JP6038035B2 - 印刷導電性表面にチップを取り付ける方法及び装置 - Google Patents
印刷導電性表面にチップを取り付ける方法及び装置 Download PDFInfo
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- JP6038035B2 JP6038035B2 JP2013533247A JP2013533247A JP6038035B2 JP 6038035 B2 JP6038035 B2 JP 6038035B2 JP 2013533247 A JP2013533247 A JP 2013533247A JP 2013533247 A JP2013533247 A JP 2013533247A JP 6038035 B2 JP6038035 B2 JP 6038035B2
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
−錫/銀(3.43%)/銅(0.83%)
−錫/銀(2%〜2.5%)/銅(0.8%)/アンチモン(0.5%〜0.6%)
−錫/銀(3.5%)/ビスマス(3.0%)
−錫/亜鉛(10%)
−錫/ビスマス(58%)
−錫/インジウム(52%)
−ビスマス(53%〜76%)/錫(22%〜35%)/インジウム(2%〜12%)
Claims (5)
- チップをプリンテッドエレクトロニクスによって基板上に形成された印刷導電性表面に取り付ける装置であって、
チップを、該チップが熱によって損傷することなく耐えることができる温度より低い第1の温度まで加熱するためのヒーターと、
前記加熱されたチップを前記印刷導電性表面に対して第1の押圧力によって押圧するためのアクチュエーターを具備し、
前記第1温度及び前記第1押圧力を、少なくとも前記印刷導電性表面の材料を少なくとも部分的に、かつ局所的に溶融するのに十分なように組み合わせて加えること、および
前記アクチュエーターは加熱ロールを備え、該加熱ロールは、前記チップに熱を伝達し、該加熱ロールと支持ロールとの間のニップにおいて前記チップを前記印刷導電性表面に対して押圧することを特徴とする装置。 - 前記アクチュエーターは、前記チップを抜き取り、該チップを前記印刷導電性表面上の所定位置に配置するためのマニピュレーターアームを備えることを特徴とする、請求項1に記載の装置。
- 前記ヒーターの少なくとも一部は、前記チップを抜き取る処理と前記印刷導電性表面上の前記所定位置に該チップを配置する処理との間で、該チップに熱を伝達するように、前記マニピュレーターアームに組み込まれていることを特徴とする、請求項2に記載の装置。
- 前記ヒーターの少なくとも一部は、前記マニピュレーターアームにより抜き取られるのを待機しているチップを加熱することを特徴とする、請求項2又は3に記載の装置。
- 前記印刷導電性表面を形成するために、
基板の表面に接着剤のパターンを印刷するように構成された印刷セクションと、
誘電体転写ロールと、
前記誘電体転写ロールの表面を帯電状態に維持するように構成された帯電装置と、
前記誘電体転写ロールの前記帯電した表面を導電性粒子の連続層によって一時的に覆うように構成された粒子アプリケーターと、
前記接着剤のパターンを有する前記基板の前記表面が、前記誘電体転写ロールの前記帯電した表面上の前記導電性粒子の連続層と接触するように配置されるセクションとを具備することを特徴とする、請求項1〜4のいずれか一項に記載の装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/FI2010/050797 WO2012049352A1 (en) | 2010-10-14 | 2010-10-14 | Method and arrangement for attaching a chip to a printed conductive surface |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013539921A JP2013539921A (ja) | 2013-10-28 |
JP6038035B2 true JP6038035B2 (ja) | 2016-12-07 |
Family
ID=45937939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013533247A Active JP6038035B2 (ja) | 2010-10-14 | 2010-10-14 | 印刷導電性表面にチップを取り付ける方法及び装置 |
Country Status (12)
Country | Link |
---|---|
US (2) | US9629255B2 (ja) |
EP (1) | EP2628370A4 (ja) |
JP (1) | JP6038035B2 (ja) |
KR (2) | KR101941679B1 (ja) |
CN (1) | CN103190206B (ja) |
AU (1) | AU2010362421B2 (ja) |
BR (1) | BR112013009147B8 (ja) |
CA (1) | CA2813538C (ja) |
MX (1) | MX2013004101A (ja) |
MY (1) | MY168368A (ja) |
RU (1) | RU2563971C2 (ja) |
WO (1) | WO2012049352A1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
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AU2010362421B2 (en) | 2010-10-14 | 2015-06-25 | Digital Tags Finland Oy | Method and arrangement for attaching a chip to a printed conductive surface |
US9105760B2 (en) * | 2011-11-07 | 2015-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pick-and-place tool for packaging process |
US9079351B2 (en) * | 2012-06-22 | 2015-07-14 | Wisconsin Alumni Research Foundation | System for transfer of nanomembrane elements with improved preservation of spatial integrity |
US9776270B2 (en) * | 2013-10-01 | 2017-10-03 | Globalfoundries Inc. | Chip joining by induction heating |
US11133866B2 (en) | 2014-02-25 | 2021-09-28 | Pharmaseq, Inc. | All optical identification and sensor system with power on discovery |
US9296056B2 (en) | 2014-07-08 | 2016-03-29 | International Business Machines Corporation | Device for thermal management of surface mount devices during reflow soldering |
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US10882258B1 (en) | 2016-01-22 | 2021-01-05 | Pharmaseq, Inc. | Microchip affixing probe and method of use |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
EP3679523B1 (en) * | 2017-09-07 | 2023-02-01 | Composecure LLC | Transaction card with embedded electronic components and process for manufacture |
SE542007C2 (en) | 2017-10-13 | 2020-02-11 | Stora Enso Oyj | A method and an apparatus for producing a radio-frequency identification transponder |
CN118364848A (zh) * | 2017-10-18 | 2024-07-19 | 安全创造有限责任公司 | 具有窗或窗图案和可选背光的金属、陶瓷或陶瓷涂层的交易卡 |
SE541653C2 (en) | 2017-11-03 | 2019-11-19 | Stora Enso Oyj | Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna |
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BR112013009147A2 (pt) | 2016-07-26 |
KR101941679B1 (ko) | 2019-01-24 |
KR20130138264A (ko) | 2013-12-18 |
MX2013004101A (es) | 2013-07-17 |
US9629255B2 (en) | 2017-04-18 |
BR112013009147B8 (pt) | 2022-07-12 |
WO2012049352A1 (en) | 2012-04-19 |
MY168368A (en) | 2018-10-31 |
USRE48018E1 (en) | 2020-05-26 |
CA2813538A1 (en) | 2012-04-19 |
RU2563971C2 (ru) | 2015-09-27 |
EP2628370A1 (en) | 2013-08-21 |
EP2628370A4 (en) | 2017-08-02 |
US20130255079A1 (en) | 2013-10-03 |
CN103190206B (zh) | 2016-12-28 |
AU2010362421B2 (en) | 2015-06-25 |
RU2013119471A (ru) | 2014-11-20 |
CN103190206A (zh) | 2013-07-03 |
JP2013539921A (ja) | 2013-10-28 |
CA2813538C (en) | 2019-05-07 |
KR20170130614A (ko) | 2017-11-28 |
BR112013009147B1 (pt) | 2020-09-24 |
AU2010362421A1 (en) | 2013-05-02 |
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