JP2016528745A - Ledモジュール - Google Patents
Ledモジュール Download PDFInfo
- Publication number
- JP2016528745A JP2016528745A JP2016536487A JP2016536487A JP2016528745A JP 2016528745 A JP2016528745 A JP 2016528745A JP 2016536487 A JP2016536487 A JP 2016536487A JP 2016536487 A JP2016536487 A JP 2016536487A JP 2016528745 A JP2016528745 A JP 2016528745A
- Authority
- JP
- Japan
- Prior art keywords
- base
- led
- insulating layer
- light emitting
- trace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
Abstract
Description
本出願は、2013年8月23日に出願された米国仮特許出願第61/869,367号に対する優先権を主張する。
Claims (13)
- 発光ダイオード(LED)モジュールであって、
熱および電気伝導性であり、発光領域および接続フランジを有する基部と、
該基部上に選択的に提供される絶縁層であって、前記接続フランジ上に位置付けられるように構成される絶縁層と、
該絶縁層上に提供される第1のトレースおよび第2のトレースであって、前記接続フランジ上のパッドから前記発光領域に隣接した対応する接続領域へと延在する、第1および第2のトレースと、
前記発光領域内にあるパターンで載置されたLEDチップであって、前記第1および第2のトレースが前記LEDチップに陽極および陰極を提供するように、前記LEDチップの組が前記第1および第2のトレースに電気接続される、LEDチップと、を備える、LEDモジュール。 - 前記接続フランジが前記発光領域からオフセットされる、請求項1に記載のLEDモジュール。
- 前記接続フランジが前記基部に対して角度付けされる、請求項1に記載のLEDモジュール。
- 前記発光領域が前記基部内に陥凹させられる、請求項1に記載のLEDモジュール。
- 前記LEDチップが少なくとも2つの層によって被覆される、請求項4に記載のLEDモジュール。
- 前記基部が上部表面および底部表面を有し、前記陥凹が前記上部表面と底部表面との間に延在し、少なくとも2つの層が前記上部表面より下にある、請求項5に記載のLEDモジュール。
- 前記基部が、集光様式で発生される光を形作るように構成されるように、該基部が屈曲し、前記発光領域が前記基部内に位置付けられる、請求項1に記載のLEDモジュール。
- 前記基部が、前記LEDチップを支持する前記基部の第1の側面から、該第1の側面と反対側の第2の側面へと延在する開口部を含み、前記接続フランジが、前記開口部から延在し、前記第2の側面上に位置付けられる、請求項7に記載のLEDモジュール。
- 発光ダイオード(LED)モジュールを形成する方法であって、
反射区域および接続フランジを有する基部を提供することと、
該基部上に絶縁層を提供することであって、前記反射区域が前記絶縁層を実質的に含まず、該絶縁層が前記接続フランジを少なくとも部分的に被覆する、提供することと、
前記絶縁層上に第1のトレースおよび第2のトレースを提供することであって、該第1および第2のトレースが、前記反射区域の隣接域から前記接続フランジへと延在する、提供することと、
前記反射区域上に複数のLEDチップを位置付けることと、
該複数のLEDチップを前記第1および第2のトレースに電気接続することと、
前記LEDチップ上に保護コーティングを提供することと、
を含む、方法。 - 前記反射区域が陥凹させられる、請求項9に記載の方法。
- 前記第1および第2のトレースの前記提供が、前記接続フランジ上に2つのパッドを提供することを含み、該2つのパッドのうちの一方が前記第1のトレースに電気接続され、前記2つのパッドのうちの他方が前記第2のトレースに電気接続される、請求項10に記載の方法。
- 前記トレースの形成が、前記絶縁層上に導電性インクを直接定置することを含む、請求項11に記載の方法。
- 前記トレースの形成が、前記絶縁層上にレーザーでパターンを形成することと、その後、導電層が前記パターン上に形成されるように前記基部をめっき浴中に定置することと、を含む、請求項11に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361869367P | 2013-08-23 | 2013-08-23 | |
US61/869,367 | 2013-08-23 | ||
PCT/US2014/052336 WO2015027180A1 (en) | 2013-08-23 | 2014-08-22 | Led module |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016528745A true JP2016528745A (ja) | 2016-09-15 |
JP6348595B2 JP6348595B2 (ja) | 2018-06-27 |
Family
ID=52484200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016536487A Expired - Fee Related JP6348595B2 (ja) | 2013-08-23 | 2014-08-22 | Ledモジュール |
Country Status (6)
Country | Link |
---|---|
US (3) | US9829159B2 (ja) |
EP (1) | EP3036473B1 (ja) |
JP (1) | JP6348595B2 (ja) |
CN (1) | CN105473930B (ja) |
TW (1) | TWM500362U (ja) |
