JP2007115993A - Printed wiring board, its production method and multilayered printed wiring board - Google Patents
Printed wiring board, its production method and multilayered printed wiring board Download PDFInfo
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Abstract
Description
本発明は、プリント配線板、プリント配線板の製造方法及び多層プリント配線板に関するものである。 The present invention relates to a printed wiring board, a method for manufacturing a printed wiring board, and a multilayer printed wiring board.
従来、プリント配線板の製造方法として、回路形成された内層回路板に絶縁接着層としてガラスクロスにエポキシ樹脂を含浸しＢステージ化したプリプレグシートを数枚介して銅箔と積層プレスし、スルーホールによって層間導通をとる方法が知られている。 Conventionally, as a printed wiring board manufacturing method, an inner layer circuit board on which a circuit is formed is laminated and pressed with a copper foil through several prepreg sheets impregnated with epoxy resin in a glass cloth as an insulating adhesive layer and made into a B-stage. There is known a method for establishing interlayer conduction.
しかし、この方法では積層プレスにて加熱、加圧成形を行うため大掛かりな設備と長時間を要しコスト高となる上、外層にスルーホールめっきが入るため銅厚が厚くなり微細回路の形成が困難となるなどの問題を抱えていた。 However, in this method, heating and pressure forming are performed with a laminating press, which requires a large amount of equipment and a long time, which leads to high costs, and through-hole plating on the outer layer increases the thickness of the copper, resulting in the formation of fine circuits. We had problems such as becoming difficult.
このような問題を解決する方法として、近年内層回路板上に導体層と有機絶縁体層とを交互に積み上げていくビルドアップ方式の多層プリント配線板の製造技術が注目されている。ビルドアップ方式の多層プリント配線板では、絶縁体層上に回路導体を形成する必要があるが、金属からなる無電解めっきと有機物からなる絶縁体層の間には化学結合が形成されず密着性不十分となることが多い。このため、プリント配線板として要求される高信頼性を達成するためには、回路導体と絶縁体層との密着性改善が課題であった。エポキシ樹脂組成物からなる層間絶縁体層を、加熱硬化後、粗化剤により表面に凸凹の粗化面を形成し、回路導体をめっきにより形成する多層プリント配線板の製造法が開示されている（例えば、特許文献１参照）。また、ポリフェニレンエーテル樹脂組成物からなる層間絶縁体層を、粗化剤により表面に凹凸を形成し、回路導体をめっきにより形成する多層プリント配線板の製造法が開示されている（例えば、特許文献２参照）。これらはいずれも、表面処理により絶縁体層表面に凹凸をつけ、めっきにより形成される回路導体との密着性を確保している。 In recent years, as a method for solving such a problem, a manufacturing technique of a build-up type multilayer printed wiring board in which a conductor layer and an organic insulator layer are alternately stacked on an inner circuit board has attracted attention. Build-up multilayer printed wiring boards require circuit conductors to be formed on the insulator layer, but there is no adhesion between the electroless plating made of metal and the insulator layer made of organic matter. Often insufficient. For this reason, in order to achieve the high reliability requested | required as a printed wiring board, the adhesive improvement of a circuit conductor and an insulator layer was a subject. A method for producing a multilayer printed wiring board is disclosed in which an interlayer insulating layer made of an epoxy resin composition is heat-cured, a roughened surface is formed on the surface with a roughening agent, and a circuit conductor is formed by plating. (For example, refer to Patent Document 1). Also disclosed is a method for producing a multilayer printed wiring board in which an interlayer insulator layer made of a polyphenylene ether resin composition is formed with irregularities on the surface with a roughening agent, and a circuit conductor is formed by plating (for example, Patent Documents). 2). In any of these, the surface of the insulator layer is made uneven by surface treatment to ensure adhesion with a circuit conductor formed by plating.
しかしながら、絶縁体層に含有される成分の種類によって、絶縁体層の下層に回路導体を有する部位と絶縁体層の下層に回路導体を有さない部位において、表面処理により得られる絶縁体層の凹凸形成効果が異なるという現象が起こる場合があった。 However, depending on the type of components contained in the insulator layer, the insulator layer obtained by surface treatment in the part having the circuit conductor in the lower layer of the insulator layer and the part having no circuit conductor in the lower layer of the insulator layer In some cases, the unevenness forming effect is different.
