JP2002176242A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002176242A5 JP2002176242A5 JP2000369753A JP2000369753A JP2002176242A5 JP 2002176242 A5 JP2002176242 A5 JP 2002176242A5 JP 2000369753 A JP2000369753 A JP 2000369753A JP 2000369753 A JP2000369753 A JP 2000369753A JP 2002176242 A5 JP2002176242 A5 JP 2002176242A5
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- etching
- copper
- alloy layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 12
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical group [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000369753A JP4592936B2 (ja) | 2000-12-05 | 2000-12-05 | 電子回路用銅箔及び電子回路の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000369753A JP4592936B2 (ja) | 2000-12-05 | 2000-12-05 | 電子回路用銅箔及び電子回路の形成方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010131709A Division JP5043154B2 (ja) | 2010-06-09 | 2010-06-09 | 電子回路用銅箔及び電子回路の形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002176242A JP2002176242A (ja) | 2002-06-21 |
| JP2002176242A5 true JP2002176242A5 (enrdf_load_stackoverflow) | 2009-08-27 |
| JP4592936B2 JP4592936B2 (ja) | 2010-12-08 |
Family
ID=18839747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000369753A Expired - Lifetime JP4592936B2 (ja) | 2000-12-05 | 2000-12-05 | 電子回路用銅箔及び電子回路の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4592936B2 (enrdf_load_stackoverflow) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051673A (ja) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板 |
| JP4941204B2 (ja) * | 2007-09-27 | 2012-05-30 | 日立電線株式会社 | プリント配線板用銅箔及びその表面処理方法 |
| KR101269708B1 (ko) | 2008-12-26 | 2013-05-30 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 전자 회로용 압연 동박 또는 전해 동박, 이들을 사용한 전자 회로의 형성 방법 및 프린트 기판 |
| CN102264951A (zh) * | 2008-12-26 | 2011-11-30 | 吉坤日矿日石金属株式会社 | 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 |
| JP4955105B2 (ja) | 2008-12-26 | 2012-06-20 | Ｊｘ日鉱日石金属株式会社 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
| WO2010074054A1 (ja) * | 2008-12-26 | 2010-07-01 | 日鉱金属株式会社 | 電子回路の形成方法 |
| EP2384101A4 (en) | 2009-01-29 | 2012-08-29 | Jx Nippon Mining & Metals Corp | COPPER COPPER FILM OR ELECTROLYTIC COPPER FILM FOR ELECTRONIC CIRCUIT, AND METHOD FOR FORMING ELECTRONIC CIRCUIT USING SUCH FILM |
| WO2010147059A1 (ja) * | 2009-06-18 | 2010-12-23 | Jx日鉱日石金属株式会社 | 電子回路及びその形成方法並びに電子回路形成用銅張積層板 |
| KR101451489B1 (ko) * | 2010-01-15 | 2014-10-17 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 전자 회로 및 그 형성 방법 그리고 전자 회로 형성용 동장 적층판 |
| JP5367613B2 (ja) * | 2010-02-12 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | プリント配線板用銅箔 |
| WO2011121803A1 (ja) * | 2010-03-30 | 2011-10-06 | Jx日鉱日石金属株式会社 | 耐加熱変色及びエッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体 |
| JP5702942B2 (ja) * | 2010-03-30 | 2015-04-15 | Jx日鉱日石金属株式会社 | エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体 |
| JP5232823B2 (ja) * | 2010-03-30 | 2013-07-10 | Ｊｘ日鉱日石金属株式会社 | エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体 |
| JP5406099B2 (ja) * | 2010-03-30 | 2014-02-05 | Ｊｘ日鉱日石金属株式会社 | エッチング性に優れたプリント配線板用銅箔及び積層体 |
| JP5312412B2 (ja) | 2010-08-06 | 2013-10-09 | 三洋電機株式会社 | コンテンツ再生装置 |
| JP5497911B2 (ja) | 2010-11-12 | 2014-05-21 | Ｊｘ日鉱日石金属株式会社 | フレキシブルラミネート基板への回路形成方法 |
| JP5558437B2 (ja) * | 2011-08-24 | 2014-07-23 | Ｊｘ日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層板 |
| TWI576024B (zh) * | 2011-09-30 | 2017-03-21 | Jx Nippon Mining & Metals Corp | Printed wiring board with copper foil and the use of its laminated board |
