MX2013004101A - Metodo y disposicion para montar un chip en una superficie conductora impresa. - Google Patents

Metodo y disposicion para montar un chip en una superficie conductora impresa.

Info

Publication number
MX2013004101A
MX2013004101A MX2013004101A MX2013004101A MX2013004101A MX 2013004101 A MX2013004101 A MX 2013004101A MX 2013004101 A MX2013004101 A MX 2013004101A MX 2013004101 A MX2013004101 A MX 2013004101A MX 2013004101 A MX2013004101 A MX 2013004101A
Authority
MX
Mexico
Prior art keywords
chip
conductive surface
printed conductive
attaching
arrangement
Prior art date
Application number
MX2013004101A
Other languages
English (en)
Inventor
Juha Maijala
Petri Sirvioe
Original Assignee
Stora Enso Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stora Enso Oyj filed Critical Stora Enso Oyj
Publication of MX2013004101A publication Critical patent/MX2013004101A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

Un chip se monta en una superficie conductora impresa. El chip se calienta primero a una primera temperatura, que es inferior a la que el chip puede resistir sin dañarse por el calor. El chip calentado se prensa contra la superficie conductora impresa con una primera fuerza de prensado. Una combinación de dicha primera temperatura y dicha primera fuerza de prensado es suficiente para fundir por lo menos parcialmente el material de por lo menos uno de: la superficie conductora impresa, un punto de contacto en el chip.
MX2013004101A 2010-10-14 2010-10-14 Metodo y disposicion para montar un chip en una superficie conductora impresa. MX2013004101A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FI2010/050797 WO2012049352A1 (en) 2010-10-14 2010-10-14 Method and arrangement for attaching a chip to a printed conductive surface

Publications (1)

Publication Number Publication Date
MX2013004101A true MX2013004101A (es) 2013-07-17

Family

ID=45937939

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013004101A MX2013004101A (es) 2010-10-14 2010-10-14 Metodo y disposicion para montar un chip en una superficie conductora impresa.

Country Status (12)

