USRE48018E1 - Method and arrangement for attaching a chip to a printed conductive surface - Google Patents

Method and arrangement for attaching a chip to a printed conductive surface Download PDF

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USRE48018E1
USRE48018E1 US16/007,530 US201016007530A USRE48018E US RE48018 E1 USRE48018 E1 US RE48018E1 US 201016007530 A US201016007530 A US 201016007530A US RE48018 E USRE48018 E US RE48018E
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chip
conductive surface
printed conductive
printed
substrate
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Juha Maijala
Petri Sirviö
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Digital Tags Finland Oy
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Stora Enso Oyj
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Definitions

  • the present invention relates generally to the technology of connecting an integrated circuit component, also known as a chip, to a surface that comprises conductive patterns. Especially the present invention concerns a case in which said conductive patterns are produced by printing.
  • PCB printed circuit board
  • a traditional, epoxy- or polyester based circuit board is often referred to as a printed circuit board (PCB)
  • PCB printed circuit board
  • the use of (silk screen) printing is limited to producing the etch-resistant ink patterns prior to the etching of unwanted copper, as well as to producing visible markings on the surface of an otherwise completed board.
  • True printed electronics mean that conductive, semiconductive and possibly other patterns that constitute actual functional elements of the electronic circuit are formed on a substrate in a printing process, i.e. printed on the substrate.
  • the dimensions of typical printed electronics are macroscopic, at least compared to the micro- or nanometre scale line widths and other structures encountered in integrated circuits. This means that implementing complex functionalities with printed electronics requires using a relatively large surface area and/or augmenting the actual printed electronics with integrated circuit components or chips. Also the longer designation “semiconductor chip” can be used, but it should be noted that the base of a chip is not always made of semiconductor material: also e.g. glass-, sapphire-, and steel based chips are known, as well as chips printed with semiconductive polymers onto an isolating polymer base. If chips are to be used, there arises the natural need to attach and connect a chip to the printed electronics.
  • the term to attach and its derivatives mean attaching physically, i.e. keeping from coming loose, while the term to connect and its derivatives mean producing an electrically conductive connection. It should be noted, though, that these terms are not mutually exclusive, but a strong enough method like e.g. soldering may be used to simultaneously attach and connect.
  • FIG. 1 illustrates a known method for attaching and connecting a chip 101 to printed electronics, of which there are shown the conductive areas 102 and 103 that have been printed on a substrate 104 .
  • the substrate 104 is paper or cardboard
  • the conductive areas 102 and 103 are pieces of metallic foil (or more generally: areas covered with an essentially metallic compound).
  • solder bumps 105 and 106 are solder bumps 105 and 106 , and corresponding patches of solder flux 107 and 108 have been spread on the conductive areas 102 and 103 .
  • the flux could also have been spread on the solder bumps 105 and 106 , or provided in the material of the solder bumps.
  • a drop of glue 109 has been applied to that surface of the chip 101 that faces the substrate 104 .
  • the glue helps to keep the chip immobilized at the desired location during the time when sufficient heat is applied to cause at least partial melting of the solder bumps.
  • the flux helps to control the flowing of the melted solder. After cooling, the chip remains attached to the substrate, with electric connections established at the locations where the melting solder formed a bond with the appropriate parts of the conductive areas.
  • a disadvantage of the prior art method illustrated in FIG. 1 is that it is relatively slow. It is not uncommon that 10 to 15 seconds are needed to attach and connect a single chip. This may prove way too slow for example for large-scale manufacturing of cardboard-made consumer packages for food supplies.
  • An advantageous feature of embodiments of the present invention is the provision of a method and an arrangement for attaching and connecting a chip to a printed conductive surface quickly, smoothly and reliably.
  • the objectives of the present invention are achieved by using a material with particular melting characteristics to produce at least a part of the printed conductive surface, and by bringing the necessary heat to the bonding phase together with the chip.
  • a printed conductive surface to which a chip should be attached, of a material that has a melting point at a temperature that is lower than what the chip can stand without being damaged.
  • Melting may take place at the printed conductive surface, at a solder bump or other contact area of the chip, or both. The melting may be assisted by pressing the chip against the printed conductive surface with a suitable force.
  • a particular class of embodiments of the present invention involves using a steel- or other metal based chip, which can stand relatively a large strain. Consequently a relatively large force can be used to press the chip against the printed conductive surface, so that in the combination of temperature and pressing force the latter has a significant role in causing the melting at the desired locations.
  • Another particular class of embodiments of the present invention involves using a chip where the base is solely made of silicon or other crystalline matter. Crystalline substances of this kind break relatively easily under strain, which means that only a relatively light force can be used to press the chip against the printed conductive surface. Considering the combination of temperature and pressing force, in this class of embodiments the melting is essentially exclusively caused by the former.
  • One class of embodiments of the present invention involves using a layer of anisotropically conductive glue on the printed conductive surface.
  • Anisotropically conductive glue is initially not electrically conductive to any significant extent. Locally applying heat will cause conductive particles in the glue to melt and form a conductive path through the glue at a particular location.
  • FIG. 1 illustrates a prior art method
  • FIG. 2 illustrates attaching and connecting a chip according to an embodiment of the present invention
  • FIG. 3 illustrates a detail related to melting the material of the printed conductive surface
  • FIG. 4 illustrates a detail related to melting the material of the contact point
  • FIG. 5 illustrates a detail related to the use of anisotropically conductive glue
  • FIG. 6 illustrates an apparatus according to an embodiment of the present invention
  • FIG. 7 illustrates an apparatus according to another embodiment of the present invention
  • FIG. 8 illustrates a printing section
  • FIG. 9 illustrates a method according to an embodiment of the present invention
  • FIG. 10 illustrates an apparatus according to an embodiment of the present invention
  • FIG. 11 illustrates a detail of the apparatus of FIG. 10 .
  • FIG. 12 illustrates another detail of the apparatus of FIG. 10 .
  • FIG. 13 illustrates an apparatus according to an embodiment of the present invention.
  • the chip can be heated to a first temperature, and the heated chip can be pressed against the printed conductive surface with a first pressing force, so that the combination of the first temperature and the first pressing force is sufficient to at least partly melt the material of either the printed conductive surface, or a contact point on the chip, or both.
  • the localization of melting and other phenomena related to melting and attachment of components to each other, and the behaviour of molten and/or nearly molten material can be further controlled through the controlled application of flux.
  • FIG. 2 illustrates an example, in which a substrate 204 comprises one or more printed conductive surfaces, of which the upper surface with patterns 202 and 203 is shown in FIG. 2 .
  • the chip 201 is heated to a first temperature as shown on the left in FIG. 2 .
  • the chip should be workable after connecting, which leads to the natural consequence that said first temperature must be lower than what the chip can stand without being damaged by the heat.
  • the heated chip is pressed against the printed conductive surface with a first pressing force, as illustrated in the middle part of FIG. 2 .
  • the combination of the first temperature and the first pressing force is sufficient to at least partly melt the material of either the patterns 202 and 203 of printed conductive surface, or the contact points 205 and 206 on the chip, or both.
  • the chip becomes both attached and connected to the printed conductive surface, as illustrated on the right in FIG. 2 .
  • the chip 201 comprises a metal base.
  • Kovio Inc. 233 S. Hillview Dr., Milpitas, Calif., USA, provides chips where semiconductor parts made of printed silicon reside on a stainless steel base.
  • Metal-based chips are available from other manufacturers as well, and other metals than stainless steel can be used as the base.
  • a metal-base chip may stand temperatures up to 400 degrees centigrade, and the metal base has also excellent mechanical strength, meaning that it can stand a relatively high strain.
  • the last-mentioned characteristic allows pressing a heated metal-base chip against a printed conductive surface with a pressing force that creates a pressure between 1 and 10 MPa (megapascals), calculated by dividing the pressing force by the surface area of the chip.
  • MPa megapascals
  • metal-based chips allow using a relatively large pressing force, they do not necessarily require it if the process is otherwise made such that a smaller force is enough.
  • the pressure used with metal-based chips could be 0.1 MPa or even less.
  • the surface pressure experienced by the printed conductive surface is highest at those almost point-like areas where the contact points 205 and 206 touch the patterns 202 and 203 respectively.
