JP3989794B2 - Ｌｅｄ照明装置およびｌｅｄ照明光源 - Google Patents

Ｌｅｄ照明装置およびｌｅｄ照明光源 Download PDF

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Publication number
JP3989794B2
JP3989794B2 JP2002231765A JP2002231765A JP3989794B2 JP 3989794 B2 JP3989794 B2 JP 3989794B2 JP 2002231765 A JP2002231765 A JP 2002231765A JP 2002231765 A JP2002231765 A JP 2002231765A JP 3989794 B2 JP3989794 B2 JP 3989794B2
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JP
Japan
Prior art keywords
led
substrate
light source
led illumination
illumination light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002231765A
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English (en)
Japanese (ja)
Other versions
JP2003124528A (ja
JP2003124528A5 (enrdf_load_stackoverflow
Inventor
正則 清水
正 矢野
龍海 瀬戸本
伸幸 松井
哲志 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Filing date
Publication date
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Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002231765A priority Critical patent/JP3989794B2/ja
Publication of JP2003124528A publication Critical patent/JP2003124528A/ja
Publication of JP2003124528A5 publication Critical patent/JP2003124528A5/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022—Pocket lamps
    • F21L4/027—Pocket lamps the light sources being a LED
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2002231765A 2001-08-09 2002-08-08 Ｌｅｄ照明装置およびｌｅｄ照明光源 Expired - Lifetime JP3989794B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002231765A JP3989794B2 (ja) 2001-08-09 2002-08-08 Ｌｅｄ照明装置およびｌｅｄ照明光源

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001242857 2001-08-09
JP2001-242857 2001-08-09
JP2002231765A JP3989794B2 (ja) 2001-08-09 2002-08-08 Ｌｅｄ照明装置およびｌｅｄ照明光源

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2005088767A Division JP4180576B2 (ja) 2001-08-09 2005-03-25 Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源
JP2005088853A Division JP2005235779A (ja) 2001-08-09 2005-03-25 Ｌｅｄ照明装置およびカード型ｌｅｄ照明光源

Publications (3)

Publication Number Publication Date
JP2003124528A JP2003124528A (ja) 2003-04-25
JP2003124528A5 JP2003124528A5 (enrdf_load_stackoverflow) 2006-04-06
JP3989794B2 true JP3989794B2 (ja) 2007-10-10

Family

ID=26620316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002231765A Expired - Lifetime JP3989794B2 (ja) 2001-08-09 2002-08-08 Ｌｅｄ照明装置およびｌｅｄ照明光源

Country Status (1)

Country Link
JP (1) JP3989794B2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146783A1 (ja) 2009-06-15 2010-12-23 パナソニック株式会社 半導体発光装置、発光モジュール、および照明装置
WO2011040980A3 (en) * 2009-10-02 2011-09-29 Light Etc. Corporation Light with replaceable light source
US8641232B2 (en) 2010-06-18 2014-02-04 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus

