CN105473930A - Led模块 - Google Patents
Led模块 Download PDFInfo
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- CN105473930A CN105473930A CN201480046784.XA CN201480046784A CN105473930A CN 105473930 A CN105473930 A CN 105473930A CN 201480046784 A CN201480046784 A CN 201480046784A CN 105473930 A CN105473930 A CN 105473930A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Abstract
一种发光二极管(LED)模块包括一基部,所述基部是导电的且选择性地覆盖有一绝缘层。所述基部可包括一连接凸缘以及一发光区域。多条迹线设置于所述绝缘涂层且可用于将位于所述发光区域的多个LED连接于所述连接凸缘上的多个垫。所述连接凸缘可在角度和/或位置上与所述基部偏移且可构造成提供适于以极化方式对接一连接器的接触形状。所述基部可在形状上设置成提供所需的功能。
Description
相关申请
本申请主张于2013年8月23日提交的美国临时申请US61/869,367的优先权。
技术领域
本申请涉及采用一发光二极管(LED)的固态照明领域,更具体地涉及LED模块领域。
背景技术
LED模块为一种采用LED来提供照明的已知途径。多个LED要求在制备过程在照明方面是有益的。现有的LED模块包括基于LED类型构造的一LED阵列。例如,基板上芯片(COB)LED阵列包括典型地安装在一反射面上并通过导线结合(wire-bonding)电连接在一起的多个LED芯片。因为具有并使红色光、绿色光、蓝色光保持平衡以提供所需的光输出有点较复杂,所以常希望具有这样一种有效的LED,其发射小范围的波长并采用磷将所发射的波长转换成一所需要的光谱。由此,一LED阵列可包括置于一基材上的一个以上的LED芯片,所述基材可为金属包层(metal-clad)PCB或其它所需的材料。多个LED芯片以一图案导线结合,该图案将所述多个LED芯片连接于一阳极和一阴极,且随后所述多个LED芯片可被合适的硅层和磷层覆盖,以保护所述多个LED芯片,同时利用磷层提供光的转换。
所得到的LED阵列提供了多个面向上的LED,并且还能提供多个面向上且电连接于阳极和阴极的触点。这使得将LED阵列能够以一可靠的方式(例如LED阵列被一固持座下压)固定于一散热器并将电源连接于多个触点。因为LED的效率的日益增长,所以LED阵列已变得更小,且由此能够提供一尺寸缩减的基材。尽管从成本角度出发这会是有益的,但是尺寸上的缩减已使得LED阵列难以配合以及将LED阵列固定于一应用中(诸如一固定装置(fixture)或灯泡)。解决这个待处理的问题的一种途径是采用一固持座来固定LED阵列。可由一绝缘材料形成的一固持座可提供与LED基材上的多个触点之间的电连接并牢固地安装到LED阵列。例如,可采用焊料或导电粘接剂而不采用辅助紧固件来实现物理连接,由此LED阵列的尺寸可最小化且固持座(由成本更低的材料形成)可提供多个触点和一外部电源之间的物理及电连接。如此构造的一LED模块的一可行结构的一实施例公开在于2013年1月4日提交的美国公开号US2013/0176732中。尽管这样的LED模块适于许多应用,但是某些人群会赏识进一步的改进。
发明内容
一种发光二极管(LED)模块包括导热导电的一基部,所述基部包括设计成发射光的一光引擎(lightengine)以及一连接凸缘。一绝缘层选择性地设置于所述基部,且所述绝缘层可为一粉末涂层。多条迹线以一图案形成于所述绝缘层。多个LED置于一反射区域,所述反射区域优选未被所述绝缘层覆盖。多条导电迹线电连接于所述多个LED。一旦所述多个LED电连接于所述多条迹线,则一保护覆盖层置于所述多个LED上。所述多条迹线从相邻的多个LED延伸至所述连接凸缘。在工作时,所述连接凸缘可收容允许将电源提供给所述多个LED的一连接器。
附图说明
本申请以示例示出且不限于附图,在附图中类似的附图标记表示类似的部件,且在附图中:
