CN1988785A - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN1988785A
CN1988785A CNA2005101212200A CN200510121220A CN1988785A CN 1988785 A CN1988785 A CN 1988785A CN A2005101212200 A CNA2005101212200 A CN A2005101212200A CN 200510121220 A CN200510121220 A CN 200510121220A CN 1988785 A CN1988785 A CN 1988785A
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China
Prior art keywords
heat abstractor
radiator
cabinet
metal clips
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005101212200A
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English (en)
Inventor
谢明志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNA2005101212200A priority Critical patent/CN1988785A/zh
Priority to US11/309,710 priority patent/US20070146990A1/en
Publication of CN1988785A publication Critical patent/CN1988785A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置,装设于机箱内用于对系统进行散热,该散热装置包括散热器,该散热器装设于该系统的发热元件上,该散热装置还包括金属弹片,该金属弹片连接于该散热器与该机箱之间。

Description

散热装置
【技术领域】
本发明涉及一种散热装置,特别是一种运用于电脑机箱内部系统散热的散热装置。
【技术背景】
个人电脑中的主要发热源为中央处理器,现有技术中,通常通过中央处理器上装设散热器的方式将中央处理器产生的热量带走。随着中央处理器热量的不断产生,通过散热器将热量传导到机箱内的空气,再通过机箱的金属外壳将热量扩散到机箱外。但在这个过程中,散热器与机箱的金属外壳之间是利用导热系数不佳的空气做为传导媒介,因此在上述的整个散热过程中会受到壳内空气较差的热导系数影响,造成不佳的散热传导。
为加快散热,一般会在机箱上打散热孔,但散热孔太大或太多容易使灰尘水汽等进入机箱内,对机箱内的电子元件产生不良影响。
鉴于此,有必要提供一种更有效的散热装置,以弥补上述缺陷。
【发明内容】
鉴于以上内容,有必要提供一种更有效的散热装置。
一种散热装置,装设于机箱内用于对系统进行散热,该散热装置包括散热器,该散热器装设于该系统的发热元件上,该散热装置还包括金属弹片,该金属弹片连接于该散热器与该机箱之间。
本装置的优点在于利用金属的导热性能比空气好的特点,取得更佳的散热效果。
【图式简单说明】
图1是本发明散热装置的第一较佳实施方式与电脑系统的立体分解图。
图2是本发明散热装置的第二较佳实施方式与电脑系统的立体分解图。
图3是本发明散热装置的第三较佳实施方式与电脑系统的立体分解图。
【具体实施方式】
请参阅图1,为本发明散热装置的第一较佳实施方式,该散热装置装设于电脑机箱10内对电脑系统进行散热,其包括散热器20及金属弹片30。
该电脑机箱10内装设有主板12,该主板12上安装有发热元件,在本实施方式中该发热元件为中央处理器14。
该散热器20包括底板22及竖直固定于该底板22上的若干鳍片24,该散热器20装设于该主板12上,且其底板22紧贴于该中央处理器14。
该金属弹片30大致呈U形,其一侧壁外侧紧贴于该散热器20的鳍片24的顶端,其另一侧壁外侧紧贴于该机箱10的内侧壁与该中央处理器14相对的位置处。
该金属弹片30可以用导热性能较好的铜、铝等材料制成。
请参阅图2,为本发明散热装置的第二较佳实施方式,其包括散热器20及金属弹片40,其与该第一较佳实施方式的主要区别在于其金属弹片40大致呈M形,其一侧壁外侧紧贴于该散热器20的鳍片24的顶端,其另一侧壁外侧紧贴于该机箱10的内侧壁与该中央处理器14相对的位置处。。
请参阅图3,为本发明散热装置的第三较佳实施方式,其包括散热器20及金属弹片50,其与该第一较佳实施方式的主要区别在于该金属弹片50大致呈N形,其一侧壁外侧紧贴于该散热器20的鳍片24的顶端,其另一侧壁外侧紧贴于该机箱10的内侧壁与该中央处理器14相对的位置处。

Claims (5)

1.一种散热装置,装设于机箱内用于对系统进行散热,所述散热装置包括散热器,所述散热器装设于所述系统的发热元件上,其特征在于:所述散热装置还包括金属弹片,所述金属弹片连接于所述散热器与所述机箱之间。
2.如权利要求1所述的散热装置,其特征在于:所述金属弹片呈U形,其两侧壁外侧分别贴紧于所述机箱内侧壁及所述散热器。
3.如权利要求1所述的散热装置,其特征在于:所述金属弹片呈M形,其两侧壁外侧分别贴紧于所述机箱内侧壁及所述散热器。
4.如权利要求1所述的散热装置,其特征在于:所述金属弹片呈N形,其两侧壁外侧分别贴紧于所述机箱内侧壁及所述散热器。
5.如权利要求1所述的散热装置,其特征在于:所述发热元件为中央处理器。
CNA2005101212200A 2005-12-23 2005-12-23 散热装置 Pending CN1988785A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNA2005101212200A CN1988785A (zh) 2005-12-23 2005-12-23 散热装置
US11/309,710 US20070146990A1 (en) 2005-12-23 2006-09-15 Heat dissipating assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2005101212200A CN1988785A (zh) 2005-12-23 2005-12-23 散热装置

Publications (1)

Publication Number Publication Date
CN1988785A true CN1988785A (zh) 2007-06-27

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CN (1) CN1988785A (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102142407A (zh) * 2010-11-04 2011-08-03 聚信科技有限公司 一种导热垫
CN101482769B (zh) * 2008-01-07 2012-05-16 研祥智能科技股份有限公司 嵌入式特种计算机
CN101511159B (zh) * 2008-02-14 2012-06-27 华硕电脑股份有限公司 散热结构及其使用方法
CN106255936A (zh) * 2014-10-28 2016-12-21 Nec平台株式会社 用于外部设备的散热结构、电子设备以及外部设备
CN109075142A (zh) * 2016-04-14 2018-12-21 微软技术许可有限责任公司 散热器

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CN101482769B (zh) * 2008-01-07 2012-05-16 研祥智能科技股份有限公司 嵌入式特种计算机
CN101511159B (zh) * 2008-02-14 2012-06-27 华硕电脑股份有限公司 散热结构及其使用方法
CN102142407A (zh) * 2010-11-04 2011-08-03 聚信科技有限公司 一种导热垫
WO2012058926A1 (zh) * 2010-11-04 2012-05-10 聚信科技有限公司 一种导热垫
CN106255936A (zh) * 2014-10-28 2016-12-21 Nec平台株式会社 用于外部设备的散热结构、电子设备以及外部设备
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Open date: 20070627