JP4638492B2 - トップ−エミッション型oledデバイスの水分汚染を減らす方法 - Google Patents
トップ−エミッション型oledデバイスの水分汚染を減らす方法 Download PDFInfo
- Publication number
- JP4638492B2 JP4638492B2 JP2007523608A JP2007523608A JP4638492B2 JP 4638492 B2 JP4638492 B2 JP 4638492B2 JP 2007523608 A JP2007523608 A JP 2007523608A JP 2007523608 A JP2007523608 A JP 2007523608A JP 4638492 B2 JP4638492 B2 JP 4638492B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/321—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3]
- H10K85/324—Metal complexes comprising a group IIIA element, e.g. Tris (8-hydroxyquinoline) gallium [Gaq3] comprising aluminium, e.g. Alq3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/341—Transition metal complexes, e.g. Ru(II)polypyridine complexes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/341—Transition metal complexes, e.g. Ru(II)polypyridine complexes
- H10K85/342—Transition metal complexes, e.g. Ru(II)polypyridine complexes comprising iridium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/351—Metal complexes comprising lanthanides or actinides, e.g. comprising europium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/899,902 US7316756B2 (en) | 2004-07-27 | 2004-07-27 | Desiccant for top-emitting OLED |
| PCT/US2005/024917 WO2006019857A1 (en) | 2004-07-27 | 2005-07-13 | Dessicant for top-emitting oled |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008508682A JP2008508682A (ja) | 2008-03-21 |
| JP2008508682A5 JP2008508682A5 (enExample) | 2008-08-28 |
| JP4638492B2 true JP4638492B2 (ja) | 2011-02-23 |
Family
ID=35431120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007523608A Expired - Lifetime JP4638492B2 (ja) | 2004-07-27 | 2005-07-13 | トップ−エミッション型oledデバイスの水分汚染を減らす方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7316756B2 (enExample) |
| EP (2) | EP2276089B1 (enExample) |
| JP (1) | JP4638492B2 (enExample) |
| KR (1) | KR101181375B1 (enExample) |
| CN (1) | CN100514704C (enExample) |
| DE (1) | DE602005027708D1 (enExample) |
| WO (1) | WO2006019857A1 (enExample) |
Families Citing this family (64)
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| US7230271B2 (en) * | 2002-06-11 | 2007-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device comprising film having hygroscopic property and transparency and manufacturing method thereof |
| US7915822B2 (en) * | 2004-08-04 | 2011-03-29 | Samsung Electronics Co., Ltd. | Display device and method and apparatus for manufacturing the same |
| JP2006049308A (ja) * | 2004-08-04 | 2006-02-16 | Samsung Electronics Co Ltd | 表示装置、その製造方法、及びその製造装置 |
| US7638942B2 (en) * | 2004-10-11 | 2009-12-29 | Lg Display Co., Ltd. | Encapsulation cap having a getter and display device using the same |
| JP4624131B2 (ja) * | 2005-02-22 | 2011-02-02 | 三洋電機株式会社 | 窒化物系半導体素子の製造方法 |
| JP5596250B2 (ja) * | 2005-03-02 | 2014-09-24 | スリーエム イノベイティブ プロパティズ カンパニー | 湿気反応性組成物及び有機el素子 |
| US20060278965A1 (en) * | 2005-06-10 | 2006-12-14 | Foust Donald F | Hermetically sealed package and methods of making the same |
| JP2006344903A (ja) * | 2005-06-10 | 2006-12-21 | Fujifilm Holdings Corp | 半導体モジュール |
| KR100637129B1 (ko) * | 2005-08-05 | 2006-10-23 | 삼성에스디아이 주식회사 | 유기 발광 표시 소자 및 그 제조방법 |
| KR20070023454A (ko) * | 2005-08-24 | 2007-02-28 | 삼성전자주식회사 | 유기전계발광표시장치 및 이에 구비되는유기박막트랜지스터 |
| TWI339442B (en) * | 2005-12-09 | 2011-03-21 | Samsung Mobile Display Co Ltd | Flat panel display and method of fabricating the same |
| JP2007184279A (ja) * | 2005-12-30 | 2007-07-19 | Samsung Sdi Co Ltd | 有機発光素子およびその製造方法 |
| US8013527B2 (en) * | 2006-04-12 | 2011-09-06 | Lg Chem, Ltd. | Organic light emittig diode unit and method for manufacturing the same |
| TWI421607B (zh) * | 2006-08-24 | 2014-01-01 | Creator Technology Bv | 可撓性裝置上的滲透阻障 |
| JP5801522B2 (ja) * | 2006-08-31 | 2015-10-28 | スリーエム イノベイティブ プロパティズ カンパニー | 湿気反応性組成物及び有機el素子 |