图1示出一LED模块的一实施例的一立体图。
图2示出图1所示实施例的一简化部分分解立体图。
图3示出图2所示LED模块的一放大立体图。
图4示出一LED模块的另一实施例的一立体图。
图5A示出一基部和光引擎的一实施例的一示意侧视图。
图5B示出一基部和光引擎的另一实施例的一示意侧视图。
图5C示出一基部和光引擎的另一实施例的一示意侧视图。
图5D示出一基部和光引擎的另一实施例的一示意侧视图。
图6示出一LED模块的另一实施例的一示意图。
图7示出一种设置一LED模块的方法。
图8示出适于供一LED模块使用的一基部的一简化实施例的一示意侧视图。
图9示出一LED模块的一实施例的一示意侧视图。
具体实施方式
下面详细的说明描述多个示范性实施例且不意欲限制到明确公开的组合。因此,除非另有说明,本文所公开的各种特征可以组合在一起而形成多个另外组合(出于简明目的而未示出)。
图1-3示出一发光二极管(LED)模块10的一第一实施例。LED模块10包括一导电基部15且包括以一选择性的方式设置于基部15上的一绝缘层21。基部15支撑一发光区域20,发光区域20包含位于一反射区域22中的多个LED芯片38。反射区域22优选不含绝缘层21。为了将电源提供给所述多个LED芯片38,导电迹线30a、30b设置于绝缘层21。迹线30a从垫31(其用作一阳极)延伸至连接区域33,而迹线30b从垫32(其用作一阴极)延伸至连接区域34。多个线结合部35用于将各个LED芯片38以一所需图案电连接于连接区域33、34。如可认识到的,垫31、32位于一连接凸缘17上。假设基部15安装成与一支撑面(未示出)平齐,连接凸缘17可从基部15以一角度延伸,以提供进入一连接器40。如从图5A-5D可认识到的,连接凸缘17a-17d可以在大的构造范围下设置,诸如相对基部15a-15d向上倾斜、向下倾斜、与基部15a-15d平行或与基部15a-15d平行但偏移。换句话说,发光区域20a、20b可以以与所述连接凸缘不同的角度定向。如果需要,也可以提供其它构造。
发光区域20包括由一材料(例如硅)形成的一保护层25,且发光区域20可包括一磷浆层,磷浆层用于将所发射的光转换成一更期望的波长的光。下面将更多地说明保护层25的各种可能的变型。
用于提供电源给发光区域20的迹线30a、30b可通过经由一粉末涂覆技术而将绝缘层21选择性地置于基部15的所需表面上来设置。一旦绝缘层21设置于基部15的所需表面(诸如一顶表面、一个或多个侧表面、以及一底表面),则基部15可被固化,从而所得到的绝缘层21提供所需的电隔离。应注意的是,绝缘层21可覆盖基部15的很多部分(包括基部15的侧表面和底表面)。提供另外的覆盖能够有助将迹线30a、30b与所述基部电隔离,且有助将基部15自身与可能包含于相邻的部件(诸如一散热器或支撑固定装置)的任何暴露的金属隔离。
一旦基部15具有选择性设置的绝缘层21,则迹线30a、30b可形成于绝缘层21。如下说明的图7给出了如何形成一LED模块的另外的信息(包括说明形成多条迹线的过程,其将更详细地说明)。如可认识到的,绝缘层21设置于连接凸缘17,从而能够形成所述多条迹线。
如上所述,反射区域22可省略绝缘层21,且在一实施例中,反射区域22可抛光,以有助光提取。多个LED芯片38以一所需方式置于反射区域22。例如,如图3所示,多个LED串联连接以形成一LED路径39,且两个或多个LED路径可并联设置。当然,其它电路图案可按照所需设置。已确认的是,理想的是使得LED路径39构造成它可被小于50伏的电势来致动,且更理想的是使所需的致动LED路径39的电势小于25伏。使用低电压使得更容易提供合适的电源并还改善了爬电距离(creepage)和电气间隙(clearance)问题。
如从图4可认识到的,示出具有一发光区域20的一LED模块10’的另一实施例,LED模块10’包括一基部15’,基部15’具有多个紧固件用开孔,从而多个常规的紧固件(例如但不限于螺钉5)可用于将LED模块10’固定就位。在其它实施例中,所述基部可在尺寸和形状上进行设置,从而一固定装置将LED模块保持就位,而无需采用单独的紧固件。例如,一固定装置可设计成具有一卡扣(snap,按扣)的特征,卡扣使得所述模块结合一电源并利用一夹子被保持就位。在这样一种情况下,所述LED模块可包括位于所述基部的一底表面上的一热耦合层(诸如一导热垫或导热膏),以有助提供在所述LED模块与一支撑表面之间的改善的热传递。
