BR112013009147B8 - Método e dispositivo para fixar um chip a uma superfície impressa condutora - Google Patents

Método e dispositivo para fixar um chip a uma superfície impressa condutora

Info

Publication number
BR112013009147B8
BR112013009147B8 BR112013009147A BR112013009147A BR112013009147B8 BR 112013009147 B8 BR112013009147 B8 BR 112013009147B8 BR 112013009147 A BR112013009147 A BR 112013009147A BR 112013009147 A BR112013009147 A BR 112013009147A BR 112013009147 B8 BR112013009147 B8 BR 112013009147B8
Authority
BR
Brazil
Prior art keywords
chip
printed surface
conductive printed
attaching
temperature
Prior art date
Application number
BR112013009147A
Other languages
English (en)
Other versions
BR112013009147A2 (pt
BR112013009147B1 (pt
Inventor
Juha Maijala
Petri Sirviö
Original Assignee
Stora Enso Oyj
Digital Tags Finland Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stora Enso Oyj, Digital Tags Finland Oy filed Critical Stora Enso Oyj
Publication of BR112013009147A2 publication Critical patent/BR112013009147A2/pt
Publication of BR112013009147B1 publication Critical patent/BR112013009147B1/pt
Publication of BR112013009147B8 publication Critical patent/BR112013009147B8/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

MÉTODO E DISPOSIÇÃO PARA FIXAÇÃO DE UM CHIP A UMA SUPERFÍCIE IMPRESSA CONDUTORA. A presente invenção está correlacionada a um chip, o qual é fixado a uma superfície impressa condutora. O chip é primeiro aquecido a uma primeira temperatura, que é inferior à temperatura que o chip pode suportar sem que seja danificado pelo calor. O chip aquecido é pressionado contra a superfície impressa condutora com uma primeira força de pressionamento. Uma combinação da dita primeira temperatura e dita primeira força de pressionamento é suficiente para, pelo menos parcialmente, fundir o material de pelo menos um material da superfície impressa condutora, ponto de contato sobre o chip.
BR112013009147A 2010-10-14 2010-10-14 Método e dispositivo para fixar um chip a uma superfície impressa condutora BR112013009147B8 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FI2010/050797 WO2012049352A1 (en) 2010-10-14 2010-10-14 Method and arrangement for attaching a chip to a printed conductive surface

Publications (3)

Publication Number Publication Date
BR112013009147A2 BR112013009147A2 (pt) 2016-07-26
BR112013009147B1 BR112013009147B1 (pt) 2020-09-24
BR112013009147B8 true BR112013009147B8 (pt) 2022-07-12

Family

ID=45937939

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013009147A BR112013009147B8 (pt) 2010-10-14 2010-10-14 Método e dispositivo para fixar um chip a uma superfície impressa condutora

Country Status (12)

