CN115437480A - 伺服装置 - Google Patents
伺服装置 Download PDFInfo
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Abstract
本发明公开一种伺服装置,包含一底壳、一电子组件、一盖体及一散热装置。电子组件包含一电路板及一热源。电路板设置于底壳。热源设置于电路板。盖体可滑移地盖合于底壳。散热装置包含一气冷式热交换器及一液冷式热交换器。气冷式热交换器固定并热耦合于热源。液冷式热交换器固定于盖体,并热耦合于气冷式热交换器。
Description
技术领域
本发明涉及一种伺服装置,特别是一种液冷与气冷复合的伺服装置。
背景技术
目前伺服器广为各企业所使用,其发展的范围结合了网际网路与电信业的应用,也深入到一般人生活中,例如金融、财经、网路银行、网路信用卡的使用、人工智能等,这些都必需靠着伺服器强大的运算能力才能做到。以人工智能为例,因人工智能技术需要更大量的运算处理,故需搭配大量的高效能处理器。不过,高效能处理器亦会随之带来大量的废热,若这些废热无法即时排出伺服器外,则累积的废热恐会造成高效能显卡的运算效能降低,甚或导致热当。
现有的作法是在伺服器内部加设开放式水冷系统,以透过水冷的方式来将高效能处理器所产生的热能移至伺服器外部。然而,目前开放式水冷系统在伺服器内部的管路设计复杂,需交错于存储器与中央处理器之间,但又因为此空隙狭窄,造成水路设计困难度与安装困难度的增加。
发明内容
本发明在于提供一种伺服装置,通过简化开放式水冷系统在伺服器内部的管路设计复杂程度,又能提升开放式水冷系统的散热效能。
本发明的一实施例所公开的伺服装置包含一底壳、一电子组件、一盖体及一散热装置。电子组件包含一电路板及一热源。电路板设置于底壳。热源设置于电路板。盖体可滑移地盖合于底壳。散热装置包含一气冷式热交换器及一液冷式热交换器。气冷式热交换器固定并热耦合于热源。液冷式热交换器固定于盖体,并热耦合于气冷式热交换器。
其中底壳包含一底板及二侧板,二侧板分别连接于底板的相对两侧,盖体可滑移地设置于二侧板。
其中至少一气冷式热交换器包含一基部及多个鳍片部,基部热接触于至少一热源,些鳍片部凸出于基部远离至少一热源的一侧。
其中散热装置更包含至少一第一导热件及至少一第二导热件,至少一第一导热件固定于至少一气冷式热交换器,且至少一第二导热件固定于至少一液冷式热交换器,且至少一气冷式热交换器透过第一导热件及至少一第二导热件热耦合于至少一液冷式热交换器。
其中至少一第一导热件及至少一第二导热件各包含二组装段及一热接触段,二组装段固定于基部,并分别连接于热接触段的相对两侧,热接触段与二组装段将这些鳍片部的部分围绕于内。
更包含至少一挠性导热垫,设置于至少一液冷式热交换器,且至少一液冷式热交换器透过及至少一第二导热件与至少一挠性导热垫热耦合于至少一第一导热件。
其中散热装置更包含至少一流管,至少一流管为一体式地组接于至少一液冷式热交换器。
其中电子组件更包含二扩充组件,至少一流管自二扩充组件之间的间隙延伸至底壳外部。
其中至少一流管固定于盖体。
更包含一气流产生器,气流产生器用以产生一散热气流吹向至少一气冷式热交换器。
根据上述实施例的伺服装置,液冷式热交换器固定于盖体,使得液冷式热交换器连接的流管可一并固定于盖体,进而避免占据电路板设置电子元件的空间。
以上关于本发明内容的说明及以下实施方式的说明是用以示范与解释本发明的原理,并且提供本发明的专利申请范围更进一步的解释。
附图说明
图1为根据本发明第一实施例所述的伺服装置的立体示意图。
图2为图1的伺服装置移除盖体的局部放大示意图。
图3为图2的分解示意图。
图4为图1的盖体的立体示意图。
图5为图1的伺服装置的盖体的作动示意图。
图6为图1的伺服装置的剖面示意图。
符号说明:
10…伺服装置
100…底壳
110…底板
110…承载面
120…侧板
200…电子组件
210…电路板
220…热源
230…扩充组件
300…盖体
400…散热装置
410…气冷式热交换器
411…基部
412…鳍片部
420…液冷式热交换器
430…流管
440…第一导热件
441…组装段
442…热接触段
450…第二导热件
451…组装段
452…热接触段
460…挠性导热垫
500…气流产生器
A、T…方向
F…散热气流
具体实施方式
请参阅图1至图4。图1为根据本发明第一实施例所述的伺服装置10的立体示意图。图2为图1的伺服装置10移除盖体300的局部放大示意图。图3为图2的分解示意图。图4为图1的盖体300的立体示意图。
本实施例的伺服装置10例如为伺服器。伺服装置10包含一底壳100、一电子组件200、一盖体300及一散热装置400。
底壳100包含一底板110及二侧板120。底板110具有一承载面110。二侧板120分别连接于底板110的相对两侧,并朝底板110的承载面110的法线方向延伸。
电子组件200包含一电路板210及二热源220。电路板210设置于底壳100,二热源220例如为中央处理器,并设置于电路板210。
在本实施例中,电子组件200还可以包含多个扩充组件230。这些扩充组件230例如为介面卡组,且这些扩充组件230相分离而保持有间隙。
盖体300可滑移地盖合于底壳100的二侧板120。也就是说,本实施例的伺服装置10是属于盖体300水平盖合于底壳100的款式。