导电迹线30a、30b从相邻的反射区域21延伸至连接凸缘17。连接凸缘17可在尺寸和结构上设置成对接一连接器40,其中所述连接器具有一本体41,本体41支撑电连接于多条导线42的多个端子。所述多个端子设置成对接阳极31、阴极32且由此提供与发光区域20的一电连接。连接凸缘17可设置成它以一极化(polarized)方式结合一连接器。应注意的是,在所示出的多数实施例中,连接凸缘17定向成不同于基部15。使所述连接凸缘与所述基部不同的方式被定向或设置的益处在于,这使得将连接器40连接于所述连接凸缘上的所述垫变得容易。例如,所述基部可具有一低高度,从而对光输出的干涉最小化,同时所述连接凸缘可以以对接一连接器简单且灵活的方式成角度设置。应注意的是,尽管图1-4的实施例示出朝光输出的角度(例如类似于图5A所示)的方向倾斜的一连接凸缘,但是在一替代实施例中,所述连接凸缘可沿相反方向倾斜(例如类似于图5D所示)。另外,所述连接凸缘可相对所述基部偏移(如图5B所示,其示出与所述连接凸缘与所述基部平行但偏移)。
应注意的是,在某些实施例中,连接凸缘也可与LED模块的发光区域的基部平行对准(如图5C所示)。这样一种结构将是合适的,例如在固定装置包含可接合一平的表面的多个接触件且所述模块旨在背离所述发光区域的一侧接合所述多个接触件的应用中(在一实施例中,固定装置中的所述多个接触件可凹设或被加护罩,以提供一接触安全环境)。
图6示出具有所包含的另外的特征的一LED模块110的另一实施例。一基部115包括:一平的区域115a,其提供一发光区域120、一第一曲线部116、一连接凸缘117及一第二曲线部118。如可认识到的,发光区域120位于这些曲线部的中间,以提供一反射结构,所述反射结构以聚焦的方式将光整形。基部110还包括一反射区域121,反射区域121主要用于将从多个LED140发射出的光反射出所述LED模块或朝第一曲线部116和第二曲线部118反射。如在上面的实施例中一样,所述的曲线部可覆盖允许用于电隔离的一绝缘层。在一实施例中,所述绝缘层可不仅进行电隔离而且还具有一高漫射反射性能,其中所述绝缘层的反射特性超过百分之90。
如在前面的实施例中一样,多个LED140通过多个线结合部135以一所需图案电连接,且可覆盖有一保护层125,保护层125可包括一磷层和/或硅层。所述多个线结合部135连接于多条导电迹线130,所述多条迹线130沿设置于第一曲线部116的一绝缘层延伸并穿过基部110的一开孔直到连接凸缘117。由此,所述绝缘层从发光区域120延伸至连接凸缘117。由于这种结构,LED模块110能够在所述基部的第一侧114a发射光而在基部115的一第二侧114b连接于电源,且这在考虑更期望的固定装置设计时能够是有益的,固定装置在所述基部的一侧输送电子和电源而在所述基部的另一侧设置所述发光区域。如可认识到的,通过在基部115的两侧采用多条迹线的图案,可使得器件(诸如但不限于驱动器、电容器、热敏电阻、以及保险丝)焊接于设置于所述基部的一侧的迹线,同时避免与由位于所述基部的另一侧的LED芯片提供的发射光造成任何干涉。当然,如果所述基部足够大,另外的器件和多个LED芯片可全部紧固在所述基部的同一侧。
应注意的是,因为基部115是导热的,所以基部115可用做一散热器,且依赖于应用,基部115可足以通过自身来管理热负荷。在替代实施例中,基部115可用做一热扩散器(heatspreader)且有助于将热能直接引导至一散热器。
图7示出一种用于设置一LED模块的方法。首先在步骤205中,由一导热材料形成一基部(诸如铝或其它合适的导热金属或金属合金,且在多数情况下,基部也是导电的)。如上所述,基部依赖于应用具有各种不同的形状。接下来在步骤210中,基部选择性地被镀覆上一绝缘层,绝缘层可以为一粉末涂层。在步骤215中,多条迹线形成于绝缘层。在一实施例中,这可涉及采用激光以一图案来活化绝缘层,这类似于在塑料上进行激光直接成型(laserdirectstructuring)。一旦形成图案,基部可被放置在镀液中,从而图案采用化学镀(electroless)工艺来镀覆。