JP4371210B2 - 電子ユニットおよびその放熱構造 - Google Patents
電子ユニットおよびその放熱構造 Download PDFInfo
- Publication number
- JP4371210B2 JP4371210B2 JP2003406653A JP2003406653A JP4371210B2 JP 4371210 B2 JP4371210 B2 JP 4371210B2 JP 2003406653 A JP2003406653 A JP 2003406653A JP 2003406653 A JP2003406653 A JP 2003406653A JP 4371210 B2 JP4371210 B2 JP 4371210B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- reinforcing plate
- electronic unit
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
6、6a、6b、6c 電子ユニット
12 プリント基板
17 上方補強板兼放熱器
17a 通気孔
18 下方補強板兼放熱器
18a 通気孔
19 電子部品
20 吸熱体
21 ヒートパイプ
30 吸熱体
31 熱伝導シート
40 吸熱体
41 放熱循環パイプ 42 上方放熱部分
43 後方放熱部分
44 下方放熱部分
45 強制循環ポンプ
46 U字状部分
Claims (6)
- 発熱部品を所定位置に搭載したプリント基板を有し電子装置架台に垂直に装着される電子ユニットにおいて、
前記プリント基板の上端および下端の少なくとも一方に固定された補強板と、
前記発熱部品の発熱を前記補強板に伝導する熱伝導手段と、
を有し、
前記熱伝導手段は、
前記発熱部品上に密着した吸熱体と、
前記吸熱体を貫通し前記プリント基板の外周部に沿って配設され、前記補強板に接触固定され、内部に封入された流体が前記吸熱体内を通過し、前記補強板に沿って流れ、前記吸熱体に帰還する循環路を形成する放熱循環パイプと、
を有することを特徴とする電子ユニット。 - 前記補強板には複数の通気孔が形成されていることを特徴とする請求項1に記載の電子ユニット。
- 前記流体を前記放熱循環パイプ内で強制的に循環させるポンプを更に設けたことを特徴とする請求項1または2に記載の電子ユニット。
- 発熱部品を所定位置に搭載したプリント基板を有し電子装置架台に垂直に装着される電子ユニットの放熱構造において、
前記プリント基板の上端および下端の少なくとも一方に固定されたL字状の補強板兼放熱板と、
前記発熱部品の発熱を前記L字状の補強板兼放熱板に伝導する熱伝導手段と、
を有し、
前記熱伝導手段は、
前記発熱部品上に密着した吸熱体と、
前記吸熱体を貫通し前記プリント基板の外周部に沿って配設され、前記補強板兼放熱板に接触固定され、内部に封入された流体が前記吸熱体内を通過し、前記補強板兼放熱板に沿って流れ、前記吸熱体に帰還する循環路を形成する放熱循環パイプと、
を有することを特徴とする電子ユニットの放熱構造。 - 前記補強板兼補強板には複数の通気孔が形成されていることを特徴とする請求項4に記載の電子ユニットの放熱構造。
- 前記流体を前記放熱循環パイプ内で強制的に循環させるポンプを更に設けたことを特徴とする請求項4または5に記載の電子ユニットの放熱構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003406653A JP4371210B2 (ja) | 2003-12-05 | 2003-12-05 | 電子ユニットおよびその放熱構造 |
CNB2004100912988A CN100484377C (zh) | 2003-12-05 | 2004-12-01 | 电子卡单元及用于除去印刷电路板上发热组件热量的方法 |
GB0426559A GB2409583B (en) | 2003-12-05 | 2004-12-02 | Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board |
US11/003,403 US7397662B2 (en) | 2003-12-05 | 2004-12-06 | Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003406653A JP4371210B2 (ja) | 2003-12-05 | 2003-12-05 | 電子ユニットおよびその放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005167102A JP2005167102A (ja) | 2005-06-23 |
JP4371210B2 true JP4371210B2 (ja) | 2009-11-25 |
Family
ID=34056293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003406653A Expired - Fee Related JP4371210B2 (ja) | 2003-12-05 | 2003-12-05 | 電子ユニットおよびその放熱構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7397662B2 (ja) |
JP (1) | JP4371210B2 (ja) |
CN (1) | CN100484377C (ja) |
GB (1) | GB2409583B (ja) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7508672B2 (en) * | 2003-09-10 | 2009-03-24 | Qnx Cooling Systems Inc. | Cooling system |
US7187549B2 (en) * | 2004-06-30 | 2007-03-06 | Teradyne, Inc. | Heat exchange apparatus with parallel flow |
US7719837B2 (en) * | 2005-08-22 | 2010-05-18 | Shan Ping Wu | Method and apparatus for cooling a blade server |
JP2007129183A (ja) * | 2005-10-03 | 2007-05-24 | Sumitomo Electric Ind Ltd | 冷却部材 |
US7369412B2 (en) * | 2006-05-02 | 2008-05-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8879254B2 (en) * | 2007-06-08 | 2014-11-04 | Raytheon Company | Methods and apparatus for compact active cooling |
