WO2008143076A1 - 金属ベース回路基板 - Google Patents

金属ベース回路基板 Download PDF

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Publication number
WO2008143076A1
WO2008143076A1 PCT/JP2008/058812 JP2008058812W WO2008143076A1 WO 2008143076 A1 WO2008143076 A1 WO 2008143076A1 JP 2008058812 W JP2008058812 W JP 2008058812W WO 2008143076 A1 WO2008143076 A1 WO 2008143076A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
metal base
base circuit
insulation layer
function
Prior art date
Application number
PCT/JP2008/058812
Other languages
English (en)
French (fr)
Inventor
Takeshi Miyakawa
Kenji Miyata
Taiki Nishi
Yoshihiko Okajima
Original Assignee
Denki Kagaku Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007188145A external-priority patent/JP2009004718A/ja
Priority claimed from JP2007305389A external-priority patent/JP2009130234A/ja
Application filed by Denki Kagaku Kogyo Kabushiki Kaisha filed Critical Denki Kagaku Kogyo Kabushiki Kaisha
Priority to US12/600,377 priority Critical patent/US8449143B2/en
Priority to MX2009011777A priority patent/MX2009011777A/es
Priority to EP08752683.6A priority patent/EP2160082B1/en
Priority to CA2687532A priority patent/CA2687532C/en
Priority to CN2008800162314A priority patent/CN101690423B/zh
Publication of WO2008143076A1 publication Critical patent/WO2008143076A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

　電子部品の実装という従来のプリント回路基板の機能に加えて、光反射機能という新しい機能を持った金属ベース回路基板を提供する。金属板上に絶縁層を介して回路が設けられた金属ベース回路基板であって、少なくとも絶縁層上に白色膜を設けたことを特徴とする金属ベース回路基板が提供される。
PCT/JP2008/058812 2007-05-18 2008-05-14 金属ベース回路基板 WO2008143076A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/600,377 US8449143B2 (en) 2007-05-18 2008-05-14 Metal base circuit board
MX2009011777A MX2009011777A (es) 2007-05-18 2008-05-14 Tarjeta de circuito de base de metal.
EP08752683.6A EP2160082B1 (en) 2007-05-18 2008-05-14 Metal base circuit board
CA2687532A CA2687532C (en) 2007-05-18 2008-05-14 Metal base circuit board
CN2008800162314A CN101690423B (zh) 2007-05-18 2008-05-14 金属基底电路板

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-133113 2007-05-18
JP2007133113 2007-05-18
JP2007188145A JP2009004718A (ja) 2007-05-18 2007-07-19 金属ベース回路基板
JP2007-188145 2007-07-19
JP2007305389A JP2009130234A (ja) 2007-11-27 2007-11-27 回路基板及び回路基板を有するｌｅｄモジュール
JP2007-305389 2007-11-27

Publications (1)

Publication Number Publication Date
WO2008143076A1 true WO2008143076A1 (ja) 2008-11-27

Family

ID=41571024

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058812 WO2008143076A1 (ja) 2007-05-18 2008-05-14 金属ベース回路基板

Country Status (8)

Country Link
US (1) US8449143B2 (ja)
EP (1) EP2160082B1 (ja)
KR (1) KR101555386B1 (ja)
CN (1) CN101690423B (ja)
CA (1) CA2687532C (ja)
MX (1) MX2009011777A (ja)
TW (1) TWI446065B (ja)
WO (1) WO2008143076A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102010570A (zh) * 2009-09-07 2011-04-13 日东电工株式会社 光半导体元件壳体封装用树脂组合物和使用该树脂组合物获得的光半导体发光装置
CN102141220A (zh) * 2010-01-29 2011-08-03 日东电工株式会社 背光源及液晶显示装置
JP2012243846A (ja) * 2011-05-17 2012-12-10 Sumitomo Chemical Co Ltd 金属ベース回路基板および発光素子

