Method of manufacturing the optical apparatus |
CN201410404024.3A CN104425632B (zh) | 2013-08-21 | 2014-08-18 | 光学装置及其制造方法 |
US15/388,597 US9887222B2 (en) | 2013-08-21 | 2016-12-22 | Method of manufacturing optical apparatus |
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JP6497998B2 (ja) * | 2015-03-19 | 2019-04-10 | 日東電工株式会社 | 封止用シートおよびパッケージの製造方法 |
JP6724321B2 (ja) * | 2015-09-15 | 2020-07-15 | Tdk株式会社 | 積層電子部品 |
ITUB20154017A1 (it) * | 2015-09-30 | 2017-03-30 | St Microelectronics Srl | Dispositivo incapsulato di materiale semiconduttore a ridotta sensibilita' nei confronti di stress termo-meccanici |
EP3429970B1 (en) | 2016-03-17 | 2022-11-23 | Corning Incorporated | Bendable electronic device modules, articles and bonding methods of making the same |
JP6884595B2 (ja) * | 2017-02-28 | 2021-06-09 | キヤノン株式会社 | 電子部品、電子機器及び電子部品の製造方法 |
CN111684785B (zh) * | 2018-01-29 | 2021-06-04 | 富士胶片株式会社 | 摄像单元及摄像装置 |
JP7246136B2 (ja) * | 2018-02-14 | 2023-03-27 | キヤノン株式会社 | 半導体装置、カメラおよび半導体装置の製造方法 |
US11237300B2 (en) * | 2018-03-16 | 2022-02-01 | Canon Kabushiki Kaisha | Optical element and optical apparatus |
CN111261647B (zh) * | 2020-01-20 | 2021-06-08 | 甬矽电子(宁波)股份有限公司 | 一种透光盖板、光学传感器及其制造方法 |
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US20170104023A1 (en) | 2017-04-13 |
CN104425632B (zh) | 2017-04-12 |
US9570632B2 (en) | 2017-02-14 |
US9887222B2 (en) | 2018-02-06 |
CN104425632A (zh) | 2015-03-18 |
US20150054107A1 (en) | 2015-02-26 |
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