JP2002176242A5 - - Google Patents
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- Publication number
- JP2002176242A5 JP2002176242A5 JP2000369753A JP2000369753A JP2002176242A5 JP 2002176242 A5 JP2002176242 A5 JP 2002176242A5 JP 2000369753 A JP2000369753 A JP 2000369753A JP 2000369753 A JP2000369753 A JP 2000369753A JP 2002176242 A5 JP2002176242 A5 JP 2002176242A5
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- etching
- copper
- alloy layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Description
【特許請求の範囲】
【請求項１】
エッチングにより回路形成を行う電子回路用銅箔において、エッチング面側に銅よりエッチングレートの遅い金属又は合金層を、１００〜１００００μｇ／ｄｍ ２ 形成したことを特徴とする電子回路用銅箔。
【請求項２】
銅張り積層板であることを特徴とする請求項１記載の電子回路用銅箔。
【請求項３】
銅よりエッチングレートの遅い金属又は合金層がコバルト、ニッケル又はこれらの合金層であることを特徴とする請求項１又は２記載の電子回路用銅箔。
【請求項４】
銅箔のエッチング側面の傾斜角度が、８０〜９５度の範囲にあることを特徴とする請求項１〜３のいずれか一項に記載の電子回路用銅箔。
【請求項５】
銅箔のエッチング側面の傾斜角度が、８５〜９０度の範囲にあることを特徴とする請求項１〜３のいずれか一項に記載の電子回路用銅箔。
【請求項６】
銅張り積層板の銅箔をエッチングし電子回路を形成する方法において、銅箔のエッチング面側に銅よりエッチングレートの遅い金属又は合金層を１００〜１００００μｇ／ｄｍ ２ 形成した後、塩化第二銅水溶液を用いて該銅箔をエッチングし、回路を形成することを特徴とする電子回路の形成方法。
【請求項７】
銅よりエッチングレートの遅い金属又は合金層がコバルト、ニッケル又はこれらの合金層であることを特徴とする請求項６記載の電子回路の形成方法。
【請求項８】
銅箔のエッチング側面の傾斜角度が、８０〜９５度の範囲にあることを特徴とする請求項６又は７に記載の電子回路の形成方法。
【請求項９】
銅箔のエッチング側面の傾斜角度が、８５〜９０度の範囲にあることを特徴とする請求項６又は７に記載の電子回路の形成方法。
[Claims]
[Claim 1]
A copper foil for electronic circuits, wherein a metal or alloy layer having a slower etching rate than copper is formed on the etching surface side in a copper foil for electronic circuits in which circuit formation is performed by etching, 100 to 10,000 μg / dm 2 .
[Claim 2]
2. The copper foil for electronic circuits according to claim 1, which is a copper-clad laminate.
[Claim 3]
3. The copper foil for electronic circuits according to claim 1, wherein the metal or alloy layer having a slower etching rate than copper is cobalt, nickel, or an alloy layer thereof.
[Claim 4]
The copper foil for electronic circuits according to any one of claims 1 to 3 , wherein the inclination angle of the etching side surface of the copper foil is in the range of 80 to 95 degrees.
[Claim 5]
The copper foil for electronic circuits according to any one of claims 1 to 3, wherein an inclination angle of the etching side surface of the copper foil is in a range of 85 to 90 degrees.
[Claim 6]
The copper foil of the copper-clad laminate in a method of forming by etching an electronic circuit, after the slow metal or alloy layer etching rate of copper was 100~10000μg / dm 2 formed on the etched surface side of the copper foil, cupric chloride A method of forming an electronic circuit, comprising etching a copper foil with an aqueous solution to form a circuit.
[Claim 7]
7. The method of forming an electronic circuit according to claim 6 , wherein the metal or alloy layer having a slower etching rate than copper is cobalt, nickel or an alloy layer thereof.
[Claim 8]
Method of forming an electronic circuit according to claim 6 or 7 inclination angle of the etching side of the copper foil, characterized in that in the range of 80 to 95 degrees.