WO (1) | WO2015027180A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018050046A (ja) * | 2016-09-21 | 2018-03-29 | 晶元光電股▲ふん▼有限公司Epistar Corporation | 治療に使用可能な発光モジュール |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3036473B1 (en) * | 2013-08-23 | 2021-06-02 | Molex, LLC | Led module |
US10663142B2 (en) | 2014-03-31 | 2020-05-26 | Bridgelux Inc. | Light-emitting device with reflective ceramic substrate |
TW201631808A (zh) * | 2015-02-25 | 2016-09-01 | 隆達電子股份有限公司 | 發光二極體晶片封裝體 |
JP6742352B2 (ja) | 2015-06-29 | 2020-08-19 | モレックス エルエルシー | 特定用途向け電子機器パッケージングシステム、方法及びデバイス |
JP6880855B2 (ja) * | 2016-05-17 | 2021-06-02 | セイコーエプソン株式会社 | 光源装置およびプロジェクター |
KR102201820B1 (ko) * | 2019-01-30 | 2021-01-12 | 주식회사 창성시트 | 디스플레이 기판 |
US10753583B1 (en) * | 2019-02-26 | 2020-08-25 | PureEdge Lighting LLC | Angled LED strip connector |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009032650A (ja) * | 2007-07-04 | 2009-02-12 | Toshiba Lighting & Technology Corp | 照明装置および照明器具 |
JP2009301795A (ja) * | 2008-06-11 | 2009-12-24 | Fujifilm Corp | 照明装置および照明装置の製造方法 |
US20100226139A1 (en) * | 2008-12-05 | 2010-09-09 | Permlight Products, Inc. | Led-based light engine |
JP2011060961A (ja) * | 2009-09-09 | 2011-03-24 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2011216868A (ja) * | 2010-03-16 | 2011-10-27 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
JP2011238802A (ja) * | 2010-05-11 | 2011-11-24 | Panasonic Corp | 発光モジュール及びこれを備えた照明装置 |
JP2012009886A (ja) * | 2011-08-25 | 2012-01-12 | Sharp Corp | 発光装置 |
JP2012084327A (ja) * | 2010-10-08 | 2012-04-26 | Sharp Corp | 照明装置及び液晶表示装置 |
JP2012124498A (ja) * | 2010-11-17 | 2012-06-28 | Kyushu Institute Of Technology | Ledモジュール装置及びその製造方法 |
WO2012090356A1 (ja) * | 2010-12-28 | 2012-07-05 | パナソニック株式会社 | 発光装置、発光モジュール及びランプ |
JP2012222228A (ja) * | 2011-04-12 | 2012-11-12 | Kyushu Institute Of Technology | Ledパッケージの製造方法 |
JP2013128013A (ja) * | 2011-12-16 | 2013-06-27 | Panasonic Corp | 立体回路基板の製造方法、立体回路基板、近接センサ及び発光装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6215184B1 (en) * | 1998-02-19 | 2001-04-10 | Texas Instruments Incorporated | Optimized circuit design layout for high performance ball grid array packages |
JPWO2003030274A1 (ja) * | 2001-09-27 | 2005-01-20 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP4527714B2 (ja) | 2003-02-07 | 2010-08-18 | パナソニック株式会社 | 発光体用金属ベース基板、発光光源、照明装置及び表示装置 |
JP4410721B2 (ja) * | 2005-05-02 | 2010-02-03 | シチズン電子株式会社 | バルブ型led光源 |
US8661660B2 (en) | 2005-09-22 | 2014-03-04 | The Artak Ter-Hovhanissian Patent Trust | Process for manufacturing LED lighting with integrated heat sink |
EP1932188A4 (en) | 2005-10-07 | 2011-06-22 | Osram Sylvania Inc | THERMAL DISSIPATOR LED LIGHT TRANSMITTER |
US7811842B2 (en) * | 2007-01-11 | 2010-10-12 | SemiLEDs Optoelectronics Co., Ltd. | LED array |