  • This high local pressure together with the heat conducted to the same regions from the body of the chip 201 , causes localized phenomena related to melting and attachment that produces an essentially solder-type joint at each contact point.
  • the point-like nature of the heat conduction and surface pressure application at the contact points ensures that most of the patterns 202 and 203 remain not melted, which in turn means that the local topology of the contact area remains well organized and does not become messy. This is advantageous, because difficultly controlled large-scale melting of the material of the patterns 202 and 203 could easily create short circuits between parts of the resulting electric circuit that must remain isolated from each other. Especially if the printed conductive surface is not exactly horizontal at the moment of attaching and connecting the chip, and/or if the state of movement of the mechanical system changes causing acceleration forces, large-scale melting of the patterns 202 and 203 could also cause significant portions of the molten conductive material to flow out of its intended position on the surface of the substrate 204 .
  • the pace at which solidifying occurs can be affected by actively controlling an ambient temperature at the location of pressing the heated chip against the printed conductive surface.
  • an ambient temperature at the location of pressing the heated chip against the printed conductive surface.
  • there may be a cooled or otherwise temperature-controlled support below the substrate 204 which quickly absorbs heat by conduction through the patterns 202 and 203 and the substrate 204 .
  • Such a support may take e.g. the form of a roll or a planar support.
  • Another exemplary way of actively controlling an ambient temperature is to deliver cooled gas to an area surrounding or adjacent to the location of pressing the heated chip against the printed conductive surface.
  • the base of the chip 201 can be made of glass or sapphire; or silicon or other crystalline material that is used as a base for semiconductor components.
  • the base of the chip 201 can be made of glass or sapphire; or silicon or other crystalline material that is used as a base for semiconductor components.
  • most other than metallic base materials have a lower mechanical strength, and in many cases also a lower critical temperature that the chip can stand without being damaged by the heat.
  • the process parameters (temperatures, pressing force, handling speed, etc.) need to be carefully selected so that they suit the chip technology that is used.
  • the first temperature, to which the chip is heated is not significantly higher than 200 degrees centigrade; and the first pressing force, with which the chip is pressed against the printed conductive surface, is not significantly larger than 1 megapascal.
  • FIGS. 3 and 4 illustrate two basic approaches to making the solder joint between a chip and a conductive pattern.
  • the contact point 305 is made of a conductive material that has a relatively high melting temperature, such as gold, silver, copper, or aluminium.
  • the melting temperature of the contact point 305 may be the same as with conductive pattern, whereupon both are at least partly melt in the process.
  • the pattern 302 is made of a conductive material that has a relatively low melting temperature, for example of a metallic compound that constitutes or resembles a low-temperature solder.
  • a melting temperature (at least under pressure) of the material of the pattern 302 is lower than the highest temperature that the chip 201 (and the substrate 204 ) can stand without being damaged by the heat.
  • the chip 201 is made sufficiently hot so that the temperature of the contact point 305 , together with the force pressing the chip 201 against the substrate 204 , suffices to locally melt the material of the pattern 302 .
  • the contact point 405 is made of a conductive material that has a relatively low melting temperature, such as a metallic compound that constitutes or resembles a low-temperature solder.
  • the melting temperature of the contact point 305 may be the same as with conductive pattern, whereupon both are at least partly melt in the process.
  • the pattern 402 is made of a conductive material that has a higher melting temperature than the contact point 405 , for example gold, silver, copper, aluminium, or some metallic or non-metallic conductive compound. In this case it is essential that a melting temperature (at least under pressure) of the material of the contact point 405 is lower than the highest temperature that the chip 201 can stand without being damaged by the heat.
  • the substrate 204 does not need to be particularly heat-resistant, because the pattern 402 is between it and the heated chip, and because the heat of the chip can be kept from advancing to the substrate in any excessive amount by selecting the temperatures, forces, time durations, support structure characteristics and/or ambient cooling suitably.
  • the chip 201 is made sufficiently hot so that the temperature of the contact point 405 , together with the force pressing the chip 201 against the substrate 204 , suffices to locally melt the material of the contact point 405 .