散热装置400包含二气冷式热交换器410及二液冷式热交换器420。二气冷式热交换器410固定并分别热耦合于二热源220。详细来说,每一气冷式热交换器410包含一基部411及多个鳍片部412。基部411例如透过锁丝或卡扣元件固定于电路板210,并热接触于热源220。这些鳍片部412凸出于基部411远离热源220的一侧。
二液冷式热交换器420固定于盖体300,并分别热耦合于二气冷式热交换器410。详细来说,散热装置400更包含二第一导热件440及二第二导热件450及二挠性导热垫460。每一第一导热件440包含二组装段441及一热接触段442。二组装段441分别连接于热接触段442的相对两侧,并固定于气冷式热交换器410的基部411。组装段441呈弯曲状,使得热接触段442呈倾斜设置。二组装段441与热接触段442将这些鳍片部412的部分围绕于内。每一第二导热件450包含二组装段451及一热接触段452。二组装段451分别连接于热接触段452的相对两侧,并固定于液冷式热交换器420。组装段451呈弯曲状,使得热接触段452呈倾斜设置。
挠性导热垫460叠设于第二导热件450的热接触段452,且气冷式热交换器410透过第一导热件440、第二导热件450与挠性导热垫460热耦合于液冷式热交换器420。
在本实施例中,散热装置400还可以包含多个流管430。这些流管430为一体式地组接于液冷式热交换器420,且流管430自二扩充组件230之间的间隙延伸至底壳100外部,使得一体式流管430与外接水管的锁附处位于底壳100外侧,故锁附处漏水时不易造成电子组件200短路。此外,流管430容纳于二扩充组件230之间的间隙,较不易干涉扩充组件230的线材,使得理线设计上更容易。
在本实施例中,流管430固定于盖体300,除了可随盖体300一并移动外,亦不会占据电路板210设置电子元件的空间。不过流管430的固定位置并非用以限制本发明。在其他实施例中,流管亦可固定于底壳。
在本实施例中,伺服装置10还可以包含多个气流产生器500,气流产生器500用以产生一散热气流吹向气冷式热交换器410,以提升气冷式热交换器410与伺服装置10内部空气的热交换效率。
在本实施例中,热源220、气冷式热交换器410、液冷式热交换器420、第一导热件440、第二导热件450及挠性导热垫460的数量为二个,但并不以此为限。在其他实施例中,热源、气冷式热交换器、液冷式热交换器、第一导热件、第二导热件及挠性导热垫的数量也可以改为单个。
在本实施例中,气流产生器500的数量为多个,但并不以此为限。在其他实施例中,气流产生器的数量也可以改为单个。
请参阅图5与图6。图5为图1的伺服装置10的盖体300的作动示意图。图6为图1的伺服装置10的剖面示意图。
由于盖体300的装卸方向垂直于底板110的承载面110的法线方向,故当使用者组装完伺服装置10内部元件而要开始让伺服装置10运行时,则可沿方向A将盖体300下压,并让液冷式热交换器420透过挠性导热垫460、第一导热件440及第二导热件450热耦合于气冷式热交换器410(如图6所示)。当伺服装置10运行时,一方面气流产生器500会产生吹向气冷式热交换器410的散热气流F,以透过散热气流F来将热源220所产生的热能带走。另一方面,第一导热件440与第二导热件450会将热源220所产生的热能沿方向T传递至液冷式热交换器420,再透过流管430转移至伺服装置10外部。如此一来,伺服装置10内可同时并存气冷与水冷两种散热方式,以进一步提高伺服装置10的散热效率。此外,本实施例的散热装置400因结构简单,故较易于导入旧机种。
根据上述实施例的伺服装置,液冷式热交换器固定于盖体,使得液冷式热交换器连接的流管可一并固定于盖体,进而避免占据电路板设置电子元件的空间。
此外,流管容纳于二扩充组件的间的间隙,较不易干涉扩充组件的线材,除了让理线设计上更为容易外,又不会干扰扩充组件的输入输出界面的配置。
此外,这些流管为一体式地组接于液冷式热交换器,且流管自二扩充组件之间的间隙延伸至底壳外部,使得一体式流管与外接水管的锁附处位于底壳外侧,故锁附处漏水时不易造成电子组件短路。
在本发明的一实施例中,本发明的伺服器可用于人工智能(英语:ArtificialIntelligence,简称AI)运算、边缘运算(edge computing),亦可当作5G伺服器、云端伺服器或车联网伺服器使用。
虽然本发明以前述的诸项实施例揭露如上,然其并非用以限定本发明,任何熟习相像技艺者,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,因此本发明的专利保护范围须视本说明书所附的权利要求书所界定的为准。
Claims (10)
1.一种伺服装置,其特征在于,包含:
一底壳;
一电子组件,包含一电路板及至少一热源,所述电路板设置于所述底壳,所述至少一热源设置于所述电路板;
一盖体,可滑移地盖合于所述底壳;以及
一散热装置,包含:
至少一气冷式热交换器,固定并热耦合于所述至少一热源;以及
至少一液冷式热交换器,固定于所述盖体,并热耦合于所述至少一气冷式热交换器。
2.如权利要求1所述的伺服装置,其特征在于,其中所述底壳包含一底板及二侧板,所述二侧板分别连接于所述底板的相对两侧,所述盖体可滑移地设置于所述二侧板。
3.如权利要求1所述的伺服装置,其特征在于,其中所述至少一气冷式热交换器包含一基部及多个鳍片部,所述基部热接触于所述至少一热源,所述些鳍片部凸出于所述基部远离所述至少一热源的一侧。