| US20080067650A1 (en) * | 2006-09-15 | 2008-03-20 | Hong Kong Applied Science and Technology Research Institute Company Limited | Electronic component package with EMI shielding |
| US20080067651A1 (en) * | 2006-09-15 | 2008-03-20 | International Business Machines Corporation | Method and apparatus for prevention of solder corrosion utilizing forced air |
| US7651890B2 (en) * | 2006-09-15 | 2010-01-26 | International Business Machines Corporation | Method and apparatus for prevention of solder corrosion |
| US20090026470A1 (en) * | 2007-07-23 | 2009-01-29 | Novalite Optronics Corp. | Super thin side-view light-emitting diode (led) package and fabrication method thereof |
| WO2009031886A2 (en) * | 2007-09-07 | 2009-03-12 | Fujifilm Manufacturing Europe B.V. | Method and apparatus for atomic layer deposition using an atmospheric pressure glow discharge plasma |
| DE102008006816A1 (de) * | 2007-10-12 | 2009-04-16 | Alcan Technology & Management Ag | Vorrichtung für die Herstellung und/oder Aufbewahrung von organischen Leuchtdioden bzw. Solarzellen sowie Verfahren zur Herstellung der Vorrichtung |
| US8016631B2 (en) * | 2007-11-16 | 2011-09-13 | Global Oled Technology Llc | Desiccant sealing arrangement for OLED devices |
| WO2009139292A1 (ja) * | 2008-05-12 | 2009-11-19 | 財団法人山形県産業技術振興機構 | 有機el発光装置およびその製造方法 |
| US20090289202A1 (en) * | 2008-05-22 | 2009-11-26 | General Electric Company | Integrated Encapsulation Status Indicator |
| WO2009148716A2 (en) * | 2008-06-02 | 2009-12-10 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| US8232350B2 (en) * | 2008-06-02 | 2012-07-31 | 3M Innovative Properties Company | Adhesive encapsulating composition and electronic devices made therewith |
| WO2010005898A1 (en) * | 2008-07-07 | 2010-01-14 | Universal Display Corporation | Oleds and other electronic devices using desiccants |
| KR101002658B1 (ko) * | 2008-12-10 | 2010-12-20 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
| DE102008063636A1 (de) * | 2008-12-18 | 2010-06-24 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines organischen optoelektronischen Bauelements und organisches optoelektronisches Bauelement |
| TW201110802A (en) * | 2009-06-24 | 2011-03-16 | Seiko Epson Corp | Electro-optical device, electronic device, and illumination apparatus |
| US20110025196A1 (en) * | 2009-07-31 | 2011-02-03 | General Electric Company | Hermetic package with getter materials |
| KR20110019636A (ko) * | 2009-08-20 | 2011-02-28 | 삼성모바일디스플레이주식회사 | 가요성 표시 장치용 기판 및 그 제조 방법과 상기 기판을 포함하는 유기 발광 표시 장치 |
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| US9891361B2 (en) | 2011-08-05 | 2018-02-13 | Lg Display Co., Ltd. | Organic light emitting display device and method of manufacturing the same |
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2004
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- 2005-07-13 EP EP10012476.7A patent/EP2276089B1/en not_active Expired - Lifetime
- 2005-07-13 CN CNB2005800254789A patent/CN100514704C/zh not_active Expired - Lifetime
- 2005-07-13 KR KR1020077001866A patent/KR101181375B1/ko not_active Expired - Lifetime
- 2005-07-13 DE DE602005027708T patent/DE602005027708D1/de not_active Expired - Lifetime
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Also Published As
| Publication number | Publication date |
|---|---|
| US20060022592A1 (en) | 2006-02-02 |
| EP2276089A2 (en) | 2011-01-19 |
| WO2006019857A1 (en) | 2006-02-23 |
| EP2276089B1 (en) | 2016-10-19 |
| EP2276089A3 (en) | 2012-04-25 |
| JP2008508682A (ja) | 2008-03-21 |
| KR20070048173A (ko) | 2007-05-08 |
| DE602005027708D1 (de) | 2011-06-09 |
| US7316756B2 (en) | 2008-01-08 |
| EP1779446A1 (en) | 2007-05-02 |
| KR101181375B1 (ko) | 2012-09-19 |
| EP1779446B1 (en) | 2011-04-27 |
| CN101019249A (zh) | 2007-08-15 |
| CN100514704C (zh) | 2009-07-15 |
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