JP4073174B2 - 中性粒子ビーム処理装置 - Google Patents
中性粒子ビーム処理装置 Download PDFInfo
- Publication number
- JP4073174B2 JP4073174B2 JP2001088863A JP2001088863A JP4073174B2 JP 4073174 B2 JP4073174 B2 JP 4073174B2 JP 2001088863 A JP2001088863 A JP 2001088863A JP 2001088863 A JP2001088863 A JP 2001088863A JP 4073174 B2 JP4073174 B2 JP 4073174B2
- Authority
- JP
- Japan
- Prior art keywords
- orifice
- plasma
- electrode
- ions
- negative ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0822—Multiple sources
- H01J2237/0827—Multiple sources for producing different ions sequentially
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001088863A JP4073174B2 (ja) | 2001-03-26 | 2001-03-26 | 中性粒子ビーム処理装置 |
| PCT/JP2002/002749 WO2002078043A2 (en) | 2001-03-26 | 2002-03-22 | Beam processing apparatus |
| US10/471,610 US6849857B2 (en) | 2001-03-26 | 2002-03-22 | Beam processing apparatus |
| AU2002239025A AU2002239025A1 (en) | 2001-03-26 | 2002-03-22 | Beam processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001088863A JP4073174B2 (ja) | 2001-03-26 | 2001-03-26 | 中性粒子ビーム処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007326831A Division JP2008108745A (ja) | 2007-12-19 | 2007-12-19 | 中性粒子ビーム処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002289583A JP2002289583A (ja) | 2002-10-04 |
| JP2002289583A5 JP2002289583A5 (enExample) | 2004-12-24 |
| JP4073174B2 true JP4073174B2 (ja) | 2008-04-09 |
Family
ID=18943885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001088863A Expired - Fee Related JP4073174B2 (ja) | 2001-03-26 | 2001-03-26 | 中性粒子ビーム処理装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6849857B2 (enExample) |
| JP (1) | JP4073174B2 (enExample) |
| AU (1) | AU2002239025A1 (enExample) |
| WO (1) | WO2002078043A2 (enExample) |
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| US20070170867A1 (en) * | 2006-01-24 | 2007-07-26 | Varian Semiconductor Equipment Associates, Inc. | Plasma Immersion Ion Source With Low Effective Antenna Voltage |
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| JPS5742131A (en) * | 1980-08-27 | 1982-03-09 | Mitsubishi Electric Corp | Parallel flat board type dry etching device |
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| US5279669A (en) * | 1991-12-13 | 1994-01-18 | International Business Machines Corporation | Plasma reactor for processing substrates comprising means for inducing electron cyclotron resonance (ECR) and ion cyclotron resonance (ICR) conditions |
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| JPH09162169A (ja) * | 1995-12-05 | 1997-06-20 | Yasuhiro Horiike | プラズマ処理方法及びその装置 |
| US6051151A (en) * | 1997-11-12 | 2000-04-18 | International Business Machines Corporation | Apparatus and method of producing a negative ion plasma |
| JP3703332B2 (ja) * | 1998-07-22 | 2005-10-05 | キヤノン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP2000306894A (ja) * | 1999-04-23 | 2000-11-02 | Nec Corp | 基板のプラズマ処理方法 |
| JP3948857B2 (ja) | 1999-07-14 | 2007-07-25 | 株式会社荏原製作所 | ビーム源 |
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