4.如权利要求2所述的伺服装置,其特征在于,其中所述散热装置更包含至少一第一导热件及至少一第二导热件,所述至少一第一导热件固定于所述至少一气冷式热交换器,且所述至少一第二导热件固定于所述至少一液冷式热交换器,且所述至少一气冷式热交换器透过所述第一导热件及所述至少一第二导热件热耦合于所述至少一液冷式热交换器。
5.如权利要求4所述的伺服装置,其特征在于,其中所述至少一第一导热件及至少一第二导热件各包含二组装段及一热接触段,所述二组装段固定于所述基部,并分别连接于所述热接触段的相对两侧,所述热接触段与所述二组装段将这些所述鳍片部的部分围绕于内。
6.如权利要求4所述的伺服装置,其特征在于,更包含至少一挠性导热垫,设置于所述至少一液冷式热交换器,且所述至少一液冷式热交换器透过所述及至少一第二导热件与所述至少一挠性导热垫热耦合于所述至少一第一导热件。
7.如权利要求1所述的伺服装置,其特征在于,其中所述散热装置更包含至少一流管,所述至少一流管为一体式地组接于所述至少一液冷式热交换器。
8.如权利要求7所述的伺服装置,其特征在于,其中所述电子组件更包含二扩充组件,所述至少一流管自所述二扩充组件之间的间隙延伸至所述底壳外部。
9.如权利要求7所述的伺服装置,其特征在于,其中所述至少一流管固定于盖体。
10.如权利要求1所述的伺服装置,其特征在于,更包含一气流产生器,所述气流产生器用以产生一散热气流吹向所述至少一气冷式热交换器。
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US6483707B1 (en) * | 2001-06-07 | 2002-11-19 | Loctite Corporation | Heat sink and thermal interface having shielding to attenuate electromagnetic interference |
US6734371B2 (en) * | 2001-09-28 | 2004-05-11 | Intel Corporation | Soldered heat sink anchor and method of use |
US6480387B1 (en) * | 2002-03-14 | 2002-11-12 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
TWI257285B (en) * | 2005-04-11 | 2006-06-21 | Delta Electronics Inc | Heat-dissipating module of electronic device |
CN1988785A (zh) * | 2005-12-23 | 2007-06-27 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
JP2009200347A (ja) * | 2008-02-22 | 2009-09-03 | Toshiba Corp | 電子機器 |
EP2321607A1 (en) * | 2008-08-04 | 2011-05-18 | Clustered Systems Company | A contact cooled electronic enclosure |
US20110061847A1 (en) * | 2009-09-11 | 2011-03-17 | Meng-Hsiu Hsieh | Heat dissipation device |
CN105700637A (zh) * | 2014-11-27 | 2016-06-22 | 英业达科技有限公司 | 服务器机箱 |
US11287192B2 (en) * | 2015-10-08 | 2022-03-29 | Furukawa Electric Co., Ltd. | Heat sink |
JP6611203B2 (ja) * | 2017-10-20 | 2019-11-27 | Necプラットフォームズ株式会社 | モジュール、サーバ |
US10375863B2 (en) * | 2017-11-28 | 2019-08-06 | Dell Products, L.P. | Liquid cooled chassis |
US10721842B1 (en) * | 2019-07-29 | 2020-07-21 | Hewlett Packard Enterprise Development Lp | Flexible thermal cooling assembly |
US11129303B1 (en) * | 2020-02-27 | 2021-09-21 | Cisco Technology, Inc. | Cooling of server high-power devices using double-base primary and secondary heat sinks |
US11350546B2 (en) * | 2020-08-03 | 2022-05-31 | Quanta Computer Inc. | Server with reconfigurable front and rear access |
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