DE102007046639A1 (de) | 2007-09-27 | 2009-04-02 | Büchner, Thomas | Dreidimensionale bestückte elektrische Leiterplattenanordnungen, insbesondere LED-Beleuchtungseinrichtungen, und Verfahren zu deren Herstellung |
US8415703B2 (en) * | 2008-03-25 | 2013-04-09 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange |
US7887384B2 (en) | 2008-09-26 | 2011-02-15 | Bridgelux, Inc. | Transparent ring LED assembly |
JP5390372B2 (ja) * | 2009-12-25 | 2014-01-15 | 株式会社小糸製作所 | 光源ユニット及び車輌用灯具 |
JP5665184B2 (ja) * | 2011-01-14 | 2015-02-04 | 株式会社小糸製作所 | 照明装置 |
US20130051018A1 (en) * | 2011-08-23 | 2013-02-28 | Tyco Electronics Corporation | Metal clad circuit board |
EP2581469B1 (en) | 2011-10-10 | 2015-04-15 | Enthone, Inc. | Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates |
US20130161670A1 (en) * | 2011-12-23 | 2013-06-27 | Sheng-Yang Peng | Light emitting diode packages and methods of making |
US9170002B2 (en) | 2012-01-05 | 2015-10-27 | Molex, Llc | Holder and LED module using same |
EP3036473B1 (en) * | 2013-08-23 | 2021-06-02 | Molex, LLC | Led module |
-
2014
- 2014-08-22 EP EP14837781.5A patent/EP3036473B1/en active Active
- 2014-08-22 JP JP2016536487A patent/JP6348595B2/ja not_active Expired - Fee Related
- 2014-08-22 US US14/913,627 patent/US9829159B2/en active Active
- 2014-08-22 WO PCT/US2014/052336 patent/WO2015027180A1/en active Application Filing
- 2014-08-22 CN CN201480046784.XA patent/CN105473930B/zh not_active Expired - Fee Related
- 2014-08-25 TW TW103215158U patent/TWM500362U/zh not_active IP Right Cessation
-
2017
- 2017-11-27 US US15/822,574 patent/US10100982B2/en not_active Expired - Fee Related
-
2018
- 2018-10-12 US US16/158,988 patent/US10393320B2/en not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009032650A (ja) * | 2007-07-04 | 2009-02-12 | Toshiba Lighting & Technology Corp | 照明装置および照明器具 |
JP2009301795A (ja) * | 2008-06-11 | 2009-12-24 | Fujifilm Corp | 照明装置および照明装置の製造方法 |
US20100226139A1 (en) * | 2008-12-05 | 2010-09-09 | Permlight Products, Inc. | Led-based light engine |
JP2011060961A (ja) * | 2009-09-09 | 2011-03-24 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2011216868A (ja) * | 2010-03-16 | 2011-10-27 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
JP2011238802A (ja) * | 2010-05-11 | 2011-11-24 | Panasonic Corp | 発光モジュール及びこれを備えた照明装置 |
JP2012084327A (ja) * | 2010-10-08 | 2012-04-26 | Sharp Corp | 照明装置及び液晶表示装置 |
JP2012124498A (ja) * | 2010-11-17 | 2012-06-28 | Kyushu Institute Of Technology | Ledモジュール装置及びその製造方法 |
WO2012090356A1 (ja) * | 2010-12-28 | 2012-07-05 | パナソニック株式会社 | 発光装置、発光モジュール及びランプ |
JP2012222228A (ja) * | 2011-04-12 | 2012-11-12 | Kyushu Institute Of Technology | Ledパッケージの製造方法 |
JP2012009886A (ja) * | 2011-08-25 | 2012-01-12 | Sharp Corp | 発光装置 |