Country Link
US (2) USRE48018E1 (es)
EP (1) EP2628370A4 (es)
JP (1) JP6038035B2 (es)
KR (2) KR20130138264A (es)
CN (1) CN103190206B (es)
AU (1) AU2010362421B2 (es)
BR (1) BR112013009147B8 (es)
CA (1) CA2813538C (es)
MX (1) MX2013004101A (es)
MY (1) MY168368A (es)
RU (1) RU2563971C2 (es)
WO (1) WO2012049352A1 (es)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2010362421B2 (en) 2010-10-14 2015-06-25 Digital Tags Finland Oy Method and arrangement for attaching a chip to a printed conductive surface
US9105760B2 (en) 2011-11-07 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
US9079351B2 (en) * 2012-06-22 2015-07-14 Wisconsin Alumni Research Foundation System for transfer of nanomembrane elements with improved preservation of spatial integrity
US9776270B2 (en) * 2013-10-01 2017-10-03 Globalfoundries Inc. Chip joining by induction heating
US11133866B2 (en) 2014-02-25 2021-09-28 Pharmaseq, Inc. All optical identification and sensor system with power on discovery
US9296056B2 (en) 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
US10745638B2 (en) 2014-10-31 2020-08-18 The Lubrizol Corporation Marine diesel lubricating composition
SE538792C2 (en) * 2015-02-06 2016-11-29 Stora Enso Oyj Apparatus and method for component assembly
US10882258B1 (en) * 2016-01-22 2021-01-05 Pharmaseq, Inc. Microchip affixing probe and method of use
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
BR112020004520A2 (pt) 2017-09-07 2020-09-08 Composecure Llc cartão de transação e processo para fazer o mesmo
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
SE542007C2 (en) 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
HUE060022T2 (hu) * 2017-10-18 2023-01-28 Composecure Llc Fém, kerámia vagy kerámiabevonatos tranzakciókártya ablakkal vagy ablakmintával és opcionális háttévilágítással
SE541653C2 (en) * 2017-11-03 2019-11-19 Stora Enso Oyj Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna
SE541540C2 (en) * 2017-12-21 2019-10-29 Stora Enso Oyj Method for manufacturing a collar piece comprising an RFID tag
JP6967726B2 (ja) * 2018-01-31 2021-11-17 パナソニックＩｐマネジメント株式会社 はんだペーストおよび実装構造体
RU2729606C1 (ru) * 2019-11-25 2020-08-11 Акционерное общество «Информационные спутниковые системы» имени академика М.Ф.Решетнёва» Способ совместного монтажа электрорадиоизделий и печатных плат радиоэлектронной аппаратуры
US11546129B2 (en) 2020-02-14 2023-01-03 P-Chip Ip Holdings Inc. Light-triggered transponder
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
US20220086646A1 (en) 2020-09-17 2022-03-17 P-Chip Ip Holdings Inc. Devices, systems, and methods using microtransponders
CN113020880B (zh) * 2021-04-14 2023-06-20 深圳市新晨阳电子有限公司 一种集成电路板研发用贴片电阻焊接试制工装
CN113490346B (zh) * 2021-07-28 2022-10-04 苏州斯尔特微电子有限公司 一种芯片贴片机和芯片贴片方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3680196A (en) 1970-05-08 1972-08-01 Us Navy Process for bonding chip devices to hybrid circuitry
US3680199A (en) 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method
US3680198A (en) 1970-10-07 1972-08-01 Fairchild Camera Instr Co Assembly method for attaching semiconductor devices
US4967950A (en) * 1989-10-31 1990-11-06 International Business Machines Corporation Soldering method
JPH0521949A (ja) * 1991-07-15 1993-01-29 Hitachi Ltd 表面実装部品位置決め装置
RU2130215C1 (ru) * 1992-08-14 1999-05-10 Государственное научно-производственное предприятие "НИИПП" Способ создания монолитной интегральной свч схемы
US5303824A (en) 1992-12-04 1994-04-19 International Business Machines Corporations Solder preform carrier and use
RU2130125C1 (ru) 1996-06-17 1999-05-10 Научно-производственное объединение "Алтай" Быстросгорающий заряд твердого топлива
JPH1050766A (ja) 1996-08-02 1998-02-20 Toshiba Corp フェース・ダウン・ボンディング方法およびその装置
US5795818A (en) 1996-12-06 1998-08-18 Amkor Technology, Inc. Integrated circuit chip to substrate interconnection and method
US6016949A (en) 1997-07-01 2000-01-25 International Business Machines Corporation Integrated placement and soldering pickup head and method of using
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6054682A (en) * 1999-03-11 2000-04-25 Micron Electronics, Inc. Method and system for reducing water vapor in integrated circuit packages prior to reflow
JP4469453B2 (ja) * 2000-02-28 2010-05-26 キヤノン株式会社 現像装置および画像記録装置
JP3747849B2 (ja) 2001-12-25 2006-02-22 松下電器産業株式会社 電子部品のボンディング装置およびボンディング方法
KR100510518B1 (ko) 2003-01-30 2005-08-26 삼성전자주식회사 반도체 장치 및 반도체 장치의 패키지 방법
JP4010265B2 (ja) * 2003-03-24 2007-11-21 コニカミノルタホールディングス株式会社 トナー製造方法、トナーおよびそれを用いた画像形成方法
JP4057589B2 (ja) * 2003-03-25 2008-03-05 富士通株式会社 電子部品搭載基板の製造方法
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
JP4344226B2 (ja) 2003-12-01 2009-10-14 パナソニック株式会社 はんだインク組成物
JP2005259925A (ja) 2004-03-11 2005-09-22 Sony Corp 実装方法
JP4584031B2 (ja) * 2004-05-28 2010-11-17 パナソニック株式会社 接合装置及び接合方法
US8240539B2 (en) 2004-05-28 2012-08-14 Panasonic Corporation Joining apparatus with UV cleaning
JP2006222170A (ja) 2005-02-09 2006-08-24 Canon Inc はんだ付け方法
WO2006109383A1 (ja) 2005-04-05 2006-10-19 Nec Corporation 配線基板を有する電子デバイス、その製造方法、および前記電子デバイスに用いられる配線基板
JP4654865B2 (ja) * 2005-09-30 2011-03-23 パナソニック株式会社 電子部品実装方法
JP2007150051A (ja) 2005-11-29 2007-06-14 Tokuyama Corp 基板上への半田パターン形成方法
JP4742844B2 (ja) 2005-12-15 2011-08-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8067253B2 (en) 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
JP4912900B2 (ja) 2006-02-03 2012-04-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20070183184A1 (en) 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Ltd. Apparatus and method for manufacturing semiconductor device
EP2298045B1 (en) 2008-05-09 2019-12-25 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
SG161134A1 (en) 2008-11-07 2010-05-27 Orion Systems Integration Pte In-situ melt and reflow process for forming flip-chip interconnections and system thereof
EA014277B1 (ru) 2008-12-02 2010-10-29 Александр Иванович Таран Способ совмещения элементов многокристальных модулей для капиллярной сборки и установка для его реализации
US8512933B2 (en) * 2008-12-22 2013-08-20 Eastman Kodak Company Method of producing electronic circuit boards using electrophotography
AU2010362421B2 (en) 2010-10-14 2015-06-25 Digital Tags Finland Oy Method and arrangement for attaching a chip to a printed conductive surface