絶縁体層の下層に回路導体を有する部位と絶縁体層の下層に回路導体を有しない部位において、絶縁体層の凹凸形成効果が異なるという現象は、絶縁体層と回路導体との密着の不均一性として顕在化する。この問題は、多層プリント配線板が回路導体と絶縁体層からなる繰り返し構造を有するため、解決を避けて通れない問題である。 The phenomenon that the effect of forming the unevenness of the insulator layer differs between the part having the circuit conductor below the insulator layer and the part not having the circuit conductor below the insulator layer is a phenomenon in which the insulation between the insulator layer and the circuit conductor is poor. It manifests as uniformity. This problem is a problem that cannot be solved because the multilayer printed wiring board has a repeated structure composed of circuit conductors and insulator layers.
本発明の目的は、絶縁体層の下層にある回路導体の影響を受けずに絶縁体層と回路導体との密着性を均一にするプリント配線板及びその製造方法を提供することである。
An object of the present invention is to provide a printed wiring board and a method for manufacturing the same, in which the adhesion between the insulator layer and the circuit conductor is made uniform without being affected by the circuit conductor under the insulator layer.
本発明は、［１］〜［８］により達成される。
［１］表面に第一回路導体が形成された第一絶縁体層の第一回路導体形成面側に第二絶縁体層を有するプリント配線板であって、該第一回路導体の表面に不活性導体皮膜を有することを特徴とするプリント配線板。
［２］表面に第一回路導体が形成された第一絶縁体層の第一回路導体形成面側に第二絶縁体層を有するプリント配線板であって、該第一回路導体が不活性導体皮膜であることを特徴とするプリント配線板。
［３］前記不活性導体皮膜は、０．１μｍ以上３０μｍ以下の厚みである第［１］又は［２］項に記載のプリント配線板。
［４］前記第二絶縁体層の表面が粗化された第［１］から［３］項のいずれか１項に記載のプリント配線板。
［５］前記第二絶縁体層がシアネート樹脂、フェノール樹脂及び硬化促進剤を必須成分とする樹脂組成物である第［１］から［４］のいずれか１項に記載のプリント配線板。
［６］さらに、第二絶縁体層に第二回路導体を形成した第［１］から［５］項のいずれか１項に記載のプリント配線板。
［７］多層プリント配線板の層構成のうち少なくとも一組が、第［１］から［６］のいずれか１項に記載のプリント配線板を有する多層プリント配線板。
［８］第一回路導体の表面に不活性導体皮膜を形成する不活性導体皮膜形成工程と、さらに第一回路導体が形成された第一絶縁体層の第一回路導体形成面側に形成された第二絶縁体層の表面を粗化する表面処理工程を含むことを特徴とするプリント配線板の製造方法。
The present invention is achieved by [1] to [8].
[1] A printed wiring board having a second insulator layer on the first circuit conductor forming surface side of the first insulator layer having the first circuit conductor formed on the surface, the printed circuit board having no surface on the surface of the first circuit conductor. A printed wiring board comprising an active conductor film.
[2] A printed wiring board having a second insulator layer on the first circuit conductor forming surface side of the first insulator layer having the first circuit conductor formed on the surface, the first circuit conductor being an inactive conductor A printed wiring board characterized by being a film.
[3] The printed wiring board according to item [1] or [2], wherein the inert conductive film has a thickness of 0.1 μm or more and 30 μm or less.
[4] The printed wiring board according to any one of [1] to [3], wherein the surface of the second insulator layer is roughened.
[5] The printed wiring board according to any one of [1] to [4], wherein the second insulator layer is a resin composition containing a cyanate resin, a phenol resin, and a curing accelerator as essential components.
[6] The printed wiring board according to any one of [1] to [5], wherein a second circuit conductor is further formed on the second insulator layer.
[7] A multilayer printed wiring board in which at least one of the layer configurations of the multilayer printed wiring board has the printed wiring board according to any one of [1] to [6].
[8] An inactive conductor film forming step for forming an inactive conductor film on the surface of the first circuit conductor, and further, formed on the first circuit conductor forming surface side of the first insulator layer on which the first circuit conductor is formed. A method of manufacturing a printed wiring board comprising a surface treatment step of roughening the surface of the second insulator layer.