Families Citing this family (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
JP2005005482A (ja) * 2003-06-12 2005-01-06 Citizen Electronics Co Ltd Ｌｅｄ発光装置及びそれを用いたカラー表示装置
JP2005039193A (ja) * 2003-06-26 2005-02-10 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
JP4238666B2 (ja) * 2003-07-17 2009-03-18 豊田合成株式会社 発光装置の製造方法
JP4268472B2 (ja) * 2003-07-18 2009-05-27 パナソニック株式会社 照明装置及びランプモジュール
WO2005015646A1 (ja) * 2003-08-07 2005-02-17 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ照明光源
JP3864943B2 (ja) * 2003-08-26 2007-01-10 住友電気工業株式会社 光配給ユニット、照明ユニット、及び照明システム
JP4902950B2 (ja) * 2003-09-16 2012-03-21 パナソニック株式会社 Ｌｅｄ照明光源
WO2005029185A2 (en) * 2003-09-16 2005-03-31 Matsushita Electric Industrial Co., Ltd. Led lighting source and led lighting apparatus
JP4159437B2 (ja) * 2003-09-29 2008-10-01 三洋電機株式会社 照明装置
KR100587328B1 (ko) 2003-10-16 2006-06-08 엘지전자 주식회사 Ｌｅｄ 면광원
JP4001856B2 (ja) * 2003-10-30 2007-10-31 ローム株式会社 発光素子駆動装置、発光素子駆動装置を有する表示モジュール及び、表示モジュールを備えた電子機器
JP2005203481A (ja) * 2004-01-14 2005-07-28 Nitto Kogaku Kk 紫外線照射装置
JP3895362B2 (ja) * 2004-01-29 2007-03-22 松下電器産業株式会社 Ｌｅｄ照明光源
JP4488873B2 (ja) * 2004-03-02 2010-06-23 シーシーエス株式会社 光照射装置
JP4643918B2 (ja) * 2004-03-10 2011-03-02 シチズン電子株式会社 光半導体パッケージ
JP4754850B2 (ja) 2004-03-26 2011-08-24 パナソニック株式会社 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
WO2005104247A1 (ja) * 2004-04-19 2005-11-03 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ照明光源の製造方法およびｌｅｄ照明光源
JP2006147999A (ja) * 2004-11-24 2006-06-08 Kyocera Corp 発光素子用配線基板並びに発光装置
JP2005347467A (ja) * 2004-06-02 2005-12-15 Fujikura Ltd 発光デバイス及び照明装置
JP2006019319A (ja) * 2004-06-30 2006-01-19 C I Kasei Co Ltd 発光ダイオード組立体および発光ダイオード組立体の製造方法
US7252408B2 (en) * 2004-07-19 2007-08-07 Lamina Ceramics, Inc. LED array package with internal feedback and control
JP4096927B2 (ja) * 2004-08-03 2008-06-04 松下電器産業株式会社 Ｌｅｄ照明光源
JP4543813B2 (ja) 2004-08-04 2010-09-15 ソニー株式会社 バックライト装置及びこのバックライト装置を備えた液晶表示装置
JP4558417B2 (ja) * 2004-09-01 2010-10-06 有限会社シマテック 照明制御装置
JP2006086469A (ja) * 2004-09-17 2006-03-30 Matsushita Electric Ind Co Ltd 半導体発光装置、照明モジュール、照明装置及び半導体発光装置の製造方法
JP4624069B2 (ja) * 2004-10-27 2011-02-02 京セラ株式会社 発光装置およびその製造方法ならびに照明装置
JP5103175B2 (ja) * 2004-11-01 2012-12-19 パナソニック株式会社 照明装置及び表示装置
JP2006156662A (ja) * 2004-11-29 2006-06-15 Matsushita Electric Ind Co Ltd 発光装置
WO2006070457A1 (ja) * 2004-12-28 2006-07-06 Matsushita Electric Works, Ltd. 高熱伝導性回路モジュールの製造方法及び高熱伝導性回路モジュール
JP4890775B2 (ja) 2005-03-23 2012-03-07 パナソニック株式会社 発光モジュール
JP4754245B2 (ja) * 2005-03-24 2011-08-24 株式会社フジクラ 発光素子ユニットの製造方法
JP2006278889A (ja) * 2005-03-30 2006-10-12 Sharp Corp 半導体ランプおよび電子機器
JP2006302726A (ja) * 2005-04-22 2006-11-02 Toshiaki Inoue 複数個の発光ダイオードを光源とした重複放射型発光ダイオード電球。
US7952112B2 (en) * 2005-04-29 2011-05-31 Philips Lumileds Lighting Company Llc RGB thermal isolation substrate
US7780312B2 (en) * 2005-05-31 2010-08-24 Lg Display Co., Ltd. Backlight assembly for liquid crystal display device and liquid crystal display device using the same
JP4628877B2 (ja) * 2005-06-07 2011-02-09 株式会社フジクラ 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機
JP2006351611A (ja) * 2005-06-13 2006-12-28 Rohm Co Ltd 発光素子搭載用基板及びそれを用いた光半導体装置
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
JP2006351695A (ja) * 2005-06-14 2006-12-28 Fujikura Ltd 発光素子実装用ホーロー基板、発光素子モジュール、光源装置、照明装置、表示装置及び交通信号機
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WO2007011068A1 (en) * 2005-07-22 2007-01-25 Showa Denko K.K. Light-emitting diode light source
JP2007042669A (ja) * 2005-07-29 2007-02-15 Toyoda Gosei Co Ltd 光源装置