  • FIGS. 3 and 4 Cross-breeds between the embodiments of FIGS. 3 and 4 are possible, either so that melting occurs at least partly both in a contact point and in the printed conductive surface it touches, or so that a chip has contact points made of different materials, and it is attached to a number of patterns of different materials on the printed conductive surfaces, so that in some of the contact point—pattern pairs melting occurs in the former, and in others in the latter.
  • the contact point of a chip is not necessarily bump-formed or protruding to any significant extent.
  • chips that have their contact points formed as conductive pads on a surface that otherwise has been oxidized or otherwise made unconductive.
  • bump-like contact points may involve advantages in controlling the pressure distribution at the zone where melting is to occur, for the purposes of the present invention it is not important, how the contact points of the chips are formed.
  • FIG. 5 illustrates yet another alternative embodiment, in which attaching and connecting a chip to a printed conductive surface is accomplished with the help of anisotropically conductive glue.
  • a printed conductive surface which comprises a conductive pattern 501 and a layer 502 of anisotropically conductive glue.
  • the last-mentioned originally comprises a large number of conductive particles, typically of the size of 5-50 micrometres in diameter, each enclosed inside an isolating layer or otherwise manufactured so that they do not make conductive connections with each other.
  • sufficient heat typically 75-140 degrees centigrade
  • the isolating layer and/or a viscous agent mixed with the particles is sticky in order to realize the glueing function.
  • a heated contact point 205 of a chip comes into contact with the layer 502 of anisotropically conductive glue, it dissolves, burns, evaporates, or otherwise destroys the isolating layer, or produces another reaction that causes the particles to become macroscopically conductive, in a number of conductive particles in the vicinity.
  • the conductive particles that are affected form an electrically conductive connection 503 between the contact point and the conductive pattern.
  • the glueing function of that part of the anisotropically conductive glue where the isolating layers are still intact (or where some of the viscous agent remains) may be utilized to assist attaching the chip in place.
  • the glueing function may be utilized at parts of the chip that are not adjacent to the contact point.
  • the heat brought along by the chip may be sufficient to melt those conductive particles that constitute the conductive connection, which makes it essentially a solder joint.
  • anisotropically conductive glue limiting the melting to small areas around the contact points was advantageous because it helped to avoid unwanted smearing of other conductive parts of the circuit. Also with anisotropically conductive glue, it is advantageous (if not even essential) to limit the reaction where the particles become to form a macroscopically conductive connection to only small areas around the contact points, but for a slightly different reason. Avoiding the smearing of other inherently conductive parts of the circuit is not such an issue, because anisotropically conductive glue is not macroscopically conductive before the application of sufficient heat. However, it is advantageous to keep it that way, i.e.
  • anisotropically conductive glue may even be spread as a continuous layer across the whole printed conductive surface. Applying continuous layers, or at least avoiding the need for very carefully designed, patterned layers, is typically advantageous in printing, because it may eliminate and/or simplify patterning steps from the manufacturing process and thus make it cheaper and technically simpler.
  • FIG. 6 illustrates schematically an apparatus for attaching a chip to a printed conductive surface.
  • the apparatus has been built as a part of a larger printing process.
  • a substrate web is unrolled from an input roll 601 , and fed through an optional tension controller 602 to a nip where the substrate web passes between an impression roll 603 and a corresponding support roll 604 .
  • a printing arrangement 605 is configured to interact with the impression roll 603 so that as a result, the impression roll 603 produces a printed conductive surface on the substrate web, typically comprising a number of conductive patterns.
  • Various technologies exist for producing a printed conductive surface on a substrate web and they are outside the scope of the present invention, so they do not need to be discussed here in more detail. Examples of such technologies are known for example from the PCT publication number WO2009/135985.
  • Semiconductor chips have been previously manufactured and arranged in a particular pattern, which corresponds to the patterning of said printed conductive surface, on a carrier band.
  • the carrier band is unwound from a carrier band roll 606 at a speed that is synchronized with the propagation speed of the substrate web.
  • An optional flux application arrangement 607 may be provided for applying flux to selected parts (typically the exposed contact points) of the chips on the carrier band. It is also possible that flux has been applied to the contact points of the chips already previously before winding the carrier band on the carrier band roll 606 . In some embodiments flux may not be needed at all, but in many cases it is advantageous because it helps to focus the subsequent melting of solder (or particles of anisotropically conductive glue) to the desired locations.