本発明のプリント配線板、すなわち、表面に第一回路導体が形成された第一絶縁体層の第一回路導体形成面側に第二絶縁体層を有するプリント配線板であって該第一の回路導体の表面に形成された不活性導体皮膜を有するプリント配線板は、第二絶縁体層の下層にある第一回路導体の影響を受けずに第二絶縁体層と第二回路導体との密着性を均一にするため、配線の高密度化に対応でき、信頼性の高いプリント配線板として使用することができる。 The printed wiring board of the present invention, that is, the printed wiring board having a second insulator layer on the first circuit conductor forming surface side of the first insulator layer having the first circuit conductor formed on the surface, The printed wiring board having the inactive conductor film formed on the surface of the circuit conductor is not affected by the first circuit conductor under the second insulator layer, and is not affected by the second insulator layer and the second circuit conductor. In order to make the adhesiveness uniform, it is possible to cope with a high density of wiring, and it can be used as a highly reliable printed wiring board.
本発明の第一絶縁体層及び第二絶縁体層としては、ポリプロピレン，ポリエチレン，エチレンプロピレンゴムあるいはこれらの共重合物又は混合物、ポリエチレンテレフタレート，エチレンプロピレンゴム又はこれを含有する共重合物、ポリメチルペンテン，ポリアセタール，ポリカーボネート，アクリロニトリルブタジエンサルファイド，スチレンブタジエン共重合体，ポリイミド，ポリフェニレンサルフィド，液晶ポリマー（ＬＣＰ），ポリエーテルエーテルケトン，ナイロン、エポキシなどの樹脂、シアネート樹脂、フェノール樹脂などを使用できる。これらの中でも、シアネート樹脂、フェノール樹脂の組み合わせからなる樹脂組成物は、高耐熱かつ低熱膨張である上に、架橋密度をコントロールすることにより、金属と樹脂との密着性を向上も期待できる。
第一絶縁体層及び第二絶縁体層は、ナフテン酸亜鉛、ナフテン酸コバルト、オクチル酸スズ、オクチル酸コバルト、ビスアセチルアセトナートコバルト（II）、トリスアセチルアセトナートコバルト（III）等の有機金属塩、トリエチルアミン、トリブチルアミン、ジアザビシクロ［２，２，２］オクタン等の３級アミン類、２−フェニル−４−メチルイミダゾール、２−エチル−４−エチルイミダゾール、２−フェニル−４−メチル−５−ヒドロキシイミダゾール、２−フェニル−４，５−ジヒドロキシイミダゾール等のイミダゾール類、フェノール、ビスフェノールＡ、ノニルフェノール等のフェノール化合物、酢酸、安息香酸、サリチル酸、パラトルエンスルホン酸等の有機酸等の硬化促進剤を含有してもよい。
第一絶縁体層及び第二絶縁体層は、充填材として、タルク、アルミナ、ガラス、シリカ、マイカ、アラミド、ポリエステル、芳香族ポリエステル、フッ素樹脂等を含有してもよい。充填材の形状は、破砕状、球状、織布状、不織布状、繊維状などがある。これらの中でも、ガラス織布、シリカ粒子、及びそれらの組み合わせは低熱膨張性及び剛性向上に優れる点で好ましい。
プリント配線板に用いられる第一絶縁体層及び第二絶縁体層は、上記構成のものであれば特に限定されるものではなく、同一であっても異なっていてもよい。
The first insulator layer and the second insulator layer of the present invention include polypropylene, polyethylene, ethylene propylene rubber or a copolymer or mixture thereof, polyethylene terephthalate, ethylene propylene rubber or a copolymer containing the same, polymethyl Pentene, polyacetal, polycarbonate, acrylonitrile butadiene sulfide, styrene butadiene copolymer, polyimide, polyphenylene sulfide, liquid crystal polymer (LCP), polyether ether ketone, nylon, epoxy resin, cyanate resin, phenol resin, and the like can be used. Among these, a resin composition comprising a combination of a cyanate resin and a phenol resin has high heat resistance and low thermal expansion, and can also be expected to improve the adhesion between the metal and the resin by controlling the crosslinking density.
The first insulator layer and the second insulator layer are organic metals such as zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III), etc. Salt, triethylamine, tributylamine, tertiary amines such as diazabicyclo [2,2,2] octane, 2-phenyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, 2-phenyl-4-methyl-5 -Curing accelerators such as imidazoles such as hydroxyimidazole and 2-phenyl-4,5-dihydroxyimidazole, phenolic compounds such as phenol, bisphenol A and nonylphenol, and organic acids such as acetic acid, benzoic acid, salicylic acid and paratoluenesulfonic acid It may contain.