Country Link
US (2) US9629255B2 (pt)
EP (1) EP2628370A4 (pt)
JP (1) JP6038035B2 (pt)
KR (2) KR20130138264A (pt)
CN (1) CN103190206B (pt)
AU (1) AU2010362421B2 (pt)
BR (1) BR112013009147B8 (pt)
CA (1) CA2813538C (pt)
MX (1) MX2013004101A (pt)
MY (1) MY168368A (pt)
RU (1) RU2563971C2 (pt)
WO (1) WO2012049352A1 (pt)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2010362421B2 (en) 2010-10-14 2015-06-25 Digital Tags Finland Oy Method and arrangement for attaching a chip to a printed conductive surface
US9105760B2 (en) 2011-11-07 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
US9079351B2 (en) * 2012-06-22 2015-07-14 Wisconsin Alumni Research Foundation System for transfer of nanomembrane elements with improved preservation of spatial integrity
US9776270B2 (en) * 2013-10-01 2017-10-03 Globalfoundries Inc. Chip joining by induction heating
US11133866B2 (en) 2014-02-25 2021-09-28 Pharmaseq, Inc. All optical identification and sensor system with power on discovery
US9296056B2 (en) 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
WO2016070002A1 (en) 2014-10-31 2016-05-06 The Lubrizol Corporation Marine diesel lubricating composition
SE538792C2 (en) * 2015-02-06 2016-11-29 Stora Enso Oyj Apparatus and method for component assembly
US10882258B1 (en) 2016-01-22 2021-01-05 Pharmaseq, Inc. Microchip affixing probe and method of use
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
SG11202002064SA (en) 2017-09-07 2020-04-29 Composecure Llc Transaction card with embedded electronic components and process for manufacture
SE542007C2 (en) 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
ES2929116T3 (es) * 2017-10-18 2022-11-24 Composecure Llc Tarjeta de transacción de metal, cerámica, o con revestimiento cerámico con ventana o patrón de ventana y retroiluminación opcional
SE541653C2 (en) 2017-11-03 2019-11-19 Stora Enso Oyj Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna
SE541540C2 (en) * 2017-12-21 2019-10-29 Stora Enso Oyj Method for manufacturing a collar piece comprising an RFID tag
JP6967726B2 (ja) * 2018-01-31 2021-11-17 パナソニックＩｐマネジメント株式会社 はんだペーストおよび実装構造体
RU2729606C1 (ru) * 2019-11-25 2020-08-11 Акционерное общество «Информационные спутниковые системы» имени академика М.Ф.Решетнёва» Способ совместного монтажа электрорадиоизделий и печатных плат радиоэлектронной аппаратуры
CN115398826A (zh) 2020-02-14 2022-11-25 P芯片知识产权控股公司 光触发的应答器
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger
CN113020880B (zh) * 2021-04-14 2023-06-20 深圳市新晨阳电子有限公司 一种集成电路板研发用贴片电阻焊接试制工装
CN113490346B (zh) * 2021-07-28 2022-10-04 苏州斯尔特微电子有限公司 一种芯片贴片机和芯片贴片方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3680196A (en) 1970-05-08 1972-08-01 Us Navy Process for bonding chip devices to hybrid circuitry
US3680199A (en) * 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method
US3680198A (en) 1970-10-07 1972-08-01 Fairchild Camera Instr Co Assembly method for attaching semiconductor devices
US4967950A (en) 1989-10-31 1990-11-06 International Business Machines Corporation Soldering method
JPH0521949A (ja) * 1991-07-15 1993-01-29 Hitachi Ltd 表面実装部品位置決め装置
RU2130215C1 (ru) * 1992-08-14 1999-05-10 Государственное научно-производственное предприятие "НИИПП" Способ создания монолитной интегральной свч схемы
US5303824A (en) * 1992-12-04 1994-04-19 International Business Machines Corporations Solder preform carrier and use
RU2130125C1 (ru) 1996-06-17 1999-05-10 Научно-производственное объединение "Алтай" Быстросгорающий заряд твердого топлива
JPH1050766A (ja) * 1996-08-02 1998-02-20 Toshiba Corp フェース・ダウン・ボンディング方法およびその装置
US5795818A (en) * 1996-12-06 1998-08-18 Amkor Technology, Inc. Integrated circuit chip to substrate interconnection and method
US6016949A (en) * 1997-07-01 2000-01-25 International Business Machines Corporation Integrated placement and soldering pickup head and method of using
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6054682A (en) 1999-03-11 2000-04-25 Micron Electronics, Inc. Method and system for reducing water vapor in integrated circuit packages prior to reflow
JP4469453B2 (ja) * 2000-02-28 2010-05-26 キヤノン株式会社 現像装置および画像記録装置
JP3747849B2 (ja) * 2001-12-25 2006-02-22 松下電器産業株式会社 電子部品のボンディング装置およびボンディング方法
KR100510518B1 (ko) 2003-01-30 2005-08-26 삼성전자주식회사 반도체 장치 및 반도체 장치의 패키지 방법
JP4010265B2 (ja) * 2003-03-24 2007-11-21 コニカミノルタホールディングス株式会社 トナー製造方法、トナーおよびそれを用いた画像形成方法
CN100390951C (zh) 2003-03-25 2008-05-28 富士通株式会社 电子部件安装基板的制造方法
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
JP4344226B2 (ja) 2003-12-01 2009-10-14 パナソニック株式会社 はんだインク組成物
JP2005259925A (ja) * 2004-03-11 2005-09-22 Sony Corp 実装方法
US8240539B2 (en) 2004-05-28 2012-08-14 Panasonic Corporation Joining apparatus with UV cleaning
JP4584031B2 (ja) 2004-05-28 2010-11-17 パナソニック株式会社 接合装置及び接合方法
JP2006222170A (ja) * 2005-02-09 2006-08-24 Canon Inc はんだ付け方法
CN101156237B (zh) * 2005-04-05 2011-01-19 日本电气株式会社 具有配线基板的电子设备、其制造方法以及用于这种电子设备的配线基板
JP4654865B2 (ja) 2005-09-30 2011-03-23 パナソニック株式会社 電子部品実装方法
JP2007150051A (ja) 2005-11-29 2007-06-14 Tokuyama Corp 基板上への半田パターン形成方法
JP4742844B2 (ja) 2005-12-15 2011-08-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8067253B2 (en) * 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
US20070183184A1 (en) 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Ltd. Apparatus and method for manufacturing semiconductor device
JP4912900B2 (ja) * 2006-02-03 2012-04-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP2298045B1 (en) 2008-05-09 2019-12-25 Stora Enso Oyj An apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
SG161134A1 (en) * 2008-11-07 2010-05-27 Orion Systems Integration Pte In-situ melt and reflow process for forming flip-chip interconnections and system thereof
EA014277B1 (ru) * 2008-12-02 2010-10-29 Александр Иванович Таран Способ совмещения элементов многокристальных модулей для капиллярной сборки и установка для его реализации
US8512933B2 (en) * 2008-12-22 2013-08-20 Eastman Kodak Company Method of producing electronic circuit boards using electrophotography
AU2010362421B2 (en) 2010-10-14 2015-06-25 Digital Tags Finland Oy Method and arrangement for attaching a chip to a printed conductive surface