Also Published As

Publication number Publication date
AU2010362421B2 (en) 2015-06-25
CA2813538A1 (en) 2012-04-19
MY168368A (en) 2018-10-31
KR20130138264A (ko) 2013-12-18
RU2563971C2 (ru) 2015-09-27
JP6038035B2 (ja) 2016-12-07
CN103190206B (zh) 2016-12-28
BR112013009147B8 (pt) 2022-07-12
AU2010362421A1 (en) 2013-05-02
KR20170130614A (ko) 2017-11-28
KR101941679B1 (ko) 2019-01-24
EP2628370A1 (en) 2013-08-21
US9629255B2 (en) 2017-04-18
RU2013119471A (ru) 2014-11-20
JP2013539921A (ja) 2013-10-28
BR112013009147B1 (pt) 2020-09-24
BR112013009147A2 (pt) 2016-07-26
EP2628370A4 (en) 2017-08-02
CN103190206A (zh) 2013-07-03
WO2012049352A1 (en) 2012-04-19
USRE48018E1 (en) 2020-05-26
CA2813538C (en) 2019-05-07
US20130255079A1 (en) 2013-10-03

Similar Documents

Publication Publication Date Title
MX2013004101A (es) Metodo y disposicion para montar un chip en una superficie conductora impresa.
EP2279522A4 (en) HEATING DEVICES ON NANOSTRUCTURE BASIS AND USE METHOD
MY161023A (en) Method for connecting solar cells
WO2009140442A3 (en) Heated cantilever
WO2009047010A3 (de) Verfahren zum verbinden eines ersten materials mit einem zweiten material im flugzeugbau
EP2634554A3 (en) Thermal insulation performance measurement apparatus and measurement method using the same
WO2013140295A3 (en) Thermal interface material
WO2014138428A3 (en) Test system with localized heating and method of manufacture thereof
EP2881801A3 (en) Image heating device
MY163406A (en) Device and method for drying separated electronic components
WO2011109501A3 (en) Electronic device provided with socket for card-shaped component
IN2013CH00558A (es)
WO2010120044A3 (ko) 무선 헤어 고데기용 방열판 및 무선 헤어 고데기
WO2012151101A3 (en) Heat conductive sheet
WO2014072124A3 (de) Temperatursensorsystem und verfahren zur herstellung eines temperatursensorsystems
GB201110511D0 (en) Metal transfer device
MY192559A (en) Method and an arrangement for producing electrically conductive patterns on substrates
MX361335B (es) Métodos para transferir materiales eléctricamente conductivos.
CL2014000303A1 (es) Ensamblaje de control para un aparato calentador de liquidos sin cable que comprende un control para montarse al aparato calentador de liquidos, y un conector de base sin cable adaptado para suministrar energia electrica al control; aparato calentador; conector de base; control.
WO2014049080A3 (de) Optoelektronische bauelementevorrichtung, verfahren zum herstellen einer optoelektronischen bauelementevorrichtung und verfahren zum betreiben einer optoelektronischen bauelementevorrichtung
PH12014502742A1 (en) Apparatus and method for heating a liquefied stream
WO2011038889A3 (de) System und verfahren zur kühlung und/oder beheizung von luftfahrzeugeinrichtungen
WO2016061006A3 (en) Carbon nanotubes as a thermal interface material
MX2016017347A (es) Metodo y dispositivo para moldeo por inyeccion o estampado/prensado.
WO2010100401A3 (en) Heater apparatus

Legal Events

Date Code Title Description
FG Grant or registration