The first insulator layer and the second insulator layer may contain talc, alumina, glass, silica, mica, aramid, polyester, aromatic polyester, fluororesin and the like as a filler. The shape of the filler includes a crushed shape, a spherical shape, a woven fabric shape, a non-woven fabric shape, and a fibrous shape. Among these, glass woven fabric, silica particles, and combinations thereof are preferable in that they are excellent in low thermal expansion and improved rigidity.
The first insulator layer and the second insulator layer used in the printed wiring board are not particularly limited as long as they have the above-described configuration, and may be the same or different.
本発明の第一回路導体及び第二回路導体の形成には、無電解めっき処理、電解めっき処理、スパッタリングなどの方法が使用できる。第一回路導体及び第二回路導体としては、銅、ニッケル、金、チタン、白金、タングステン、アルミニウム、コバルト、クロム、銀、鉛、亜鉛、ニッケル鉄合金などを使用することができる。第一回路導体及び第二回路導体として、後述の不活性導体皮膜と同種の成分を選択した場合は、第一回路導体及び第二回路導体自体が不活性導体皮膜の効果を備えるため、敢えて不活性導体皮膜を表面に形成する必要はない。第一回路導体及び第二回路導体の表面は表面処理によって粗化されていてもよい。 For forming the first circuit conductor and the second circuit conductor of the present invention, methods such as electroless plating, electrolytic plating, and sputtering can be used. As the first circuit conductor and the second circuit conductor, copper, nickel, gold, titanium, platinum, tungsten, aluminum, cobalt, chromium, silver, lead, zinc, nickel-iron alloy, or the like can be used. If the same type of components as the inactive conductor film described later are selected as the first circuit conductor and the second circuit conductor, the first circuit conductor and the second circuit conductor themselves have the effect of the inactive conductor film. It is not necessary to form an active conductor film on the surface. The surfaces of the first circuit conductor and the second circuit conductor may be roughened by a surface treatment.
本発明の第一回路導体は、前記第一絶縁体層及び銅からなる銅張板を使用し、エッチングにより形成することができる。例えば、ガラスエポキシ基板、ポリエステル基板、ポリイミド基板、ＢＴレジン基板、熱硬化型ポリフェニレンエーテル基板等の銅張板を使用することができる。 The first circuit conductor of the present invention can be formed by etching using a copper-clad plate made of the first insulator layer and copper. For example, a copper-clad plate such as a glass epoxy substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, or a thermosetting polyphenylene ether substrate can be used.
本発明に用いる不活性導体皮膜は、ニッケル、金、スズ、コバルト、チタン、アルミニウム、亜鉛、鉛などの金属、又は、これらの金属の組み合わせからなる合金が好適である。これらの不活性導体皮膜を用いた第一回路導体では、第二絶縁体層の下層にある第一回路導体の有無にかかわらず第二絶縁体層表面の凹凸がなくなり均一な表面となる。
本発明に用いる不活性導体皮膜は、電解めっき、無電解めっき、スパッタリングなどの方法により形成することができるが、電解めっき法では回路導体を給電層とすることにより、回路導体に選択的に形成できるため、低コストである。
不活性導体皮膜の厚みは、０．１μｍ以上であれば、本発明の効果を得るために制限されることはないが、０．１μｍ以上３０μｍ以下が望ましい。０．１μｍ以下では、発明の効果が十分に発現しない場合がある。３０μｍ以上では、回路が厚くなり製品としてのプリント配線板の薄型化に支障をきたす場合がある。
不活性導体皮膜は、プラズマ処理やエッチング処理などの表面処理を施されていてもよい。
The inert conductor film used in the present invention is preferably a metal such as nickel, gold, tin, cobalt, titanium, aluminum, zinc, lead, or an alloy made of a combination of these metals. In the first circuit conductor using these inactive conductor films, the unevenness of the surface of the second insulator layer is eliminated and the surface is uniform regardless of the presence or absence of the first circuit conductor in the lower layer of the second insulator layer.
