MY178050A - Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board - Google Patents
Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring boardInfo
- Publication number
- MY178050A MY178050A MYPI2015702835A MYPI2015702835A MY178050A MY 178050 A MY178050 A MY 178050A MY PI2015702835 A MYPI2015702835 A MY PI2015702835A MY PI2015702835 A MYPI2015702835 A MY PI2015702835A MY 178050 A MY178050 A MY 178050A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper
- laser processing
- copper foil
- wiring board
- printed wiring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Mechanical Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laser Beam Processing (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
An object is to provide a copper foil (12) suitable for infrared laser processing (10), a copper foil provided with a carrier foil suitable for laser processing, a copper-clad laminate (100), and a method of manufacturing a printed wiring board which is high in laser processability and suitable for appropriate formation of a wiring pattern. To achieve the object, the copper foil suitable for laser processing according to the present invention is provided with a slightly soluble laser absorbing layer that is etchable with a copper etchant and is slower in etching rate than the copper foil and that absorbs infrared laser beam on a surface of the copper foil.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013043046 | 2013-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY178050A true MY178050A (en) | 2020-09-30 |
Family
ID=51491279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015702835A MY178050A (en) | 2013-03-05 | 2014-03-04 | Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6304829B2 (en) |
KR (1) | KR102356407B1 (en) |
CN (1) | CN105008594A (en) |
MY (1) | MY178050A (en) |
TW (1) | TWI599279B (en) |
WO (1) | WO2014136763A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102412000B1 (en) | 2015-05-12 | 2022-06-22 | 삼성전기주식회사 | Copper clad laminates and method for printed circuit board using the same |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4582778A (en) * | 1983-10-25 | 1986-04-15 | Sullivan Donald F | Multi-function photopolymer for efficiently producing high resolution images on printed wiring boards, and the like |
JPH0681172A (en) * | 1992-09-01 | 1994-03-22 | Hitachi Cable Ltd | Formation of fine pattern |
TW469228B (en) * | 1998-01-14 | 2001-12-21 | Mitsui Mining & Smelting Co | Method for producing multi-layer printed wiring boards having blind vias |
JP3612594B2 (en) * | 1998-05-29 | 2005-01-19 | 三井金属鉱業株式会社 | Composite foil with resin, method for producing the same, multilayer copper-clad laminate using the composite foil, and method for producing multilayer printed wiring board |
JP2001226796A (en) * | 1999-12-09 | 2001-08-21 | Hitachi Metals Ltd | Copper foil for laser drilling process, copper foil fitted with resin using same and their producing method |
JP3258308B2 (en) * | 2000-02-03 | 2002-02-18 | 株式会社日鉱マテリアルズ | Copper foil excellent in laser drilling property and method for producing the same |
JP3330925B2 (en) * | 2000-04-05 | 2002-10-07 | 株式会社日鉱マテリアルズ | Copper foil for laser drilling |
US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
JP4592936B2 (en) * | 2000-12-05 | 2010-12-08 | Jx日鉱日石金属株式会社 | Copper foil for electronic circuit and method for forming electronic circuit |
JP2003286596A (en) | 2002-03-29 | 2003-10-10 | Nippon Denkai Kk | Copper foil suitable for laser drilling and its preparation process |
JP2004006612A (en) * | 2002-04-12 | 2004-01-08 | Mitsui Mining & Smelting Co Ltd | Copper foil with carrier foil and its producing method, and copper clad laminate using copper foil with carrier foil |
JP3736806B2 (en) * | 2003-12-26 | 2006-01-18 | 三井金属鉱業株式会社 | Printed wiring board, manufacturing method thereof, and circuit device |
JP2005260250A (en) * | 2005-03-23 | 2005-09-22 | Mitsui Mining & Smelting Co Ltd | Surface treatment copper foil and copper clad laminate using it |
JP5354950B2 (en) * | 2008-05-02 | 2013-11-27 | 株式会社秀峰 | Surface treatment method for mobile phone case and mobile phone case thereby |
WO2011086972A1 (en) * | 2010-01-15 | 2011-07-21 | Jx日鉱日石金属株式会社 | Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation |
JP5043154B2 (en) | 2010-06-09 | 2012-10-10 | Jx日鉱日石金属株式会社 | Copper foil for electronic circuit and method for forming electronic circuit |
KR101805743B1 (en) * | 2012-03-09 | 2017-12-07 | 미쓰이금속광업주식회사 | Method for manufacturing printed wiring board and copper foil for laser processing |
-
2014
- 2014-03-04 KR KR1020157023938A patent/KR102356407B1/en active IP Right Grant
- 2014-03-04 MY MYPI2015702835A patent/MY178050A/en unknown
- 2014-03-04 WO PCT/JP2014/055446 patent/WO2014136763A1/en active Application Filing
- 2014-03-04 CN CN201480011975.2A patent/CN105008594A/en active Pending
- 2014-03-04 JP JP2015504326A patent/JP6304829B2/en active Active
- 2014-03-05 TW TW103107413A patent/TWI599279B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2014136763A1 (en) | 2014-09-12 |
KR102356407B1 (en) | 2022-01-28 |
CN105008594A (en) | 2015-10-28 |
TW201448685A (en) | 2014-12-16 |
TWI599279B (en) | 2017-09-11 |
KR20150128686A (en) | 2015-11-18 |
JPWO2014136763A1 (en) | 2017-02-09 |
JP6304829B2 (en) | 2018-04-04 |
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