  • the substrate web with its printed conductive surface, and the carrier band with the chips it carries, are both taken to a nip between a heated roll 609 and a support roll 610 .
  • the flux may be applied on the conductive pattern especially to areas where the chip contact points are to be located and/or attached.
  • An optional tension controller 608 is shown to control the tension of the substrate web.
  • the carrier band comes into contact with the heated roll 609 earlier than the substrate web, causing the chips on the carrier band to be heated to a predetermined first temperature, which is lower than what the chips can stand without being damaged by the heat.
  • the substrate and/or the conductive pattern may be preheated before the chip attachment. For example an antenna is warm after its printing process, whereafter if the antenna is then still kept warm, it is already preheated for the chip attachment, whereupon the later chip attachment with the antenna is much more easier and faster. In addition the preheated antenna reduces the need of additional heating.
  • the printed conductive surface and/or substrate may be preheated for example to temperatures between 25-200 degrees centigrade before attaching the chip to the printed conductive pattern.
  • the chip can also be attached without heating the substrate and/or conductive pattern, whereupon the needed heat energy is transferred by, from or via the chip.
  • the chip may be for example preheated.
  • the heated chips carried by the carrier band become pressed against the printed conductive surface with a first pressing force.
  • a combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of the printed conductive surface and/or the contact point on a chip.
  • the temporary attachment of the chips to the carrier band is such that the chips become detached from the band web simultaneously when they become attached to the printed conductive surface.
  • the remaining carrier band is collected on a collector roll 611 .
  • the printed conductive surface with the chips attached thereto is optionally cooled with a cooling gas flow from a nozzle 612 , and also optionally protected with a layer of protective lacquer sprayed from another nozzle 613 before winding the chip-equipped substrate onto an output roll 614 .
  • FIG. 7 illustrates schematically another apparatus for attaching a chip to a printed conductive surface.
  • the apparatus has again been built as a part of a larger process, which includes printing and other operations for manufacturing a product, such as an intelligent package.
  • Sheets of a substrate material, such as cardboard are brought to the process on an input tray 701 .
  • One sheet at a time is input to the process on a conveyor 702 .
  • a printing machine 703 such as a digital printer or an apparatus known from WO2009/135985, is used to form a printed conductive surface on the substrate sheet.
  • the printed conductive surface may comprise for example conductive patterns that are designed to function as parts of electric circuits.
  • the apparatus for attaching the chips to the printed conductive surface comprises one or more manipulator arms, of which arm 705 is shown as an example.
  • the apparatus is configured to use a manipulator arm to pick a chip from the tray and to place the chip at a correct location on the printed conductive surface.
  • a combination of the temperature of the chip and the pressing force used to press it against the printed conductive surface is sufficient to at least partly melt the material of either the printed conductive surface, or a contact point on the chip, or both.
  • the tray 704 may comprise a heater configured to heat at least some of the chips on the tray.
  • the manipulator arm 705 used to transfer the chip from the tray to the printed conductive surface may comprise an integrated heater configured to transfer heat to the picked chip, or there may be a separate heater apparatus or heating zone through which the manipulator arm is configured to take the chip on its way from the tray to the printed conductive surface.
  • this embodiment of the invention allows controlling the temperature and/or pressing force of each chip very accurately. It is even possible to use the very same apparatus to simultaneously (or in close succession) attach and connect chips that require different temperatures, different pressing forces and/or other kind of different handling.
  • Using a manipulator arm to press the chip against the printed conductive surface involves the additional advantage that the time during which the manipulator arm keeps the chip in place before letting go can be selected relatively freely.
  • the embodiment of FIG. 7 allows using the manipulator arm to keep the chip in place until the melted parts of the printed conductive surface and/or the contact point on the chip have solidified again, which significantly reduces the risk of creeping type alignment errors.
  • Local cooling can be used if necessary to accelerate the cooling, for example in the form of a locally administrated cooling gas jet or a conductive cooling arrangement integrated in the manipulator arm.
  • the process may include optional additional processing steps, of which the spreading of a protective lacquer with a nozzle 706 and cutting the substrate sheet with a cutting machine 707 are shown in FIG. 7 .
  • Other possible additional processing steps include but are not limited to creasing, glueing, bending, and the adding of additional electronics, like an RFID tag.
  • Completed workpieces are collected on an output tray 708 .
  • FIG. 8 illustrates schematically a printing section, which has been illustrated only schematically as 603 , 604 , and 605 in FIGS. 6 and 703 in FIG. 7 .
  • a first section 801 is configured to print patterns 802 and 803 of an adhesive on the surface of a substrate 804 .
  • a fluidized powderbed or some other kind of particle applicator 807 has been configured to temporarily cover the electrically charged surface of the dielectric transfer roll 805 with a continuous layer of conductive particles.
  • the surface of the substrate with the patterns of the adhesive is arranged to come into contact with the continuous layer of conductive particles on the electrically charged surface of the dielectric transfer roll. Electrically conductive particles stick to the adhesive patterns, thus constituting the basis for the conductive patterns and in general the printed conductive surface.
  • the advantageous characteristics of conductivity of the conductive patterns can be enhanced by subsequently cold rolling them like in the nip 809 of FIG. 8 , and/or by heating them so that at least partial melting of the conductive particles occurs.
  • FIG. 9 is a general representation of a method according to an embodiment of the invention.
  • Step 901 represents manufacturing a semiconductor chip; correspondingly step 902 represents manufacturing a substrate which in the completed construction will form the basis on which the combination of a printed conductive surface and the chip attached and connected thereto will appear.
  • Steps 903 and 904 represent preparing the chip and the substrate respectively.
  • preparing the chip at step 903 may comprise placing the chip onto a tray or a carrier band, and possibly also applying flux to selected locations of the chip.
  • Preparing the substrate at step 904 may comprise cleaning the surface of the substrate and/or otherwise ensuring that the surface of the substrate is ready for receiving printed conductive patterns.
  • Step 905 represents heating the chip to a first temperature, which is lower than what the chip can stand without being damaged by the heat.
  • step 906 represents forming the printed conductive surface, which typically means forming conductive patterns on a surface of the substrate in a printing process.
  • the heated chip is pressed against the printed conductive surface with a first pressing force.
  • a combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of the printed conductive surface and/or a contact point on the chip.
  • Step 908 represents post-processing, non-limiting examples of which have been considered in the description of FIGS. 6 and 7 .
  • FIG. 10 is a top view of an exemplary apparatus according to an embodiment of the invention.
  • the task of the apparatus is to attach and connect a semiconductor chip to each piece of printed electronics that travels through the apparatus.
  • the pieces of printed electronics are loop-formed antennae, but the same principle is naturally applicable irrespective of what are the exact nature and form of the semiconductor chips and the pieces of printed electronics.
  • the apparatus should post-process the printed electronics to ensure that they are ready for use as e.g. RFID tags.
  • the main sections of the apparatus is the chip attaching and connecting section 1001 , the slitter winder section 1002 , the lacquer deposition section 1003 and the testing unit 1004 .
  • the slitter winder section 1002 is configured to cut a substrate carrying the workpieces into smaller parts for easier further handling
  • the lacquer deposition section 1003 is configured to spread a layer of protective lacquer on the workpieces
  • the testing unit 1004 is configured to test the workpieces for appropriate operation.
  • the semiconductor chips are brought to the process on a tray, of which tray 1005 is shown as an example.
  • the semiconductor chips may have been manufactured as parts of a silicon wafer, for example a 6 inches or 12 inches wafer, and cut loose to make them ready for picking.
  • the step of cutting loose individual semiconductor chips from the wafer may be integrated as a part of the chip attaching and connecting section 1001 .
  • FIG. 11 illustrates a principle according to which a so-called pick-flip manipulator 1101 picks a chip 1102 and flips over so that the chip 1102 is offered to a next handling step.
  • FIG. 11 illustrates a principle according to which a so-called pick-flip manipulator 1101 picks a chip 1102 and flips over so that the chip 1102 is offered to a next handling step.