The inactive conductor film used in the present invention can be formed by methods such as electrolytic plating, electroless plating, sputtering, etc., but in the electroplating method, the circuit conductor is used as a power feeding layer to selectively form the circuit conductor. Because it can, it is low cost.
The thickness of the inactive conductor film is not limited as long as it is 0.1 μm or more, but is preferably 0.1 μm or more and 30 μm or less. If the thickness is 0.1 μm or less, the effects of the invention may not be sufficiently exhibited. If it is 30 μm or more, the circuit becomes thick, which may hinder the thinning of the printed wiring board as a product.
The inert conductor film may be subjected to surface treatment such as plasma treatment or etching treatment.
次に、本発明の不活性導体皮膜を用いたプリント配線板の製造方法について説明する。
まず、第一絶縁体層の表面に形成された第一回路導体を有する内層回路基板の回路上に電解めっき、無電解めっき、スパッタリングなどにより、不活性導体皮膜を形成する。不活性導体皮膜としては、ニッケル、金、スズなどを使用することができる。
Next, the manufacturing method of the printed wiring board using the inert conductor membrane | film | coat of this invention is demonstrated.
First, an inactive conductor film is formed by electrolytic plating, electroless plating, sputtering or the like on the circuit of the inner circuit board having the first circuit conductor formed on the surface of the first insulator layer. As the inert conductor film, nickel, gold, tin, or the like can be used.
前記不活性導体皮膜を形成した内層回路基板上に第二絶縁体層を形成する。具体的には、第二絶縁体層として、樹脂組成物からなる接着フィルムを用い、加圧、過熱条件下で基板上にラミネートし加熱硬化させる。他にも、インキ状の樹脂組成物を、溶剤成分揮発及び熱硬化させて絶縁体層とする方法がある。
その後、必要に応じて所定のスルーホール、ビアホール部等にドリル及び／又はレーザー、プラズマにより穴あけを行う。
A second insulator layer is formed on the inner layer circuit board on which the inactive conductor film is formed. Specifically, an adhesive film made of a resin composition is used as the second insulator layer, which is laminated on a substrate under pressure and overheating conditions and cured by heating. In addition, there is a method in which an ink-like resin composition is volatilized and thermally cured to form an insulator layer.
Thereafter, drilling is performed in a predetermined through hole, via hole portion or the like by drill and / or laser or plasma as necessary.
次に、過マンガン酸塩、重クロム酸塩、過酸化水素硫酸混合液、硝酸等の酸化剤により、第二絶縁体層の表面を粗化処理する。前記不活性導体皮膜を形成することにより、この粗化処理工程において、第二絶縁体層の下層にある第一回路導体に依存しない均一な凹凸を表面に有する第二絶縁体層を得ることが可能となる。均一な凹凸を表面に有する第二絶縁体層は、次の第二回路導体の形成工程において、第二絶縁体層との密着性に優れた第二回路導体を形成することができる。 Next, the surface of the second insulator layer is roughened with an oxidizing agent such as permanganate, dichromate, hydrogen peroxide-sulfuric acid mixture, or nitric acid. By forming the inert conductor film, in this roughening treatment step, a second insulator layer having uniform irregularities on the surface that does not depend on the first circuit conductor in the lower layer of the second insulator layer can be obtained. It becomes possible. The second insulator layer having uniform unevenness on the surface can form a second circuit conductor excellent in adhesion to the second insulator layer in the next step of forming the second circuit conductor.
上記粗化された第二絶縁体層上に第二回路導体を形成する。第二回路導体の作製方法は特に制限しないが、具体的には、無電解めっき又はスパッタリングにより形成し、その上にラミネート形成したフォトレジストを露光、現像した後、レジスト開口部に電解めっきし、最後に不要となった給電層をエッチングにより除去する、いわゆる、セミアディティブ工法を使用できる。他にも、無電解めっき又はスパッタリングにより形成し、電解パネルめっき法により全面を増膜させた後、ラミネート形成したフォトレジストを露光、現像し、回路導体をエッチングにより形成する、いわゆる、サブトラクティブ工法を使用することができる。 A second circuit conductor is formed on the roughened second insulator layer. The method for producing the second circuit conductor is not particularly limited. Specifically, the photoresist formed by electroless plating or sputtering is exposed and developed, and then electroplated on the resist opening, Finally, a so-called semi-additive construction method can be used in which the power feeding layer that has become unnecessary is removed by etching. In addition, the so-called subtractive method is formed by forming by electroless plating or sputtering, increasing the entire surface by electrolytic panel plating, then exposing and developing the laminated photoresist, and forming circuit conductors by etching. Can be used.