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JP2011014890A (ja) 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
KR101338116B1 (ko) * 2009-07-09 2013-12-06 엘지디스플레이 주식회사 액정표시장치
US7960194B2 (en) * 2009-10-07 2011-06-14 Bridgelux, Inc. Method for manufacturing a reflective surface sub-assembly for a light-emitting device
US8749978B2 (en) 2010-01-29 2014-06-10 Nitto Denko Corporation Power module
JP2012049495A (ja) 2010-01-29 2012-03-08 Nitto Denko Corp 発光ダイオード装置
KR101134794B1 (ko) * 2010-07-20 2012-04-13 엘지이노텍 주식회사 방열회로기판 및 그의 제조 방법
TWI435666B (zh) 2010-07-20 2014-04-21 Lg Innotek Co Ltd 輻散熱電路板及其製造方法
JP5406800B2 (ja) * 2010-07-30 2014-02-05 日東電工株式会社 配線回路基板およびその製造方法
US20150062915A1 (en) * 2013-09-05 2015-03-05 Cree, Inc. Light emitting diode devices and methods with reflective material for increased light output
KR101300226B1 (ko) * 2011-02-17 2013-08-26 이진배 빛 반사율이 향상된 엘이디 기판의 제조방법
WO2012164997A1 (ja) * 2011-05-30 2012-12-06 パナソニック株式会社 積層板、その用途及びその製造方法
KR20130014887A (ko) * 2011-08-01 2013-02-12 삼성전자주식회사 발광소자 패키지 및 그 제조 방법
EP2741341B1 (en) * 2011-08-01 2022-11-23 Shikoku Instrumentation Co., Ltd. Semiconductor device and fabrication method thereof
KR101326934B1 (ko) * 2011-08-31 2013-11-11 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 방열회로기판
WO2013038304A1 (en) * 2011-09-14 2013-03-21 Koninklijke Philips Electronics N.V. Reflective coating for a light emitting device mount
JP5848976B2 (ja) * 2012-01-25 2016-01-27 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP2013153068A (ja) * 2012-01-25 2013-08-08 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
CN103249250A (zh) * 2012-02-08 2013-08-14 欧司朗股份有限公司 电路板及其制造方法和包括该电路板的照明装置
EP2626918B8 (de) * 2012-02-13 2020-06-03 Tridonic GmbH & Co. KG LED-Modul mit hoch-reflektivem Träger und Verfahren zum Herstellen eines LED-Moduls mit hoch-reflektivem Träger
AT14124U1 (de) * 2012-02-13 2015-04-15 Tridonic Jennersdorf Gmbh LED-Modul mit Flächenverguß
US20150040388A1 (en) * 2012-03-20 2015-02-12 Applied Nanotech Holdings, Inc. Application of Dielectric Layer and Circuit Traces on Heat Sink
JP5609925B2 (ja) * 2012-07-09 2014-10-22 日亜化学工業株式会社 発光装置
DE102013106858A1 (de) 2012-07-19 2014-01-23 Samsung Electro-Mechanics Co., Ltd. Substrat für ein LED-Modul und Verfahren zu dessen Herstellung
WO2016185675A1 (ja) 2015-05-15 2016-11-24 パナソニックＩｐマネジメント株式会社 インタポーザ
TWI651491B (zh) 2015-07-23 2019-02-21 晶元光電股份有限公司 發光裝置
CN110260183A (zh) * 2015-07-23 2019-09-20 晶元光电股份有限公司 发光装置
CN105609615A (zh) * 2016-03-03 2016-05-25 深圳市新月光电有限公司 铜铝复合基导热型面光源
DE112017003086T5 (de) * 2016-06-21 2019-03-14 Soraa, Inc. LED-Package
CN107785378B (zh) * 2016-08-24 2020-06-16 群创光电股份有限公司 显示装置
JPWO2019187587A1 (ja) * 2018-03-30 2021-04-22 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、積層構造体、および、電子部品
CN110505754A (zh) * 2019-08-09 2019-11-26 珠海市沃德科技有限公司 一种用于led的铝基覆膜板的生产方法

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JP2006210490A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Ind Co Ltd 発光装置および発光装置の製造方法

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102010570A (zh) * 2009-09-07 2011-04-13 日东电工株式会社 光半导体元件壳体封装用树脂组合物和使用该树脂组合物获得的光半导体发光装置
US8664685B2 (en) 2009-09-07 2014-03-04 Nitto Denko Corporation Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
CN105670224A (zh) * 2009-09-07 2016-06-15 日东电工株式会社 光半导体元件壳体封装用树脂组合物和使用该树脂组合物获得的光半导体发光装置
CN102141220A (zh) * 2010-01-29 2011-08-03 日东电工株式会社 背光源及液晶显示装置
JP2012243846A (ja) * 2011-05-17 2012-12-10 Sumitomo Chemical Co Ltd 金属ベース回路基板および発光素子

Also Published As

Publication number Publication date
TWI446065B (zh) 2014-07-21
CA2687532A1 (en) 2008-11-27
US8449143B2 (en) 2013-05-28
EP2160082A4 (en) 2016-08-24
KR20100017841A (ko) 2010-02-16
KR101555386B1 (ko) 2015-09-23
US20100164362A1 (en) 2010-07-01
CA2687532C (en) 2018-07-17
CN101690423A (zh) 2010-03-31
EP2160082A1 (en) 2010-03-03
EP2160082B1 (en) 2018-07-04
TW200907493A (en) 2009-02-16
CN101690423B (zh) 2011-10-05
MX2009011777A (es) 2010-02-11

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