  • FIG. 12 illustrates a principle according to which a place-and-press manipulator 1201 takes the chip offered by the pick-flip manipulator 1101 and applies flux to its desired portions for example by bringing the chip close enough to a rotating flux applicator 1202 in a desired manner.
  • the right part of FIG. 12 illustrates a place-and-press manipulator placing a semiconductor chip at the right location in the piece of printed electronics and pressing it against the printed conductive surface in order to implement the combined attaching and connecting according to an embodiment of the invention.
  • heating the chip to a first temperature can be accomplished in many ways: for example by applying heat through the place-and-press manipulator 1201 , and/or through a heater element 1203 below the workpiece, and/or by using a heated gas jet or a radiation heater, which are not shown in FIG. 12 .
  • element 1203 can be considered to illustrate a back support that supports the substrate and workpieces during the time when the chip is pressed against the printed conductive surface.
  • the place-and-press manipulator implements pressing the heated chip against the printed conductive surface with a first pressing force. A combination of the first temperature and the first pressing force is sufficient to at least partly melt the material of the printed conductive surface and/or a contact point on the chip.
  • a first exemplary setup involved a substrate web the width (i.e. the dimension in the direction perpendicular to the arrow indicating propagating direction in FIG. 10 ) of which was half of that illustrated in FIG. 10 . It carried two parallel lines of antennae (instead of the four parallel lines shown in FIG. 10 ), each line having 16 antennae per metre of length of the substrate. The substrate propagated in the direction illustrated with the arrow in FIG. 10 at a speed of 12 centimetres per second, which equals 7.2 metres per minute.
  • Chips were brought to the process on a single wafer.
  • the place-and-press manipulators were made movable so that they could keep a chip in place at its desired location on the printed conductive surface for the duration of one second. This was found sufficient to cause the chip to be attached and connected. Due to parallel operation in the two lines, the production rate was 32 units per metre times 7.2 metres per minute, equalling 224 manufactured units per minute or 13440 manufactured units per hour.
  • a second exemplary setup was otherwise equal with the first, but it involved a substrate web twice as wide, with four parallel lines of antennae, chips on two wafers, as well as two parallel pick-flip manipulator and place-and-press manipulator units, making the configuration identical to that shown in FIG. 10 .
  • the production rate was twice that of the first example, equalling 26880 manufactured units per hour.
  • Image recognition capability would be advantageously built into the apparatus of FIG. 10 in order to enable continuous and accurate position control in placing the chips.
  • One alternative is to have two assembly heads per antenna, one of them performing image recognition while the other picks and places the chip.
  • infrared heating was applied to heat chips that are waiting to be picked.
  • the place-and-press manipulators were heated, resulting in a chip temperature between 150 and 180 degrees centigrade at the time of pressing the chip against the printed conductive surface.
  • accurate local injection or spraying of flux was considered. It is considered possible to reduce the time that is required to keep a chip in place at its desired location on the printed conductive surface from one second to 0.3 seconds or even less.
  • the value 0.3 seconds would allow shortening the distance that the place-and-press manipulator moves along with the substrate from 12 centimetres (required above by the propagating speed 12 cm per second) to about 4 centimetres; or alternatively it would allow increasing the propagation speed of the substrate from 12 cm per second to about 36 centimetres per second.
  • the last-mentioned alternative would naturally increase the production rate to three times that mentioned above.
  • Buffered operation may be used, so that the substrate is stationary in relation to the chip attaching and connecting mechanism for the short time it takes to attach and connect a chip, and possibly then accelerates to a higher than average speed for a moment so that despite of the stopover, a desired average speed of production is maintained.
  • Buffered operation is generally considered to allow reaching better accuracy, because there are fewer degrees of freedom in the movements that need to be controlled during attaching and connecting a chip.
  • the temperatures mentioned above were related to a particular selection of the substance used to produce the conductive patterns on the substrate.
  • the mentioned lower limit of 150 degrees could be significantly lowered by selecting for example an alloy of tin, bismuth, and indium, which has a melting point at about 75 degrees centigrade.
  • Chips that were considered were RFID chips, some exemplary brands of which are the TI GEN2, HIGGS, MONZA2, and UCODE G2X in the UHF (ultrahigh frequency) range and the MIFARE UL and UCODE G2X in the HF (high frequency) range.