EP2061296B1 (en) * | 2007-11-16 | 2014-05-14 | GE Aviation Systems LLC | Conduction cooled circuit board assembly |
US8223494B2 (en) * | 2007-12-31 | 2012-07-17 | General Electric Company | Conduction cooled circuit board assembly |
FR2925254B1 (fr) * | 2007-12-18 | 2009-12-04 | Thales Sa | Dispositif de refroidissement d'une carte electronique par conduction a l'aide de caloducs,et procede de fabrication correspondant. |
CN102065666A (zh) * | 2009-11-12 | 2011-05-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
US8077460B1 (en) | 2010-07-19 | 2011-12-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same |
US8199505B2 (en) | 2010-09-13 | 2012-06-12 | Toyota Motor Engineering & Manufacturing Norh America, Inc. | Jet impingement heat exchanger apparatuses and power electronics modules |
US8659896B2 (en) | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
CN101969754B (zh) * | 2010-10-01 | 2012-11-21 | 苏州佳世达电通有限公司 | 冷却装置 |
US8644020B2 (en) * | 2010-12-01 | 2014-02-04 | Google Inc. | Cooling heat-generating electronics |
FR2969379B1 (fr) * | 2010-12-17 | 2013-02-15 | Thales Sa | Refroidissement d'un equipement electronique |
US8427832B2 (en) | 2011-01-05 | 2013-04-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
US8391008B2 (en) | 2011-02-17 | 2013-03-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics modules and power electronics module assemblies |
US8482919B2 (en) | 2011-04-11 | 2013-07-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics card assemblies, power electronics modules, and power electronics devices |
US20120279683A1 (en) * | 2011-05-05 | 2012-11-08 | Alcatel-Lucent Usa Inc. | Cooling apparatus for communications platforms |
DE102011082352A1 (de) * | 2011-09-08 | 2013-03-14 | Siemens Aktiengesellschaft | Vorrichtung und Verfahren zum Kühlen einer Einrichtung |
WO2013157117A1 (ja) * | 2012-04-19 | 2013-10-24 | 株式会社日立製作所 | 冷却システムを備えた電子計算機 |
JP5775062B2 (ja) | 2012-12-27 | 2015-09-09 | レノボ・シンガポール・プライベート・リミテッド | 電子機器および電子機器システム |
US8643173B1 (en) | 2013-01-04 | 2014-02-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features |
US9426932B2 (en) * | 2013-03-13 | 2016-08-23 | Silicon Graphics International Corp. | Server with heat pipe cooling |
US9612920B2 (en) | 2013-03-15 | 2017-04-04 | Silicon Graphics International Corp. | Hierarchical system manager rollback |
US9131631B2 (en) | 2013-08-08 | 2015-09-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Jet impingement cooling apparatuses having enhanced heat transfer assemblies |
US9398731B1 (en) | 2014-09-23 | 2016-07-19 | Google Inc. | Cooling electronic devices in a data center |
US9370090B2 (en) * | 2014-09-29 | 2016-06-14 | General Electric Company | Circuit card assembly and method of manufacturing thereof |
US10448543B2 (en) | 2015-05-04 | 2019-10-15 | Google Llc | Cooling electronic devices in a data center |
US10462935B2 (en) | 2015-06-23 | 2019-10-29 | Google Llc | Cooling electronic devices in a data center |
US10080067B2 (en) * | 2015-12-31 | 2018-09-18 | Infinera Corporation | Heat relay network system for telecommunication equipment |
