JPH04284690A - Copper foil for inner layer circuit of multilayer printed circuit board and manufacture thereof - Google Patents

Copper foil for inner layer circuit of multilayer printed circuit board and manufacture thereof

Info

Publication number
JPH04284690A
JPH04284690A JP7208691A JP7208691A JPH04284690A JP H04284690 A JPH04284690 A JP H04284690A JP 7208691 A JP7208691 A JP 7208691A JP 7208691 A JP7208691 A JP 7208691A JP H04284690 A JPH04284690 A JP H04284690A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
inner layer
circuit board
copper foil
multilayer printed
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7208691A
Inventor
Keiji Azuma
Takashi Inada
Kimikazu Kato
Ryoichi Oguro
Original Assignee
Furukawa Saakitsuto Foil Kk
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE:To enhance adhesive properties with a prepreg, to scarcely cause a haloing and to further facilitate an optical inspection. CONSTITUTION:A copper foil for an inner layer circuit of a multilayer printed circuit board comprising a black metal-plated layer further provided at least on a rough surface as a front surface of the inner layer circuit board of the foil in which both side surfaces are previously roughed.
JP7208691A 1991-03-13 1991-03-13 Copper foil for inner layer circuit of multilayer printed circuit board and manufacture thereof Granted JPH04284690A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7208691A JPH04284690A (en) 1991-03-13 1991-03-13 Copper foil for inner layer circuit of multilayer printed circuit board and manufacture thereof

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP7208691A JPH04284690A (en) 1991-03-13 1991-03-13 Copper foil for inner layer circuit of multilayer printed circuit board and manufacture thereof
TW80103802A TW208110B (en) 1990-06-08 1991-05-16
US07706053 US5320919A (en) 1990-06-08 1991-05-28 Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same
DE1991621143 DE69121143D1 (en) 1990-06-08 1991-05-29 Copper foil for the inner layer circuit of a multilayered printed circuit board, to processes for their preparation and containing multilayer printed circuit board
DE1991621143 DE69121143T2 (en) 1990-06-08 1991-05-29 Copper foil for the inner layer circuit of a multilayered printed circuit board, to processes for their preparation and containing multilayer printed circuit board
EP19910304818 EP0460856B1 (en) 1990-06-08 1991-05-29 Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same

Publications (1)

Publication Number Publication Date
JPH04284690A true true JPH04284690A (en) 1992-10-09

Family

ID=13479242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7208691A Granted JPH04284690A (en) 1991-03-13 1991-03-13 Copper foil for inner layer circuit of multilayer printed circuit board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH04284690A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996017503A1 (en) * 1994-12-01 1996-06-06 Ibiden Co., Ltd. Multilayer printed wiring board and process for producing the same
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
JP2001168481A (en) * 1999-12-08 2001-06-22 Ibiden Co Ltd Copper-clad laminate, and circuit substrate for printed wiring board and manufacturing method therefor
JP2002176242A (en) * 2000-12-05 2002-06-21 Nikko Materials Co Ltd Copper foil for electronic circuit and method for forming electronic circuit
US6544664B1 (en) 1999-05-25 2003-04-08 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board
JP2004349693A (en) * 2003-04-30 2004-12-09 Mec Kk Resin adhesive layer on surface of copper
JP2007115993A (en) * 2005-10-21 2007-05-10 Sumitomo Bakelite Co Ltd Printed wiring board, its production method and multilayered printed wiring board
JP2007207812A (en) * 2006-01-31 2007-08-16 Nikko Kinzoku Kk Copper foil for printed wiring board and printed wiring board using the same
JP2012094918A (en) * 2003-04-30 2012-05-17 Mec Kk To-resin adhesive layer on surface of copper, wiring board, and method for forming adhesive layer

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800930A (en) * 1994-01-21 1998-09-01 Olin Corporation Nodular copper/nickel alloy treatment for copper foil
WO1996017503A1 (en) * 1994-12-01 1996-06-06 Ibiden Co., Ltd. Multilayer printed wiring board and process for producing the same
US5827604A (en) * 1994-12-01 1998-10-27 Ibiden Co., Ltd. Multilayer printed circuit board and method of producing the same
EP0743812A4 (en) * 1994-12-01 1999-05-06 Ibiden Co Ltd Multilayer printed wiring board and process for producing the same
US6544664B1 (en) 1999-05-25 2003-04-08 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board
JP2001168481A (en) * 1999-12-08 2001-06-22 Ibiden Co Ltd Copper-clad laminate, and circuit substrate for printed wiring board and manufacturing method therefor
JP4486196B2 (en) * 1999-12-08 2010-06-23 イビデン株式会社 Single-sided circuit board and a manufacturing method thereof for a multilayer printed circuit board
JP2002176242A (en) * 2000-12-05 2002-06-21 Nikko Materials Co Ltd Copper foil for electronic circuit and method for forming electronic circuit
JP2004349693A (en) * 2003-04-30 2004-12-09 Mec Kk Resin adhesive layer on surface of copper
JP2012094918A (en) * 2003-04-30 2012-05-17 Mec Kk To-resin adhesive layer on surface of copper, wiring board, and method for forming adhesive layer
JP2007115993A (en) * 2005-10-21 2007-05-10 Sumitomo Bakelite Co Ltd Printed wiring board, its production method and multilayered printed wiring board
JP2007207812A (en) * 2006-01-31 2007-08-16 Nikko Kinzoku Kk Copper foil for printed wiring board and printed wiring board using the same
JP4683640B2 (en) * 2006-01-31 2011-05-18 Jx日鉱日石金属株式会社 Copper foil for printed circuit board and the printed wiring board using the same

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