  • the largest considered chip size was 7 mm times 2 mm, but it is believed to be advantageous if the apparatus has small die handling capacity down to 0.3 mm.
  • the associated die thickness was between 0.07 and 0.5 mm, and bump height on the chips was between 10 and 30 micrometres. Using a relatively large chip of 10 square millimetres as an example, a pressing force between 0.2 and 5 newtons means a pressure between 0.02 and 0.5 megapascals.
  • Assembling accuracy was required to have its so-called 3sigma value smaller than 100 micrometres, and the orientation accuracy was required to be ⁇ 30 degrees or lower.
  • the process was suitable for both 6 inches and 12 inches wafers, and it specifically did not use any adhesive, neither conductive nor non-conductive (ACP/NCP; anisotropically conductive paste/non-conductive paste).
  • the protective lacquer was applied after the attaching and connecting of the chips.
  • As substrates, coated paper and cardboard were considered.
  • the testing unit could advantageously be one that is capable of both HF testing and UHF testing.
  • FIG. 13 is a schematic side view of an apparatus according to an embodiment of the invention.
  • a substrate 1301 has at least one printed conductive surface, on which conductive patterns 1302 appear.
  • the task of the apparatus is here to attach and connect one chip to each conductive pattern; chip 1303 is shown as an example.
  • Chips originally come on a dicing membrane 1304 , which has a release polymer coating (not separately shown in FIG. 13 ).
  • the chips are transferred onto a transfer film 1305 , the lower surface of which is covered with thermally releasing adhesive. It is also possible to manufacture the whole transfer film of a thermally decomposable material. If chips are originally available on a membrane that has (or the surface adhesive of which has) suitable release properties, it is not necessary to transfer the chips from one membrane to another for the purposes of this process.
  • the transfer film 1305 brings the chips close to the conductive patterns on the printed conductive surface.
  • a heat applicator 1306 “shoots” the chip off the transfer film 1305 by providing some very accurately localized heating.
  • the amount of heat transferred is enough to release the chip from the transfer film and also enough to heat the chip to a first temperature, which is lower than what the chip can stand without being damaged by the heat but high enough to work in favour of attaching and connecting the chip.
  • the heated chip is pressed against the printed conductive surface with a first pressing force either by the heat applicator 1306 or by a separate pressing means (not separately shown in FIG. 13 ).
  • the speed at which the released chip is shot off the transfer film is high enough to cause the occurrence of a decelerating force when the chip hits the printed conductive surface, so that the decelerating force is simultaneously the pressing force.
  • a combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of the printed conductive surface and/or a contact point on the chip.
  • the remaining transfer film is removed from the process, and the substrate with its chip-equipped printed conductive surface is taken to further processing steps, which may resemble e.g. those that were described earlier as steps 1002 , 1003 , and 1004 in FIG. 10 .
  • “shooting” chips from the transfer film to the printed conductive surface may be used for only putting the chips in place, after which there would be a separate step in the process that applied the heat and the pressing force that eventually cause the chip to be attached and connected.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
US16/007,530 2010-10-14 2010-10-14 Method and arrangement for attaching a chip to a printed conductive surface Active 2031-03-05 USRE48018E1 (en)

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WO2012049352A1 (en) 2012-04-19
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RU2563971C2 (ru) 2015-09-27
BR112013009147B1 (pt) 2020-09-24
JP6038035B2 (ja) 2016-12-07
AU2010362421A1 (en) 2013-05-02
US20130255079A1 (en) 2013-10-03
MY168368A (en) 2018-10-31
EP2628370A1 (en) 2013-08-21
KR20170130614A (ko) 2017-11-28
BR112013009147A2 (pt) 2016-07-26
KR101941679B1 (ko) 2019-01-24
US9629255B2 (en) 2017-04-18
CN103190206A (zh) 2013-07-03
KR20130138264A (ko) 2013-12-18
EP2628370A4 (en) 2017-08-02
MX2013004101A (es) 2013-07-17
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JP2013539921A (ja) 2013-10-28
AU2010362421B2 (en) 2015-06-25

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