[Claim 9]
The method of forming an electronic circuit according to claim 6 or 7, wherein an inclination angle of the etching side surface of the copper foil is in a range of 85 to 90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000369753A JP4592936B2 (en) | 2000-12-05 | 2000-12-05 | Copper foil for electronic circuit and method for forming electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000369753A JP4592936B2 (en) | 2000-12-05 | 2000-12-05 | Copper foil for electronic circuit and method for forming electronic circuit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010131709A Division JP5043154B2 (en) | 2010-06-09 | 2010-06-09 | Copper foil for electronic circuit and method for forming electronic circuit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002176242A JP2002176242A (en) | 2002-06-21 |
| JP2002176242A5 true JP2002176242A5 (en) | 2009-08-27 |
| JP4592936B2 JP4592936B2 (en) | 2010-12-08 |
Family
ID=18839747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000369753A Expired - Lifetime JP4592936B2 (en) | 2000-12-05 | 2000-12-05 | Copper foil for electronic circuit and method for forming electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4592936B2 (en) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051673A (en) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | Printed wiring board copper foil and copper-plated laminated board using the same |
| JP4941204B2 (en) * | 2007-09-27 | 2012-05-30 | 日立電線株式会社 | Copper foil for printed wiring board and surface treatment method thereof |
| JP4955106B2 (en) | 2008-12-26 | 2012-06-20 | Ｊｘ日鉱日石金属株式会社 | Rolled copper foil or electrolytic copper foil for electronic circuit and method for forming electronic circuit using these |
| KR101295472B1 (en) * | 2008-12-26 | 2013-08-09 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Rolled copper foil or electrolytic copper foil for electronic circuit and method of forming electronic circuit using same |
| KR101269745B1 (en) | 2008-12-26 | 2013-05-30 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Rolled copper foil or electrolytic copper foil for electronic circuit, method for forming electronic circuit and printed substrate using the rolled copper foil or electrolytic copper foil |
| CN102265712B (en) * | 2008-12-26 | 2014-10-29 | 吉坤日矿日石金属株式会社 | Method for forming electronic circuit |
| EP2384101A4 (en) | 2009-01-29 | 2012-08-29 | Jx Nippon Mining & Metals Corp | Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using same |
| WO2010147059A1 (en) * | 2009-06-18 | 2010-12-23 | Jx日鉱日石金属株式会社 | Electronic circuit, method for forming same, and copper-clad laminate for electronic circuit formation |
| KR101451489B1 (en) | 2010-01-15 | 2014-10-17 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation |
| JP5367613B2 (en) * | 2010-02-12 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | Copper foil for printed wiring boards |
| JP5232823B2 (en) * | 2010-03-30 | 2013-07-10 | Ｊｘ日鉱日石金属株式会社 | Copper foil for printed wiring board excellent in etching property and laminate using the same |
| JP5406099B2 (en) * | 2010-03-30 | 2014-02-05 | Ｊｘ日鉱日石金属株式会社 | Copper foil and laminate for printed wiring board with excellent etching properties |
| JP5702942B2 (en) * | 2010-03-30 | 2015-04-15 | Jx日鉱日石金属株式会社 | Copper foil for printed wiring board excellent in etching property and laminate using the same |
| WO2011121803A1 (en) * | 2010-03-30 | 2011-10-06 | Jx日鉱日石金属株式会社 | Copper foil for printed wiring board having excellent thermal discoloration resistance and etching properties, and laminate using same |
| JP5312412B2 (en) | 2010-08-06 | 2013-10-09 | 三洋電機株式会社 | Content playback device |
| KR20130100333A (en) | 2010-11-12 | 2013-09-10 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Method for forming circuit on flexible laminate substrate |
| JP5558437B2 (en) * | 2011-08-24 | 2014-07-23 | Ｊｘ日鉱日石金属株式会社 | Copper foil for printed wiring board and laminated board using the same |
| TW201519712A (en) * | 2011-09-30 | 2015-05-16 | Jx Nippon Mining & Metals Corp | Copper foil for printed circuit board and laminated plate using same |
| JP6111017B2 (en) | 2012-02-03 | 2017-04-05 | Ｊｘ金属株式会社 | Copper foil for printed wiring board, laminate using the same, printed wiring board, and electronic component |
| CN105008594A (en) * | 2013-03-05 | 2015-10-28 | 三井金属矿业株式会社 | Copper foil for laser processing, carrier-foil-supported copper foil for laser processing, copper-clad laminate, and process for producing printed wiring board |
| JP6227803B2 (en) * | 2014-12-09 | 2017-11-08 | インテル・コーポレーション | Microelectronic substrate with copper alloy conductive path structure |
| TWI593548B (en) | 2015-01-09 | 2017-08-01 | Jx Nippon Mining & Metals Corp | Attached to the metal substrate |
| CN105018985B (en) * | 2015-08-10 | 2018-07-31 | 灵宝华鑫铜箔有限责任公司 | A kind of process of surface treatment reducing electrolytic copper foil side etching phenomenon |
| JP7183582B2 (en) * | 2018-06-19 | 2022-12-06 | 凸版印刷株式会社 | glass wiring board |
| CN109788654A (en) * | 2018-12-17 | 2019-05-21 | 盐城维信电子有限公司 | A kind of production method for the flexible circuit board improving etching factor |
| CN116745462A (en) | 2021-03-25 | 2023-09-12 | 纳美仕有限公司 | Method for producing laminate |
| CN116724671A (en) | 2021-03-25 | 2023-09-08 | 纳美仕有限公司 | Laminate for wiring board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284690A (en) * | 1991-03-13 | 1992-10-09 | Furukawa Saakitsuto Foil Kk | Copper foil for inner layer circuit of multilayer printed circuit board and manufacture thereof |
| JPH0681172A (en) * | 1992-09-01 | 1994-03-22 | Hitachi Cable Ltd | Formation of fine pattern |
| JPH07297544A (en) * | 1994-04-21 | 1995-11-10 | Hitachi Chem Co Ltd | Manufacture of printed wiring board |
| JP2000269619A (en) * | 1999-03-16 | 2000-09-29 | Reiko Co Ltd | Data communication antenna circuit board and film for manufacturing the same |
-
2000
- 2000-12-05 JP JP2000369753A patent/JP4592936B2/en not_active Expired - Lifetime
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