如果需要,或者通过另外的化学镀或者通过采用将电荷施加于所述多条迹线并随后镀覆的电镀,所述多条迹线的厚度可进一步增加。可替代地,所述多条迹线可利用喷墨技术通过在绝缘层上直接印刷导电墨而形成于绝缘层上。如果所述多条迹线采用喷墨技术形成,则依赖于应用和所需的电流,可理想地进一步镀覆所述多条迹线,以提供更厚的所述多条迹线(其可应对更高的电流负荷且这优选地采用电镀来进行)。然而,希望的是采用合适的导电墨,从而这种另外的镀覆将不是必须的。应注意的是,如果需要,所述多条迹线可形成在基部的超过一个侧面上,且所述多条迹线可含有间隙和复杂的图案,这允许其它的电器件(除了LED裸片以外)连接于所述多条迹线。如可认识到的,所述多条迹线与基部的任何暴露部分隔离且由此电镀操作可选择性地得以应用。
一旦所述多条导电迹线形成,则在步骤220中,LED裸片可置于基部。如可认识到的,设置裸片的工序可在一区域完成,该区域在放置裸片之前经由清洁和抛光,例如如上所述,裸片可置于一反射区域。在步骤225中,LED裸片经由导线结合在一起并连接于所述多条迹线。最后,在步骤230中,多个LED被一保护层覆盖,保护层可包括一硅层以及可选的磷浆层。如果需要,则可添加另外的层以及过滤体。例如,如果特殊的波长确定是不需要的,则这些波长的光可被阻截。另外的器件也可安装于基部。如可认识的,另外的器件可通过焊料或导电粘接剂来附接。
图8-9示出可用于一LED模块的一基部315的一横截面示意图,且基部315包括具有壁318的一凹陷区域319。凹陷区域319包括一反射区域322且由此提供位于一顶表面315a和一底表面315d之间的一发光区域。凹陷区域319可示出为所述基部的一部分可被去除或被压扁,且由此得到底表面315d在一单个平面的一基部。可替代地,所述基部的厚度可保持恒定且所述凹陷区域只是被压下(这会导致所述基部的底表面不在一单个平面)。或者,凹陷区域319提供一发光区域。凹陷区域319使得多个LED芯片340位于反射区域322并利用多个线结合部335电连接。为了保护所述芯片和所述线结合部,一第一硅层325a可置于所述LED芯片340上。随后,一磷层325b可设置在所述第一硅层上。磷层325b用于将从所述多个LED芯片发射的光转换成其它波长的光。磷层325b可随后被一另外的硅层325c覆盖。当然,另外的层可用于提供过滤和/或提供不同的性能,且所示出的实施例相当直接。所示出的设计的一个优势在于凹陷区域319的壁318帮助收容液态的层并防止这些层泄露或流到相邻区域。由此,在制造LED模块的过程中,凹陷区域319和壁318一起提供了针对这些层的收容部,而不需要另外的固定装置或辅助壁。
如上所述,当设置多个LED芯片时,多个层可设置。这对于本文公开的任何LED芯片的设计一般都是适用的。通常使用一硅层来保护器件且由此预期一保护层将包括至少有一些与一硅层类似。依赖于应用,另外的层和/或过滤体(未示出)可添加在所述多个LED芯片上。例如,阻截某些波长和/或调整光的颜色的过滤体可添加。当然,对于多个LED芯片以RGB结构来构造的一实施例而言,磷层和第二硅层可去除,因为LED芯片将会提供所需的输出而无需使用磷或过滤体来转换或阻截某些波长的光。由此,不管构造如何,使用一凹陷区域提供了许多益处和可构造有合适的深度以收容所需的层,且所示出的三层可变为其它数量的层。应注意的是,如果需要,发光区域可高度抛光,以提高光提取,且发光区域也可被整形(除了基部的其它部分的任何整形以外或是个别地),以帮助控制从发光区域发出的光的形状。
如可认识到的,所示出的LED模块可以一紧凑且成本划算的方式提供电连接。应注意的是,在一实施例中,LED模块的基部可设置成它大得足以无需另外的散热器。在一替代结构中,基部可设置成热耦合于一散热器且因此更像一热扩散器一样起作用。
本文给出的申请以其优选及示范性实施例说明了各个特征。本领域技术人员在阅读本申请后将作出处于随附权利要求的范围和精神内的许多其它的实施例、修改、以及变型。
Claims (13)
1.一种发光二极管(LED)模块,包括:
一基部,所述基部导热且导电,并具有一发光区域以及一连接凸缘;
一绝缘层,选择性地设置于所述基部上,所述绝缘层设置成位于所述连接凸缘上;
一第一迹线以及一第二迹线,设置于所述绝缘层,所述第一迹线和所述第二迹线从所述连接凸缘上的垫延伸至与所述发光区域相邻的一对应的连接区域;以及