US10349561B2 (en) | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
TWI636724B (zh) * | 2017-03-01 | 2018-09-21 | 雙鴻科技股份有限公司 | 具有散熱功能的電子設備及其水冷排總成 |
US10080311B1 (en) * | 2017-06-09 | 2018-09-18 | Rockwell Collins, Inc. | Modular enclosure with angled heat sink fins |
CN107371351A (zh) * | 2017-08-16 | 2017-11-21 | 合肥宗平计算机科技有限公司 | 显卡背板及其显卡 |
US10204659B1 (en) * | 2018-04-14 | 2019-02-12 | Microsoft Technology Licensing, Llc | Hard disk drive backplane for immersion-cooled circuit board |
US20220312622A1 (en) * | 2021-03-25 | 2022-09-29 | Baidu Usa Llc | Server chassis design for high power density electronics thermal management |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE8003579L (sv) * | 1980-05-13 | 1981-11-14 | Ericsson Telefon Ab L M | Kylanordning for diskreta eller pa kretskort monterade elektroniska komponenter |
US4366526A (en) * | 1980-10-03 | 1982-12-28 | Grumman Aerospace Corporation | Heat-pipe cooled electronic circuit card |
JPS63152200A (ja) | 1986-12-17 | 1988-06-24 | 富士通株式会社 | 電子装置における発熱部品の放熱構造 |
US5285347A (en) | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
JP2795289B2 (ja) * | 1990-09-04 | 1998-09-10 | 富士通株式会社 | 電子機器におけるプリント板ユニットの保持構造 |
US5684674A (en) * | 1996-01-16 | 1997-11-04 | Micronics Computers Inc. | Circuit board mounting brackets with convective air flow apertures |
JP2874684B2 (ja) | 1997-03-27 | 1999-03-24 | 日本電気株式会社 | プラグインユニットの放熱構造 |
JPH11163565A (ja) * | 1997-11-27 | 1999-06-18 | Ando Electric Co Ltd | プリント基板の冷却構造 |
US6239972B1 (en) * | 1999-12-13 | 2001-05-29 | Honeywell International Inc. | Integrated convection and conduction heat sink for multiple mounting positions |
US6590768B1 (en) * | 2000-07-05 | 2003-07-08 | Network Engines, Inc. | Ventilating slide rail mount |
JP3565767B2 (ja) * | 2000-07-19 | 2004-09-15 | トラストガード株式会社 | カートリッジ型サーバユニットおよび該サーバユニット搭載用筐体ならびにサーバ装置 |
WO2002080270A1 (en) | 2001-03-30 | 2002-10-10 | Thermotek, Inc. | Cooling apparatus having low profile extrusion |
US6657121B2 (en) * | 2001-06-27 | 2003-12-02 | Thermal Corp. | Thermal management system and method for electronics system |
JP2003218572A (ja) * | 2002-01-28 | 2003-07-31 | Nec Corp | 屋外装置の放熱方法および装置 |
US6804117B2 (en) * | 2002-08-14 | 2004-10-12 | Thermal Corp. | Thermal bus for electronics systems |
US6839235B2 (en) * | 2002-12-19 | 2005-01-04 | Dy 4 Systems Inc. | Embedded heat pipe for a conduction cooled circuit card assembly |
-
2003
- 2003-12-05 JP JP2003406653A patent/JP4371210B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-01 CN CNB2004100912988A patent/CN100484377C/zh not_active Expired - Fee Related
- 2004-12-02 GB GB0426559A patent/GB2409583B/en not_active Expired - Fee Related
- 2004-12-06 US US11/003,403 patent/US7397662B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005167102A (ja) | 2005-06-23 |
US7397662B2 (en) | 2008-07-08 |
GB2409583B (en) | 2006-03-08 |
GB0426559D0 (en) | 2005-01-05 |
US20050122686A1 (en) | 2005-06-09 |
GB2409583A (en) | 2005-06-29 |
CN100484377C (zh) | 2009-04-29 |
CN1625330A (zh) | 2005-06-08 |
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