JP5376404B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5376404B2 JP5376404B2 JP2009208336A JP2009208336A JP5376404B2 JP 5376404 B2 JP5376404 B2 JP 5376404B2 JP 2009208336 A JP2009208336 A JP 2009208336A JP 2009208336 A JP2009208336 A JP 2009208336A JP 5376404 B2 JP5376404 B2 JP 5376404B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- substrate
- frame member
- light
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Description
Claims (1)
- 基板と;
この基板に実装された発光素子と;
環形をなして形成されるとともに内側に前記発光素子を納めて前記基板に接着された枠部材であって、この枠部材の内周面が、前記枠部材と前記基板との接着箇所を起点に前記基板から前記枠部材の高さ方向に離れるに従い前記基板に対する離間距離を次第に増加する円弧面である受面部位、及びこの受面部位と反対側に位置する出射側円弧面を有する半円形に形成されている前記枠部材と;
前記発光素子を埋めて前記枠部材の内側に、前記基板から前記受面部位と前記出射側円弧面との境をなす前記半円形の頂点までの高さより厚く設けられ、かつ、前記基板と前記受面部位との間に充填された先細り状部位、及び前記出射側円弧面に接着された周部出射側部位を有した透光性の封止部材と;
を具備することを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009208336A JP5376404B2 (ja) | 2009-09-09 | 2009-09-09 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009208336A JP5376404B2 (ja) | 2009-09-09 | 2009-09-09 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011060961A JP2011060961A (ja) | 2011-03-24 |
JP5376404B2 true JP5376404B2 (ja) | 2013-12-25 |
Family
ID=43948268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009208336A Expired - Fee Related JP5376404B2 (ja) | 2009-09-09 | 2009-09-09 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5376404B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6169829B2 (ja) * | 2012-07-09 | 2017-07-26 | 交和電気産業株式会社 | 照明装置 |
JP5907388B2 (ja) | 2012-09-24 | 2016-04-26 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP5999341B2 (ja) * | 2012-10-05 | 2016-09-28 | 東芝ライテック株式会社 | 発光装置および照明装置 |
US9829159B2 (en) | 2013-08-23 | 2017-11-28 | Molex, Llc | LED module |
JP6610866B2 (ja) | 2015-08-31 | 2019-11-27 | パナソニックIpマネジメント株式会社 | 発光装置、及び照明装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004247701A (ja) * | 2002-12-19 | 2004-09-02 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP4164006B2 (ja) * | 2003-02-17 | 2008-10-08 | 京セラ株式会社 | 発光素子収納用パッケージおよび発光装置 |
JP2005191111A (ja) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005243738A (ja) * | 2004-02-24 | 2005-09-08 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP4484554B2 (ja) * | 2004-03-23 | 2010-06-16 | 京セラ株式会社 | 照明装置 |
US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
JP2008198782A (ja) * | 2007-02-13 | 2008-08-28 | Toyoda Gosei Co Ltd | 発光装置 |
-
2009
- 2009-09-09 JP JP2009208336A patent/JP5376404B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011060961A (ja) | 2011-03-24 |
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