上述の工程で得られた第二回路導体上に電解めっき、無電解めっき、スパッタリングなどにより、不活性導体皮膜を形成することにより、プリント配線板を作製する。さらに前述のとおりの方法を繰り返すことにより、多層にわたって下層の回路導体に依存せずに、絶縁体層／回路導体の優れた密着性を有する多層プリント配線板を得ることができる。また、最外層にはソルダーレジストなどで絶縁することも可能である。 A printed wiring board is produced by forming an inactive conductor film on the second circuit conductor obtained in the above-described process by electrolytic plating, electroless plating, sputtering, or the like. Furthermore, by repeating the method as described above, it is possible to obtain a multilayer printed wiring board having excellent adhesion of the insulator layer / circuit conductor without depending on the lower layer circuit conductor over multiple layers. In addition, the outermost layer can be insulated with a solder resist or the like.
以下、実施例により更に具体的に説明するが、本発明を何ら限定するものではない。 Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.
［実施例１］
銅箔１８μｍを両面に有する銅張板（住友ベークライト（株）製 ＥＬＣ４７８５−ＧＳ）を所定の回路にエッチングすることにより銅からなる第一回路導体を得た後、電解めっきにより、銅回路上に不活性導体皮膜として金を厚み１μｍで形成したコア基板を得た。ここで得られたコア基板に厚み４０μｍの第二絶縁体層（住友ベークライト（株）製 ＡＰＬ３６０１）をラミネート装置（（株）名機製作所製 ＭＶＬＰ−５００／６００−IIＡ）にてラミネートした。第二絶縁体層の硬化を目的として、１７０℃で４５分の熱処理を行った。
[Example 1]
After obtaining a first circuit conductor made of copper by etching a copper clad plate (ELC4785-GS, manufactured by Sumitomo Bakelite Co., Ltd.) having a copper foil of 18 μm on both sides into a predetermined circuit, it is formed on the copper circuit by electrolytic plating. A core substrate in which gold was formed with a thickness of 1 μm as an inert conductor film was obtained. A second insulating layer (APL3601 manufactured by Sumitomo Bakelite Co., Ltd.) having a thickness of 40 μm was laminated on the core substrate obtained here by a laminating apparatus (MVLP-500 / 600-IIA manufactured by Meiki Seisakusho Co., Ltd.). For the purpose of curing the second insulator layer, a heat treatment was performed at 170 ° C. for 45 minutes.
次いで、第二絶縁体層の表面を粗化処理することを目的として、モノエチルブチルアルコール・過マンガン酸ナトリウム・硫酸（（株）ロームアンドハース電子材料製 ＭＬＢ２００シリーズ）により処理した。処理条件は、８０℃／１０ｍｉｎ、８０℃／２０ｍｉｎ、４０℃／５ｍｉｎで処理を行った。第二絶縁体層の下層に銅からなる第一回路導体及び金を有するプリント配線板を得た。 Next, for the purpose of roughening the surface of the second insulator layer, it was treated with monoethylbutyl alcohol, sodium permanganate, sulfuric acid (MLB200 series, manufactured by Rohm and Haas Electronic Materials). Processing conditions were 80 ° C./10 min, 80 ° C./20 min, and 40 ° C./5 min. A printed wiring board having a first circuit conductor made of copper and gold in the lower layer of the second insulator layer was obtained.
［実施例２］
銅箔１８μｍを両面に有する銅張板（住友ベークライト（株）製 ＥＬＣ４７８５−ＧＳ）をハーフエッチングにより銅厚２μｍとした後、電解めっきにより、銅上に不活性導体皮膜としてニッケルを厚み２５μｍで回路形成した。この後、ニッケルに覆われていない不要な銅をエッチングにより除去しコア基板を得た。こうして得られたコア基板に厚み４０μｍの第二絶縁体層（住友ベークライト（株）製 ＡＰＬ３６０１）をラミネート装置（（株）名機製作所製 ＭＶＬＰ−５００／６００−IIＡ）にてラミネートした。第二絶縁体層の硬化を目的として、１７０℃で４５分の熱処理を行った。
[Example 2]
A copper-clad plate (ELC4785-GS manufactured by Sumitomo Bakelite Co., Ltd.) having a copper foil of 18 μm on both sides is made to have a copper thickness of 2 μm by half-etching, and then nickel is formed as an inert conductor film on the copper with a thickness of 25 μm by electrolytic plating. Formed. Thereafter, unnecessary copper not covered with nickel was removed by etching to obtain a core substrate. A second insulator layer (APL3601 manufactured by Sumitomo Bakelite Co., Ltd.) having a thickness of 40 μm was laminated on the core substrate thus obtained by a laminating apparatus (MVLP-500 / 600-IIA manufactured by Meiki Seisakusho Co., Ltd.). For the purpose of curing the second insulator layer, a heat treatment was performed at 170 ° C. for 45 minutes.