Also Published As

Publication number Publication date
RU2013119471A (ru) 2014-11-20
BR112013009147A2 (pt) 2016-07-26
CN103190206A (zh) 2013-07-03
KR101941679B1 (ko) 2019-01-24
CA2813538C (en) 2019-05-07
US20130255079A1 (en) 2013-10-03
WO2012049352A1 (en) 2012-04-19
JP6038035B2 (ja) 2016-12-07
AU2010362421B2 (en) 2015-06-25
KR20170130614A (ko) 2017-11-28
AU2010362421A1 (en) 2013-05-02
JP2013539921A (ja) 2013-10-28
USRE48018E1 (en) 2020-05-26
KR20130138264A (ko) 2013-12-18
EP2628370A1 (en) 2013-08-21
CN103190206B (zh) 2016-12-28
CA2813538A1 (en) 2012-04-19
MX2013004101A (es) 2013-07-17
BR112013009147B1 (pt) 2020-09-24
MY168368A (en) 2018-10-31
EP2628370A4 (en) 2017-08-02
RU2563971C2 (ru) 2015-09-27
US9629255B2 (en) 2017-04-18

Similar Documents

Publication Publication Date Title
BR112013009147B8 (pt) Método e dispositivo para fixar um chip a uma superfície impressa condutora
BR122020009302B8 (pt) Método para impressão em couro
CL2012002252A1 (es) Conjunto antidesgaste que incluye un elemento antidesgaste que va a montarse en un implemento o aparato que va a protegerse, un elemento de base que va a acoplarse al implemento o aparato, un elemento de bloqueo para bloquear dicho elemento antidesgaste con respecto a dicho elemento de base; base para un conjunto antidesgaste; bloqueo ; elemento de bloqueo; conjunto antidesgaste.
BR112015006247A2 (pt) adesivo hot melt sensível à pressão para rotulagem
BRPI1002587A2 (pt) composição e produto de reação
BR112015009655A2 (pt) método e aparelho para formar em um substrato um padrão de um material
BR112012010893B8 (pt) pé protético
BR112012015431A2 (pt) dispositivo para identificar condições orais
BR112013002091A2 (pt) máquina elétrica resfriada por fluido
BR112014002772A2 (pt) controles
BRPI1002597A2 (pt) Composição que compreende pelo menos um polímero polar modificado solúvel em óleo
BRPI1002586A2 (pt) Composição que compreende pelo menos um polímero polar modificado lipossolúvel com teor elevado de carbono
BRPI1003794A2 (pt) composição e produto de reação
BRPI1011639A2 (pt) composição anticongelante, e, método para aumentar a estabilidade térmica de uma composição anticongelante
BR112015005060A2 (pt) decodificador de sinais que tem meios de aplicação de pressão de dissipador de calor
BRPI0921785A2 (pt) elemento condutor luminoso para um conjunto de iluminação
BR112014018776A8 (pt) Método e dispositivo para produzir um padrão eletricamente condutor sobre uma superfície
BR112015021771A8 (pt) rótulo adesivo para gravação por jato de tinta
BR112012000713A2 (pt) dissipador térmico para um componente eletrônico ou elétrico
BR112013005553A2 (pt) máquina de estampagem, compreendendo uma prensa com platinas
BR112013005669A2 (pt) composição de adoçante melhorada com base em estévia e produtos comestíveis com ela produzidos
BR112015009301A2 (pt) biocontrole de nematoides
BR112017025805A2 (pt) equipamento de proteção para a transmissão de uma pontuação esportiva
BRPI0812022A2 (pt) Composições para produção de soja com teor de óleo elevado.
EP2493961A4 (en) POLYIMIDE RESINS FOR HIGH TEMPERATURE WEAR APPLICATIONS

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 14/10/2010, OBSERVADAS AS CONDICOES LEGAIS.

B25A Requested transfer of rights approved

Owner name: DIGITAL TAGS FINLAND OY (FI)