| JP6111017B2 (ja) | 2012-02-03 | 2017-04-05 | Ｊｘ金属株式会社 | プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品 |
| MY178050A (en) * | 2013-03-05 | 2020-09-30 | Mitsui Mining & Smelting Co Ltd | Copper foil suitable for laser processing, copper foil provided with carrier foil suitable for laser processing, copper-clad laminate, and method of manufacturing printed wiring board |
| KR20160086757A (ko) * | 2014-12-09 | 2016-07-20 | 인텔 코포레이션 | 구리 합금 도전성 루트 구조체를 갖는 마이크로전자 기판 |
| TWI593548B (zh) | 2015-01-09 | 2017-08-01 | Jx Nippon Mining & Metals Corp | Attached to the metal substrate |
| CN105018985B (zh) * | 2015-08-10 | 2018-07-31 | 灵宝华鑫铜箔有限责任公司 | 一种减少电解铜箔侧蚀现象的表面处理工艺 |
| JP7183582B2 (ja) * | 2018-06-19 | 2022-12-06 | 凸版印刷株式会社 | ガラス配線基板 |
| CN109788654A (zh) * | 2018-12-17 | 2019-05-21 | 盐城维信电子有限公司 | 一种提高蚀刻因子的柔性线路板的制作方法 |
| CN116745462A (zh) | 2021-03-25 | 2023-09-12 | 纳美仕有限公司 | 叠层体的制造方法 |
| EP4319494A1 (en) | 2021-03-25 | 2024-02-07 | Namics Corporation | Laminate for wiring board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284690A (ja) * | 1991-03-13 | 1992-10-09 | Furukawa Saakitsuto Foil Kk | 多層プリント配線板内層回路用銅箔及びその製造方法 |
| JPH0681172A (ja) * | 1992-09-01 | 1994-03-22 | Hitachi Cable Ltd | 微細パターンの形成方法 |
| JPH07297544A (ja) * | 1994-04-21 | 1995-11-10 | Hitachi Chem Co Ltd | プリント配線板の製造法 |
| JP2000269619A (ja) * | 1999-03-16 | 2000-09-29 | Reiko Co Ltd | データ通信用アンテナ回路基板製造用フイルム及びデータ通信用アンテナ回路基板 |
-
2000
- 2000-12-05 JP JP2000369753A patent/JP4592936B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002176242A5 (enrdf_load_stackoverflow) | ||
| EP1194021A3 (en) | Method of producing multilayer printed wiring board and multilayer printed wiring board | |
| EP1157821A4 (en) | COPPER-COATED LAMINATED PLATE, PCB AND METHOD OF MANUFACTURING | |
| WO2003015483A1 (en) | Printed wiring board-use copper foil and copper clad laminated sheet using the printed wiring board-use copper foil | |
| CN1663329B (zh) | 柔性电路可印刷板上通路孔的制造 | |
| EP1667510A4 (en) | METHOD FOR PRODUCING A DOUBLE-SIDED PRINTED GLASS PANEL | |
| JP2015019107A5 (enrdf_load_stackoverflow) | ||
| EP1261021A3 (en) | Method of production of circuit board, semiconductor device, and plating system | |
| TWI282377B (en) | Etchant, replenishment solution and method for producing copper wiring using the same | |
| TW200520662A (en) | Multi-layer printed circuit board and fabricating method thereof | |
| JP2004172589A5 (enrdf_load_stackoverflow) | ||
| JP2002176242A (ja) | 電子回路用銅箔及び電子回路の形成方法 | |
| EP1357775A4 (en) | PCB AND METHOD FOR THE PRODUCTION THEREOF | |
| MY124084A (en) | A clad sheet for printed circuit board, a multilayered printed circuit board using thereof and manufacturing method thereof | |
| TW200607419A (en) | Production method of wiring sustrate having ultra-fine pattern, and wiring substrate | |
| TW200605373A (en) | Printed wiring board, production process thereof and semiconductor device | |
| TW200507715A (en) | Manufacturing method of printed circuit board | |
| CN109600923A (zh) | 一种高端pcb金属化槽加工方法 | |
| EP1229770A4 (en) | PRINTED CIRCUIT BOARD MANUFACTURING METHOD | |
| WO2005006412A3 (en) | A method of forming an integrated circuit substrate | |
| TWI295911B (en) | Manufacturing method of circuit board | |
| JP2005222999A (ja) | 両面型回路配線基板の製造方法 | |
| CN201479476U (zh) | 一种单面电镍金板制作装置 | |
| JP2003110211A (ja) | 回路基板およびその製造方法 | |
| WO2000046877A3 (en) | Printed circuit boards with solid interconnect and method of producing the same |