多个LED芯片,以一图案安装于所述发光区域,所述多个LED芯片成组地电连接于所述第一迹线和所述第二迹线,从而所述第一迹线和所述第二迹线为所述多个LED芯片提供一阳极以及一阴极。
2.如权利要求1所述的LED模块,其中,所述连接凸缘与所述发光区域偏移。
3.如权利要求1所述的LED模块,其中,所述连接凸缘相对所述基部倾斜。
4.如权利要求1所述的LED模块,其中,所述发光区域凹设于所述基部。
5.如权利要求4所述的LED模块,其中,所述多个LED芯片被至少两个层覆盖。
6.如权利要求5所述的LED模块,其中,所述基部具有一顶表面以及一底表面,且在所述顶表面和所述底表面之间延伸有凹部,且所述至少两个层位于所述顶表面下方。
7.如权利要求1所述的LED模块,其中,所述基部为曲线状且所述发光区域位于所述基部,从而所述基部构造成以一聚焦的方式整形所发射的光。
8.如权利要求7所述的LED模块,其中,所述基部包括一开孔,所述开孔从所述基部的一第一侧延伸至与所述第一侧相对的一第二侧,所述第一侧支撑所述多个LED芯片,其中,所述连接凸缘从所述开孔延伸并位于所述第二侧。
9.一种形成发光二极管(LED)模块的方法,包括:
设置基部,所述基部具有一反射区域和一连接凸缘;
设置一绝缘层于所述基部上,其中所述反射区域基本上不含所述绝缘层且所述绝缘层至少部分覆盖所述连接凸缘;
设置一第一迹线和一第二迹线于所述绝缘层上,所述第一迹线和第二迹线从相邻所述反射区域延伸到所述连接凸缘;
定位多个LED芯片于所述反射区域上;
使所述多个LED芯片电连接于所述第一迹线和第二迹线;以及
设置一保护涂层于所述多个LED芯片上。
10.如权利要求9所述的方法,其中所述反射区域是凹入的。
11.如权利要求10所述的方法,其中设置所述第一迹线和第二迹线包括设置两个垫于所述连接凸缘上,所述两个垫中的一个电连接于所述第一迹线,而所述两个垫中的另一个电连接于所述第二迹线。
12.如权利要求11所述的方法,其中形成所述迹线包括将导电墨直接放置于所述绝缘层上。
13.如权利要求11所述的方法,其中形成所述迹线包括用激光形成一图案于所述绝缘层上,然后将所述基部放置于镀液中,使得在所述图案上形成导电层。
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- 2014-08-22 CN CN201480046784.XA patent/CN105473930B/zh not_active Expired - Fee Related
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2017
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Also Published As
Publication number | Publication date |
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US10100982B2 (en) | 2018-10-16 |
EP3036473A4 (en) | 2017-07-26 |
US9829159B2 (en) | 2017-11-28 |
EP3036473B1 (en) | 2021-06-02 |
TWM500362U (zh) | 2015-05-01 |
US20190049072A1 (en) | 2019-02-14 |
CN105473930B (zh) | 2019-03-19 |
US10393320B2 (en) | 2019-08-27 |
US20180080610A1 (en) | 2018-03-22 |
US20160208987A1 (en) | 2016-07-21 |
JP2016528745A (ja) | 2016-09-15 |
JP6348595B2 (ja) | 2018-06-27 |
EP3036473A1 (en) | 2016-06-29 |
WO2015027180A1 (en) | 2015-02-26 |
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