BR112015005060A2 - decodificador de sinais que tem meios de aplicação de pressão de dissipador de calor - Google Patents

decodificador de sinais que tem meios de aplicação de pressão de dissipador de calor

Info

Publication number
BR112015005060A2
BR112015005060A2 BR112015005060A BR112015005060A BR112015005060A2 BR 112015005060 A2 BR112015005060 A2 BR 112015005060A2 BR 112015005060 A BR112015005060 A BR 112015005060A BR 112015005060 A BR112015005060 A BR 112015005060A BR 112015005060 A2 BR112015005060 A2 BR 112015005060A2
Authority
BR
Brazil
Prior art keywords
heat sink
circuit board
signal decoder
thermal pad
application means
Prior art date
Application number
BR112015005060A
Other languages
English (en)
Other versions
BR112015005060B1 (pt
Inventor
Michael Williams Kevin
Phillip Dernier William
Original Assignee
Thomson Licensing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing filed Critical Thomson Licensing
Publication of BR112015005060A2 publication Critical patent/BR112015005060A2/pt
Publication of BR112015005060B1 publication Critical patent/BR112015005060B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting

Abstract

resumo “decodificador de sinais que tem meios de aplicação de pressão de dissipador de calor” trata-se de um dispositivo eletrônico, que inclui uma estrutura de topo, uma estrutura de fundo, uma placa de circuito montada acima da estrutura de fundo, uma almofada térmica montada na placa de circuito, um dissipador de calor associado com a almofada térmica e uma pluralidade de molas para proporcionar uma força de polarização que mantém o dissipador de calor contra a almofada térmica, o dissipador de calor que inclui uma porção plana em torno de uma depressão central, em que a pluralidade de molas fixa a almofada térmica da placa de circuito entre a parte de depressão central do dissipador de calor e da placa de circuito.
BR112015005060-3A 2012-09-07 2013-07-23 Decodificador de sinais que tem meios de aplicação de pressão de dissipador de calor BR112015005060B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261698077P 2012-09-07 2012-09-07
US61/698,077 2012-09-07
PCT/US2013/051624 WO2014039173A1 (en) 2012-09-07 2013-07-23 Set top box having heat sink pressure applying means

Publications (2)

Publication Number Publication Date
BR112015005060A2 true BR112015005060A2 (pt) 2017-07-04
BR112015005060B1 BR112015005060B1 (pt) 2021-09-28

Family

ID=48998690

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015005060-3A BR112015005060B1 (pt) 2012-09-07 2013-07-23 Decodificador de sinais que tem meios de aplicação de pressão de dissipador de calor

Country Status (6)

Country Link
US (1) US9265180B2 (pt)
EP (1) EP2893787B1 (pt)
JP (1) JP6085684B2 (pt)
KR (1) KR20150052063A (pt)
BR (1) BR112015005060B1 (pt)
WO (1) WO2014039173A1 (pt)

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US9357670B2 (en) * 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
DE102015206480A1 (de) * 2015-04-10 2016-10-13 Robert Bosch Gmbh Steuergerät
JP6274196B2 (ja) * 2015-12-16 2018-02-07 株式会社オートネットワーク技術研究所 電気接続箱
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
WO2019030809A1 (ja) * 2017-08-08 2019-02-14 Ｎｅｃプラットフォームズ株式会社 放熱構造体
US10721840B2 (en) 2017-10-11 2020-07-21 DISH Technologies L.L.C. Heat spreader assembly
CN110557931B (zh) * 2019-08-30 2020-12-08 华为技术有限公司 车载设备和车辆
CN112601411B (zh) * 2020-12-04 2022-08-16 Oppo广东移动通信有限公司 电路板结构和电子设备
US11800687B2 (en) 2021-08-26 2023-10-24 Dish Network L.L.C. Heat transfer assembly
US20230345675A1 (en) * 2022-04-26 2023-10-26 Dish Network, L.L.C. Electronic assembly having thermal pad with polymer layer

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JPS5856438Y2 (ja) * 1977-11-10 1983-12-26 豊生ブレ−キ工業株式会社 ドラムブレ−キ用シユ−ホ−ルドダウンスプリング
JPS5758634Y2 (pt) * 1978-11-09 1982-12-15
JPH08161067A (ja) * 1994-11-30 1996-06-21 Nissin Kogyo Kk 操作レバーの支持構造
DE19600619A1 (de) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
JPH10199085A (ja) * 1996-12-27 1998-07-31 Sony Corp ディスク装置
JP2000223631A (ja) * 1999-01-27 2000-08-11 Nissan Motor Co Ltd 半導体装置およびその製造方法
US6226184B1 (en) * 1999-10-22 2001-05-01 Sun Microsystems, Inc. Enclosure mounted heat sink
JP2003157646A (ja) * 2001-04-05 2003-05-30 Fuji Photo Film Co Ltd 磁気テープカセットおよびこれに用いるテープリールならびに樹脂製板ばねおよびその製造方法
US6673998B1 (en) * 2003-01-02 2004-01-06 Accton Technology Corporation Electromagnetic shielding device with heat-dissipating capability
JP4498163B2 (ja) * 2005-02-08 2010-07-07 株式会社東芝 電子機器の放熱装置
JP2006229046A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 電子機器の放熱装置及び放熱方法
JP4445409B2 (ja) * 2005-02-23 2010-04-07 株式会社東芝 電子機器の放熱装置
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CN103369909A (zh) * 2012-03-28 2013-10-23 富准精密工业(深圳)有限公司 电子装置及其散热装置
FR2995172B1 (fr) * 2012-09-06 2015-11-20 Sagemcom Broadband Sas Equipement electronique a refroidissement par air et dispositif de refroidissement d'un composant electronique
TW201444460A (zh) * 2013-05-14 2014-11-16 Hon Hai Prec Ind Co Ltd 散熱器組合

Also Published As

Publication number Publication date
BR112015005060B1 (pt) 2021-09-28
EP2893787B1 (en) 2018-09-26
JP2015529399A (ja) 2015-10-05
JP6085684B2 (ja) 2017-02-22
CN104604352A (zh) 2015-05-06
US20150230363A1 (en) 2015-08-13
US9265180B2 (en) 2016-02-16
EP2893787A1 (en) 2015-07-15
WO2014039173A1 (en) 2014-03-13
KR20150052063A (ko) 2015-05-13

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B25G Requested change of headquarter approved

Owner name: THOMSON LICENSING (FR)

B25A Requested transfer of rights approved

Owner name: INTERDIGITAL CE PATENT HOLDINGS (FR)

B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B25A Requested transfer of rights approved

Owner name: INTERDIGITAL MADISON PATENT HOLDINGS, SAS (FR)

B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/07/2013, OBSERVADAS AS CONDICOES LEGAIS.