次いで、第二絶縁体層の表面を粗化処理することを目的として、モノエチルブチルアルコール・過マンガン酸ナトリウム・硫酸（（株）ロームアンドハース電子材料製 ＭＬＢ２００シリーズ）により処理した。処理条件は、８０℃／１０ｍｉｎ、８０℃／２０ｍｉｎ、４０℃／５ｍｉｎで処理を行った。銅とニッケルからなる回路導体と不活性導体皮膜とを有するプリント配線板を得た。 Next, for the purpose of roughening the surface of the second insulator layer, it was treated with monoethylbutyl alcohol, sodium permanganate, sulfuric acid (MLB200 series, manufactured by Rohm and Haas Electronic Materials). Processing conditions were 80 ° C./10 min, 80 ° C./20 min, and 40 ° C./5 min. A printed wiring board having a circuit conductor made of copper and nickel and an inert conductor film was obtained.
［比較例１］
銅箔１８μｍを両面に有する銅張板（住友ベークライト（株）製 ＥＬＣ４７８５−ＧＳ）を所定の回路にエッチングすることにより銅からなる第一回路導体を有するコア基板を得た。ここで得られたコア基板に厚み４０μｍの第二絶縁体層（住友ベークライト（株）製 ＡＰＬ３６０１）をラミネート装置（（株）名機製作所製 ＭＶＬＰ−５００／６００−IIＡ）にてラミネートした。第二絶縁体層の硬化を目的として、１７０℃で４５分の熱処理を行った。
[Comparative Example 1]
A core board having a first circuit conductor made of copper was obtained by etching a copper clad plate (ELC4785-GS manufactured by Sumitomo Bakelite Co., Ltd.) having a copper foil of 18 μm on both sides into a predetermined circuit. A second insulating layer (APL3601 manufactured by Sumitomo Bakelite Co., Ltd.) having a thickness of 40 μm was laminated on the core substrate obtained here by a laminating apparatus (MVLP-500 / 600-IIA manufactured by Meiki Seisakusho Co., Ltd.). For the purpose of curing the second insulator layer, a heat treatment was performed at 170 ° C. for 45 minutes.
次いで、第二絶縁体層の表面を粗化処理することを目的として、モノエチルブチルアルコール・過マンガン酸ナトリウム・硫酸（（株）ロームアンドハース電子材料製 ＭＬＢ２００シリーズ）により処理した。処理条件は、８０℃／１０ｍｉｎ、８０℃／２０ｍｉｎ、４０℃／５ｍｉｎで処理を行った。銅からなる回路導体を有するプリント配線板を得た。 Next, for the purpose of roughening the surface of the second insulator layer, it was treated with monoethylbutyl alcohol, sodium permanganate, sulfuric acid (MLB200 series, manufactured by Rohm and Haas Electronic Materials). Processing conditions were 80 ° C./10 min, 80 ° C./20 min, and 40 ° C./5 min. A printed wiring board having a circuit conductor made of copper was obtained.
上述で得られたプリント配線板の第二絶縁体層表面をＳＥＭ観察した。さらにピール強度評価及び表面粗度測定を行った。評価方法及び評価結果を、次に述べる。 The surface of the second insulator layer of the printed wiring board obtained above was observed with an SEM. Further, peel strength evaluation and surface roughness measurement were performed. The evaluation method and evaluation results are described below.