JP4620778B2 (ja) * 2005-08-19 2011-01-26 ネオバルブ テクノロジーズ，インコーポレイテッド 高出力と高熱拡散効率を備えるｌｅｄ照明装置
JP2007073752A (ja) * 2005-09-07 2007-03-22 Meiko:Kk Ｌｅｄディスプレー
US7360934B2 (en) 2005-10-24 2008-04-22 Sumitomo Electric Industries, Ltd. Light supply unit, illumination unit, and illumination system
WO2007072659A1 (ja) * 2005-12-20 2007-06-28 Toshiba Lighting & Technology Corporation 発光装置
DE102005061204A1 (de) * 2005-12-21 2007-07-05 Perkinelmer Elcos Gmbh Beleuchtungsvorrichtung, Beleuchtungssteuergerät und Beleuchtungssystem
JP4569925B2 (ja) * 2005-12-28 2010-10-27 パナソニック株式会社 照明装置
JP2007214472A (ja) * 2006-02-13 2007-08-23 Matsushita Electric Ind Co Ltd エッジライトとその製造方法
JP4828253B2 (ja) * 2006-02-23 2011-11-30 昭和電工株式会社 液晶用バックライトの光源として用いられる発光ユニット
JP2007242856A (ja) * 2006-03-08 2007-09-20 Rohm Co Ltd チップ型半導体発光素子
JP2007294867A (ja) * 2006-03-28 2007-11-08 Toshiba Lighting & Technology Corp 発光装置
WO2007123068A1 (ja) * 2006-04-25 2007-11-01 Sharp Kabushiki Kaisha バックライト装置
JP4207061B2 (ja) * 2006-06-12 2009-01-14 住友電気工業株式会社 光配給ユニット、照明ユニット、及び照明システム
USD565756S1 (en) 2006-06-20 2008-04-01 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD565753S1 (en) 2006-06-20 2008-04-01 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD565207S1 (en) 2006-06-20 2008-03-25 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570506S1 (en) 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570003S1 (en) 2006-06-20 2008-05-27 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD611628S1 (en) 2006-06-20 2010-03-09 Panasonic Corporation Lighting apparatus
USD566303S1 (en) 2006-06-20 2008-04-08 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD565754S1 (en) 2006-06-20 2008-04-01 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD560293S1 (en) 2006-06-20 2008-01-22 Matsushita Electric Industrial Co., Ltd. Lighting unit
USD569529S1 (en) 2006-06-20 2008-05-20 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD565755S1 (en) 2006-06-20 2008-04-01 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
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USD568500S1 (en) 2006-06-20 2008-05-06 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
DE102007004303A1 (de) 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
JP2008052939A (ja) * 2006-08-22 2008-03-06 Yoshihiro Hasegawa Ｌｅｄ照明ユニットおよび照明装置
US8581393B2 (en) * 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
US20080074884A1 (en) * 2006-09-25 2008-03-27 Thye Linn Mok Compact high-intensty LED-based light source and method for making the same
EP2573812B1 (en) 2006-10-12 2017-08-16 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus
US7549786B2 (en) 2006-12-01 2009-06-23 Cree, Inc. LED socket and replaceable LED assemblies
USD572388S1 (en) 2006-12-19 2008-07-01 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
JP5050562B2 (ja) * 2007-02-26 2012-10-17 日亜化学工業株式会社 発光装置
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JP5181505B2 (ja) * 2007-03-22 2013-04-10 東芝ライテック株式会社 発光装置
WO2008143076A1 (ja) * 2007-05-18 2008-11-27 Denki Kagaku Kogyo Kabushiki Kaisha 金属ベース回路基板
JP2009004718A (ja) * 2007-05-18 2009-01-08 Denki Kagaku Kogyo Kk 金属ベース回路基板
USD581885S1 (en) 2007-06-14 2008-12-02 Panasonic Corporation Light source of light emitting diode
TWD125663S1 (zh) 2007-06-14 2008-10-21 松下電器產業股份有限公司 發光二極體照明光源
JP2009033088A (ja) * 2007-06-29 2009-02-12 Sharp Corp 半導体発光装置、その製造方法およびそれを用いたｌｅｄ照明装置
JP5538671B2 (ja) * 2007-09-19 2014-07-02 シャープ株式会社 発光装置およびｌｅｄランプ
JP4844520B2 (ja) * 2007-09-25 2011-12-28 パナソニック電工株式会社 照明装置
