JP4592936B2 - 電子回路用銅箔及び電子回路の形成方法 - Google Patents

電子回路用銅箔及び電子回路の形成方法 Download PDF

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JP4592936B2
JP4592936B2 JP2000369753A JP2000369753A JP4592936B2 JP 4592936 B2 JP4592936 B2 JP 4592936B2 JP 2000369753 A JP2000369753 A JP 2000369753A JP 2000369753 A JP2000369753 A JP 2000369753A JP 4592936 B2 JP4592936 B2 JP 4592936B2
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copper foil
etching
circuit
copper
cobalt
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JP2002176242A (ja
JP2002176242A5 (enrdf_load_stackoverflow
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賢吾 米沢
勝 坂本
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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JP2000369753A 2000-12-05 2000-12-05 電子回路用銅箔及び電子回路の形成方法 Expired - Lifetime JP4592936B2 (ja)

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JP2010131709A Division JP5043154B2 (ja) 2010-06-09 2010-06-09 電子回路用銅箔及び電子回路の形成方法

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JP2002176242A JP2002176242A (ja) 2002-06-21
JP2002176242A5 JP2002176242A5 (enrdf_load_stackoverflow) 2009-08-27
JP4592936B2 true JP4592936B2 (ja) 2010-12-08

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Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051673A (ja) * 2001-08-06 2003-02-21 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板
JP4941204B2 (ja) * 2007-09-27 2012-05-30 日立電線株式会社 プリント配線板用銅箔及びその表面処理方法
KR101269708B1 (ko) 2008-12-26 2013-05-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 회로용 압연 동박 또는 전해 동박, 이들을 사용한 전자 회로의 형성 방법 및 프린트 기판
CN102264951A (zh) * 2008-12-26 2011-11-30 吉坤日矿日石金属株式会社 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法
JP4955105B2 (ja) 2008-12-26 2012-06-20 Ｊｘ日鉱日石金属株式会社 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法
WO2010074054A1 (ja) * 2008-12-26 2010-07-01 日鉱金属株式会社 電子回路の形成方法
EP2384101A4 (en) 2009-01-29 2012-08-29 Jx Nippon Mining & Metals Corp COPPER COPPER FILM OR ELECTROLYTIC COPPER FILM FOR ELECTRONIC CIRCUIT, AND METHOD FOR FORMING ELECTRONIC CIRCUIT USING SUCH FILM
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
KR101451489B1 (ko) * 2010-01-15 2014-10-17 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 회로 및 그 형성 방법 그리고 전자 회로 형성용 동장 적층판
JP5367613B2 (ja) * 2010-02-12 2013-12-11 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
WO2011121803A1 (ja) * 2010-03-30 2011-10-06 Jx日鉱日石金属株式会社 耐加熱変色及びエッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
JP5702942B2 (ja) * 2010-03-30 2015-04-15 Jx日鉱日石金属株式会社 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
JP5232823B2 (ja) * 2010-03-30 2013-07-10 Ｊｘ日鉱日石金属株式会社 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
JP5406099B2 (ja) * 2010-03-30 2014-02-05 Ｊｘ日鉱日石金属株式会社 エッチング性に優れたプリント配線板用銅箔及び積層体
JP5312412B2 (ja) 2010-08-06 2013-10-09 三洋電機株式会社 コンテンツ再生装置
JP5497911B2 (ja) 2010-11-12 2014-05-21 Ｊｘ日鉱日石金属株式会社 フレキシブルラミネート基板への回路形成方法
JP5558437B2 (ja) * 2011-08-24 2014-07-23 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔及びそれを用いた積層板
TWI576024B (zh) * 2011-09-30 2017-03-21 Jx Nippon Mining & Metals Corp Printed wiring board with copper foil and the use of its laminated board
JP6111017B2 (ja) 2012-02-03 2017-04-05 Ｊｘ金属株式会社 プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品
MY178050A (en) * 2013-03-05 2020-09-30 Mitsui Mining & Smelting Co Ltd Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board
KR20160086757A (ko) * 2014-12-09 2016-07-20 인텔 코포레이션 구리 합금 도전성 루트 구조체를 갖는 마이크로전자 기판
TWI593548B (zh) 2015-01-09 2017-08-01 Jx Nippon Mining & Metals Corp Attached to the metal substrate
CN105018985B (zh) * 2015-08-10 2018-07-31 灵宝华鑫铜箔有限责任公司 一种减少电解铜箔侧蚀现象的表面处理工艺
JP7183582B2 (ja) * 2018-06-19 2022-12-06 凸版印刷株式会社 ガラス配線基板
CN109788654A (zh) * 2018-12-17 2019-05-21 盐城维信电子有限公司 一种提高蚀刻因子的柔性线路板的制作方法
CN116745462A (zh) 2021-03-25 2023-09-12 纳美仕有限公司 叠层体的制造方法
EP4319494A1 (en) 2021-03-25 2024-02-07 Namics Corporation Laminate for wiring board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284690A (ja) * 1991-03-13 1992-10-09 Furukawa Saakitsuto Foil Kk 多層プリント配線板内層回路用銅箔及びその製造方法
JPH0681172A (ja) * 1992-09-01 1994-03-22 Hitachi Cable Ltd 微細パターンの形成方法
JPH07297544A (ja) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd プリント配線板の製造法
JP2000269619A (ja) * 1999-03-16 2000-09-29 Reiko Co Ltd データ通信用アンテナ回路基板製造用フイルム及びデータ通信用アンテナ回路基板

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