＜ＳＥＭ観察＞
上記で得られたプリント配線板の第二絶縁体層表面を、下層に第一回路導体を有する部位、下層に第一回路導体を有しない部位について走査型電子顕微鏡（倍率１０００倍）により観察した。下層の第一回路導体の有無にかかわらず第二絶縁体層表面が均一なものを○、均一でないものを×とした。
<SEM observation>
The surface of the second insulator layer of the printed wiring board obtained above was observed with a scanning electron microscope (magnification 1000 times) for the part having the first circuit conductor in the lower layer and the part not having the first circuit conductor in the lower layer. . A case where the surface of the second insulator layer was uniform irrespective of the presence or absence of the first circuit conductor in the lower layer was marked with ◯, and a case where the surface was not uniform was marked with ×.
＜ピール強度評価＞
上記で得られたプリント配線板の第二絶縁体層に無電解銅めっき処理（（株）アトテック製 プリントガントＭＳＫ−ＤＫシリーズ）した後、１５０℃、３０分の熱処理を行った。続いて、無電解銅めっきを給電層として電解めっき処理により厚み２５μｍの銅を形成した後、２００℃、１時間の熱処理を行い、ピール強度評価用基板を得た。ピール強度評価用基板の銅を引き剥がし幅１ｃｍ、垂直引き上げ速度５０ｍｍ／ｍｉｎでピール強度測定を行った。
<Peel strength evaluation>
The second insulating layer of the printed wiring board obtained above was subjected to an electroless copper plating process (print Gantt MSK-DK series, manufactured by Atotech Co., Ltd.), followed by heat treatment at 150 ° C. for 30 minutes. Subsequently, copper having a thickness of 25 μm was formed by electroplating using electroless copper plating as a power feeding layer, and then heat treatment was performed at 200 ° C. for 1 hour to obtain a peel strength evaluation substrate. The peel strength was measured at a peel strength of 1 cm and a vertical pulling speed of 50 mm / min.
＜表面粗度測定＞
上記で得られたプリント配線板の第二絶縁体層表面の算術平均線粗さを、共焦点レーザー顕微鏡（（株）キーエンス製）により、第二絶縁体層の下層に第一回路導体を有する部位、第二絶縁体層の下層に第一回路導体を有しない部位について測定し、表面粗さとした。
<Surface roughness measurement>
Arithmetic mean line roughness of the surface of the second insulating layer of the printed wiring board obtained above is measured by a confocal laser microscope (manufactured by Keyence Co., Ltd.) and has a first circuit conductor under the second insulating layer. The surface roughness was measured by measuring the site and the site not having the first circuit conductor in the lower layer of the second insulator layer.
以上の評価結果から分かるように、本発明のプリント配線板において、第二絶縁体層の下層にある第一回路導体の有無に影響されない第二絶縁体層の粗化形状、銅回路の密着性が達成できる。 As can be seen from the above evaluation results, in the printed wiring board of the present invention, the rough shape of the second insulator layer, which is not affected by the presence or absence of the first circuit conductor in the lower layer of the second insulator layer, the adhesion of the copper circuit Can be achieved.
本発明により、絶縁体層の下層にある回路導体の影響を受けずに、絶縁体層と回路導体との密着性を均一にするプリント配線板を製造することができる。 According to the present invention, it is possible to manufacture a printed wiring board that makes the adhesion between the insulator layer and the circuit conductor uniform without being influenced by the circuit conductor under the insulator layer.
１０１ 第一絶縁体層
１０２ 第一回路導体
１０３ 不活性導体皮膜
１０４ 第二絶縁体層
101
Claims (8)
Formed on the first circuit conductor forming surface side of the first insulator layer in which the first circuit conductor is formed on the surface, and the inert conductor film forming step of forming the inert conductor film on the surface of the first circuit conductor A method for producing a printed wiring board comprising a surface treatment step of roughening a surface of a second insulator layer.
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| JP2005307633A JP5116231B2 (en) | 2005-10-21 | 2005-10-21 | Printed wiring board, method for manufacturing printed wiring board, and multilayer printed wiring board |
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| JP2005307633A JP5116231B2 (en) | 2005-10-21 | 2005-10-21 | Printed wiring board, method for manufacturing printed wiring board, and multilayer printed wiring board |
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| JP5116231B2 JP5116231B2 (en) | 2013-01-09 |
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| JP7175166B2 (en) | 2018-11-16 | 2022-11-18 | 信越ポリマー株式会社 | Wiring sheet and its manufacturing method |
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|---|---|
| JP5116231B2 (en) | 2013-01-09 |
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