WO2009055079A1 (en) * 2007-10-26 2009-04-30 Cree Led Lighting Solutions, Inc. Illumination device having one or more lumiphors, and methods of fabricating same
KR101217201B1 (ko) 2008-07-07 2012-12-31 파나소닉 주식회사 전구형 조명용 광원
WO2010018682A1 (ja) * 2008-08-11 2010-02-18 ローム株式会社 照明装置
FR2936251B1 (fr) * 2008-09-23 2010-11-05 Millipore Corp Dispositif pour l'analyse microbiologique.
JP4676527B2 (ja) * 2008-12-24 2011-04-27 パナソニック株式会社 ソケット
JP4676526B2 (ja) * 2008-12-24 2011-04-27 パナソニック株式会社 ランプモジュール
JP2010153556A (ja) * 2008-12-25 2010-07-08 Kyocera Corp 発光装置及びこれを用いた照明装置
TWI384660B (zh) * 2009-01-23 2013-02-01 Everlight Electronics Co Ltd 發光二極體封裝結構及其製作方法
TW201139926A (en) * 2010-01-05 2011-11-16 Koninkl Philips Electronics Nv Circuit board support structure having fixed circuit board connection device
JP2011146640A (ja) * 2010-01-18 2011-07-28 Fujikom Corp Ｌｅｄ光源
JP2010171466A (ja) * 2010-05-11 2010-08-05 Toshiba Lighting & Technology Corp 発光装置
JP4945658B2 (ja) * 2010-05-17 2012-06-06 スタンレー電気株式会社 車両用前照灯
JP2012015226A (ja) * 2010-06-30 2012-01-19 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JPWO2012042962A1 (ja) * 2010-09-30 2014-02-06 日亜化学工業株式会社 発光装置および発光装置の製造方法
JP5727245B2 (ja) * 2011-01-28 2015-06-03 ジーニアアンドアーレイ株式会社 発光ダイオードの実装構造、光源ユニット、光源器具、発光ダイオード実装体の製造方法
WO2012165125A1 (ja) * 2011-06-03 2012-12-06 シャープ株式会社 Ｌｅｄランプおよびそれを備えた加熱調理器
JP2012251738A (ja) * 2011-06-03 2012-12-20 Sharp Corp 加熱調理器
JP2012253232A (ja) * 2011-06-03 2012-12-20 Sharp Corp 加熱調理器
JP5900019B2 (ja) * 2012-02-29 2016-04-06 日亜化学工業株式会社 発光装置用ホルダ
JP2014022501A (ja) * 2012-07-17 2014-02-03 Nitto Denko Corp 発光装置集合体および照明装置
JP5132007B2 (ja) * 2012-03-14 2013-01-30 パナソニック株式会社 照明器具
US9487019B2 (en) 2012-11-29 2016-11-08 Kyocera Corporation Light irradiation device, light irradiation module, and printing apparatus
JP2015103733A (ja) 2013-11-27 2015-06-04 豊田合成株式会社 発光装置
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JP2018142592A (ja) * 2017-02-27 2018-09-13 パナソニックＩｐマネジメント株式会社 光源モジュール、照明装置、および移動体
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EP4160679B1 (en) * 2020-04-28 2024-01-31 Nichia Corporation Light-emitting device
EP3907428B1 (en) * 2020-05-07 2023-09-27 Lumileds LLC Retrofit lighting device with improved thermal properties
JP7502636B2 (ja) * 2020-09-29 2024-06-19 日亜化学工業株式会社 発光装置の製造方法及び発光装置
CN114171644A (zh) * 2021-11-17 2022-03-11 广东索亮智慧科技有限公司 一种特殊应用超高密度纳米级导热全色域nk瓦级cob光源封装技术
CN117894890B (zh) * 2024-03-07 2024-06-07 深圳日上光电有限公司 一种led灯珠生产设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072281A (ja) * 1983-09-28 1985-04-24 Sanyo Electric Co Ltd 発光ダイオ−ド基板
JPS618146U (ja) * 1984-06-20 1986-01-18 三洋電機株式会社 光プリンタヘツド
JPH033276A (ja) * 1989-05-31 1991-01-09 Nippon Denyo Kk Ｌｅｄランプ
JP2787799B2 (ja) * 1993-12-29 1998-08-20 岡谷電機産業株式会社 表示灯
JPH0825689A (ja) * 1994-07-15 1996-01-30 Rohm Co Ltd Ｌｅｄアレイプリントヘッドの構造
JP2000100218A (ja) * 1998-09-21 2000-04-07 Ichikoh Ind Ltd Ｌｅｄを光源とする車両用灯具
JP3530417B2 (ja) * 1999-04-23 2004-05-24 三洋電機株式会社 Ｌｅｄ光源装置
JP2001052504A (ja) * 1999-08-06 2001-02-23 Inax Corp 照明装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146783A1 (ja) 2009-06-15 2010-12-23 パナソニック株式会社 半導体発光装置、発光モジュール、および照明装置
US8390021B2 (en) 2009-06-15 2013-03-05 Panasonic Corporation Semiconductor light-emitting device, light-emitting module, and illumination device
WO2011040980A3 (en) * 2009-10-02 2011-09-29 Light Etc. Corporation Light with replaceable light source
US8641232B2 (en) 2010-06-18 2014-02-04 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus

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