JP2013128013A (ja) * | 2011-12-16 | 2013-06-27 | Panasonic Corp | 立体回路基板の製造方法、立体回路基板、近接センサ及び発光装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018050046A (ja) * | 2016-09-21 | 2018-03-29 | 晶元光電股▲ふん▼有限公司Epistar Corporation | 治療に使用可能な発光モジュール |
Also Published As
Publication number | Publication date |
---|---|
CN105473930B (zh) | 2019-03-19 |
US10100982B2 (en) | 2018-10-16 |
US20160208987A1 (en) | 2016-07-21 |
US10393320B2 (en) | 2019-08-27 |
JP6348595B2 (ja) | 2018-06-27 |
TWM500362U (zh) | 2015-05-01 |
EP3036473A4 (en) | 2017-07-26 |
US9829159B2 (en) | 2017-11-28 |
US20190049072A1 (en) | 2019-02-14 |
EP3036473B1 (en) | 2021-06-02 |
WO2015027180A1 (en) | 2015-02-26 |
CN105473930A (zh) | 2016-04-06 |
EP3036473A1 (en) | 2016-06-29 |
US20180080610A1 (en) | 2018-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6348595B2 (ja) | Ledモジュール | |
KR102098831B1 (ko) | Led 조명 모듈 및 led 조명 장치 | |
EP2202810B1 (en) | Package for light emitting device | |
JP3989794B2 (ja) | Led照明装置およびled照明光源 | |
US7679099B2 (en) | Low thermal resistance high power LED | |
JP4180576B2 (ja) | Led照明装置およびカード型led照明光源 | |
EP3182471B1 (en) | Light source module | |
US20080117619A1 (en) | Light source utilizing a flexible circuit carrier and flexible reflectors | |
JP2005235779A (ja) | Led照明装置およびカード型led照明光源 | |
EP3182472B1 (en) | Light source module | |
JP2013529370A (ja) | Led光モジュール | |
KR20130096267A (ko) | 폴리사불화 에틸렌 색 변환 표면을 갖는 led 기반 조명 모듈과 방법 | |
TWI525789B (zh) | 發光二極體 | |
US10390399B2 (en) | LED assembly having base insert molded about terminals and substrate with a plurality of LED chips positioned on said substrate | |
US20150214194A1 (en) | Package for high-power led devices | |
KR20090003037A (ko) | 금속베이스 광소자 패키지 모듈 및 그 제조방법 | |
JP2011192703A (ja) | 発光装置及び照明装置 | |
KR20120123674A (ko) | Led 기반 장방형 조명장치 | |
JP2016171147A (ja) | 発光装置および照明装置 | |
US20100270580A1 (en) | Substrate based light source package with electrical leads | |
EP3116038B1 (en) | Light source module, lighting device including the same and method for fabrication the same | |
KR20120040973A (ko) | 세리믹 발광소자 패키지 | |
JP6402890B2 (ja) | 発光装置およびその製造方法 | |
KR20130043835A (ko) | 발광소자 패키지, 그 제조방법 및 이를 포함하는 조명 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160331 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170221 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170519 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170720 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170818 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171003 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20171228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180305 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180508 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180531 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6348595 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |