JP6884595B2 - 電子部品、電子機器及び電子部品の製造方法 - Google Patents
電子部品、電子機器及び電子部品の製造方法 Download PDFInfo
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- JP6884595B2 JP6884595B2 JP2017037712A JP2017037712A JP6884595B2 JP 6884595 B2 JP6884595 B2 JP 6884595B2 JP 2017037712 A JP2017037712 A JP 2017037712A JP 2017037712 A JP2017037712 A JP 2017037712A JP 6884595 B2 JP6884595 B2 JP 6884595B2
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Description
図1(a)の断面模式図と図1(b)の平面模式図を参照しつつ、第1の実施形態に係る電子部品1の構造について説明する。
図4(a)、(b)の模式断面図と平面図を参照しつつ、第2の実施形態に係る電子部品1の構造について説明する。第1の実施形態とは、貫通孔17の近傍の構造が異なっている点が異なっており、それ以外は第1の実施形態と同様である。
第3の実施形態について詳述する。第2の実施形態とは、穴24を形成する工程が異なっており、それ以外は第2の実施形態と同様である。
第4の実施形態の電子部品1が、図1に示した電子部品1と異なる点は透光部材16が配置されていない点である。それ以外は第2の実施形態と同じである。この場合、樹脂部材14としては、エポキシ樹脂、シリコーン樹脂等の樹脂など、特に制限なく用いることができる。また、樹脂部材14の封止方法としては、印刷やディスペンサー法だけではなく、射出成形法や、トランスファーモールド成形法も可能である。
図4(c)、(d)には第5の実施形態を示しており、図4(c)は模式断面図、図4(d)は平面模式図を示している。図4(c)、(d)に示す第5の実施形態の電子部品1が、図4に示す電子部品1と異なる点は、電子部品1が中空パッケージである点であり、それ以外は第2の実施形態と同じである。
電子部品1の製造方法としては、例えば図6に示すように、集合基板である実装基板2に複数の電子デバイス5を固着して図3の工程同様に行い、最後にダイシングによって個片化すると、複数の電子デバイス5を一括で製造することができる。
その後、紫外線硬化性樹脂を用いて、ホウケイ酸ガラス板をキャビティを有する実装基板2の上面に接着固定する。そして、ソルダーレジストからなる23YAGレーザーを照射し、約200μmの穴24を作製する。このようにして、電子部品1Eを35個作製する。
比較例として、上記説明した電子部品1A〜Eに関して、結合部材12の中央部分19を設けていない電子部品1A´〜E´を各35個作製する。それぞれの電子部品1A´〜E´は、結合部材12の中央部分19を設けない以外は、それぞれ実施例1〜5と同様に作製する。いずれの電子部品1A´〜E´においても、数個〜数十個程度の割合で異常が観察されうる。電子部品1A´〜C´については、アクリル樹脂部のクラックが観察され、かつ、電子デバイス5の平面度は不合格レベルの値を示しうる。また、電子部品1D´については、X線観察にて黒モールド内部にクラックが観察され、かつ電子デバイス5の平面度は不合格レベルの値でありうる。また、電子部品1E´については、画質に焦点が合わない不合格レベルの平面度でありうる。
2 実装基板2
5 電子デバイス5
12 結合部材12
13 空隙13
14 樹脂部材14
16 透光部材16
17 貫通孔17
18 周辺部分18
19 中央部分19
22 貫通孔17
23 膜23
24 穴24
50 中心
51 中央領域
52 周辺領域
53 縁
Claims (13)
- 基板と、
前記基板の上に配された電子デバイスと、
前記基板と前記電子デバイスとの間に配された結合部材と、を備える電子部品であって、
前記電子デバイスは、前記電子デバイスの中心を含む第1領域、および、前記第1領域と前記電子デバイスの縁との間の第2領域を有し、
前記結合部材は、前記電子デバイスの前記第1領域と前記基板との間に配置された第1部分と、前記電子デバイスの前記第2領域と前記基板との間に配置された第2部分と、を含み、
前記電子デバイスと前記基板との間であって、前記第1部分と前記第2部分との間には空隙が設けられており、
前記基板には、前記空隙に連通する貫通孔が、前記電子デバイスの前記中心に重ならないように設けられており、
前記基板と前記電子デバイスとの間には、前記貫通孔を覆う膜が設けられており、前記膜には前記貫通孔と前記空隙とを連通する穴が設けられており、
前記膜には前記結合部材が接触していないことを特徴とする電子部品。 - 前記空隙が前記第2部分で囲まれていることを特徴とする請求項1に記載の電子部品。
- 前記中心と前記縁とを結ぶ線分に重なる位置において、前記空隙が前記第1部分と前記第2部分との間に設けられている請求項1または2に記載の電子部品。
- 前記第1領域と前記第2領域の境界は、前記中心と前記縁の各点を結ぶ複数の線分の各々中点を結んだ線で定義されることを特徴とする請求項1乃至3のいずれか1項に記載の電子部品。
- 基板と、
前記基板の上に配された電子デバイスと、
前記基板と前記電子デバイスとの間に配された結合部材と、を備える電子部品であって、
前記結合部材は、前記電子デバイスの中心に重なるように配置されており、
前記電子デバイスと前記基板との間には空隙が設けられており、
前記基板には、前記空隙に連通する貫通孔が設けられており、
前記基板と前記電子デバイスとの間には、前記貫通孔を覆う膜が設けられており、前記膜には前記貫通孔と前記空隙とを連通する穴が設けられており、
前記膜には前記結合部材が接触していないことを特徴とする電子部品。 - 前記結合部材が前記空隙で囲まれていることを特徴とする請求項1乃至5のいずれか1項に記載の電子部品。
- 前記電子デバイスと前記基板との間には、前記空隙を含む複数の空隙が設けられており、前記基板には、前記複数の空隙の各々に対応して、複数の貫通孔が設けられていることを特徴とする請求項1乃至5のいずれか1項に記載の電子部品。
- 前記膜の厚さが50μm以下であることを特徴とする請求項1乃至7のいずれか1項に記載の電子部品。
- 前記電子デバイスに対向する透光部材を更に備え、前記電子デバイスは前記透光部材と前記基板との間に配されていることを特徴とする請求項1乃至8のいずれか1項に記載の電子部品。
- 前記基板および前記電子デバイスを覆う樹脂部材を更に備えることを特徴とする請求項1乃至9のいずれか1項に記載の電子部品。
- 前記電子デバイスに対向する透光部材と、
前記基板および前記透光部材に接触する樹脂部材を更に備え、
前記樹脂部材は、前記透光部材と前記電子デバイスとの間に位置する部分を有することを特徴とする請求項1乃至10のいずれか1項に記載の電子部品。 - 前記電子デバイスが光学デバイスであることを特徴とする請求項1乃至11のいずれか1項に記載の電子部品。
- 請求項1乃至11のいずれか1項に記載の電子部品と、
前記電子部品を搭載する配線板と、
前記電子部品の前記基板と前記配線板との間に配された半田部材と、
を備える電子機器。
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