JP4057589B2 - 電子部品搭載基板の製造方法 - Google Patents
電子部品搭載基板の製造方法 Download PDFInfo
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- JP4057589B2 JP4057589B2 JP2004569931A JP2004569931A JP4057589B2 JP 4057589 B2 JP4057589 B2 JP 4057589B2 JP 2004569931 A JP2004569931 A JP 2004569931A JP 2004569931 A JP2004569931 A JP 2004569931A JP 4057589 B2 JP4057589 B2 JP 4057589B2
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Description
本実施例のチップ搭載基板の作製においては、まず、コア基板を作製した。コア基板の作製においては、具体的には、コア材である42アロイ板(平面サイズ:150mm×150mm、厚さ:0.5mm)に対し、スペーサ材である電解銅箔(厚さ:70μm)を、中間層を構成する接着剤としてのエポキシ樹脂シート(商品名:ABF、味の素ファインテクノ製)を介して貼り付けた。42アロイは、Fe−42wt%Niの組成を有する。
Claims (4)
- コア層およびスペーサ層を含む積層構造を有するコア基板における前記スペーサ層上に、配線パターンおよび絶縁層よりなる積層構造を有し且つ前記スペーサ層に接する電極部を有するビルドアップ部を形成することにより、配線基板を作製するための工程と、
前記コア層に対して前記ビルドアップ部とは反対の側からエッチング処理を施すことにより、当該コア層における前記電極部に対応する箇所を除去するための工程と、
前記スペーサ層に対して前記ビルドアップ部とは反対の側からエッチング処理を施すことにより、前記電極部を露出させ、且つ、前記ビルドアップ部における電子部品搭載面上にスペーサを残存形成するための工程と、
バンプ電極を有する電子部品を、当該電子部品および前記ビルドアップ部の間に前記スペーサを介在させつつ前記バンプ電極および前記電極部を接合することにより、前記配線基板に搭載するための搭載工程と、を含む、電子部品搭載基板の製造方法。 - 前記バンプ電極はハンダ材料を含み、
前記搭載工程は、前記バンプ電極を有する前記電子部品を前記ハンダ材料の融点より高い第1温度に加熱し且つ前記電極部を有する前記配線基板を前記第1温度より低い第2温度に加熱するための昇温工程と、前記バンプ電極および前記電極部を当接させつつ前記配線基板に対して前記電子部品を押圧することによって当該バンプ電極および電極部を接合するための接合工程と、を含む、請求項1に記載の電子部品搭載基板の製造方法。 - 前記第2温度は、前記ハンダ材料の融点より低い、請求項2に記載の電子部品搭載基板の製造方法。
- 前記昇温工程の前に、前記バンプ電極に対してエチレングリコール、トリエチレングリコール、またはテトラエチレングリコールを付着させる工程を更に含む、請求項2または3に記載の電子部品搭載基板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2003/003661 WO2004086493A1 (ja) | 2003-03-25 | 2003-03-25 | 電子部品搭載基板の製造方法 |
Publications (2)
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JPWO2004086493A1 JPWO2004086493A1 (ja) | 2006-06-29 |
JP4057589B2 true JP4057589B2 (ja) | 2008-03-05 |
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JP2004569931A Expired - Fee Related JP4057589B2 (ja) | 2003-03-25 | 2003-03-25 | 電子部品搭載基板の製造方法 |
Country Status (6)
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US (1) | US7595228B2 (ja) |
JP (1) | JP4057589B2 (ja) |
CN (1) | CN100390951C (ja) |
AU (1) | AU2003221149A1 (ja) |
TW (1) | TW591765B (ja) |
WO (1) | WO2004086493A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8642894B2 (en) | 2009-02-02 | 2014-02-04 | Fujitsu Limited | Circuit board, method of manufacturing the same, and resistance element |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100633850B1 (ko) * | 2005-09-22 | 2006-10-16 | 삼성전기주식회사 | 캐비티가 형성된 기판 제조 방법 |
KR100717909B1 (ko) * | 2006-02-24 | 2007-05-14 | 삼성전기주식회사 | 니켈층을 포함하는 기판 및 이의 제조방법 |
TWI277190B (en) * | 2006-03-07 | 2007-03-21 | Ind Tech Res Inst | Package structure for electronic device |
TWI299554B (en) | 2006-06-21 | 2008-08-01 | Advanced Semiconductor Eng | Substrate structure and method for manufacturing the same |
JP5214139B2 (ja) * | 2006-12-04 | 2013-06-19 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
US20080241991A1 (en) * | 2007-03-26 | 2008-10-02 | National Semiconductor Corporation | Gang flipping for flip-chip packaging |
FR2917234B1 (fr) * | 2007-06-07 | 2009-11-06 | Commissariat Energie Atomique | Dispositif multi composants integres dans une matrice semi-conductrice. |
US8283756B2 (en) * | 2007-08-20 | 2012-10-09 | Infineon Technologies Ag | Electronic component with buffer layer |
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JPS58157146A (ja) | 1982-03-12 | 1983-09-19 | Fujitsu Ltd | 半導体装置 |
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JP3888943B2 (ja) * | 2002-04-12 | 2007-03-07 | イビデン株式会社 | 多層プリント配線板及び多層プリント配線板の製造方法 |
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2003
- 2003-03-25 AU AU2003221149A patent/AU2003221149A1/en not_active Abandoned
- 2003-03-25 CN CNB038262207A patent/CN100390951C/zh not_active Expired - Fee Related
- 2003-03-25 WO PCT/JP2003/003661 patent/WO2004086493A1/ja active Application Filing
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- 2003-03-28 TW TW092107132A patent/TW591765B/zh not_active IP Right Cessation
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US8642894B2 (en) | 2009-02-02 | 2014-02-04 | Fujitsu Limited | Circuit board, method of manufacturing the same, and resistance element |
Also Published As
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WO2004086493A1 (ja) | 2004-10-07 |
AU2003221149A1 (en) | 2004-10-18 |
TW200419737A (en) | 2004-10-01 |
US20060051895A1 (en) | 2006-03-09 |
JPWO2004086493A1 (ja) | 2006-06-29 |
CN1759477A (zh) | 2006-04-12 |
CN100390951C (zh) | 2008-05-28 |
US7595228B2 (en) | 2009-09-29 |
TW591765B (en) | 2004-06-11 |
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