JP3596337B2 - 化合物半導体結晶の製造方法 - Google Patents
化合物半導体結晶の製造方法 Download PDFInfo
- Publication number
- JP3596337B2 JP3596337B2 JP6314399A JP6314399A JP3596337B2 JP 3596337 B2 JP3596337 B2 JP 3596337B2 JP 6314399 A JP6314399 A JP 6314399A JP 6314399 A JP6314399 A JP 6314399A JP 3596337 B2 JP3596337 B2 JP 3596337B2
- Authority
- JP
- Japan
- Prior art keywords
- compound semiconductor
- semiconductor crystal
- carbon
- gas
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013078 crystal Substances 0.000 title claims description 134
- 150000001875 compounds Chemical class 0.000 title claims description 117
- 239000004065 semiconductor Substances 0.000 title claims description 114
- 238000004519 manufacturing process Methods 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 38
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 71
- 229910052799 carbon Inorganic materials 0.000 claims description 70
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 55
- 239000002994 raw material Substances 0.000 claims description 55
- 229910002090 carbon oxide Inorganic materials 0.000 claims description 48
- 239000010453 quartz Substances 0.000 claims description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 35
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 28
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 229910052810 boron oxide Inorganic materials 0.000 claims description 15
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 239000001569 carbon dioxide Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 74
- 239000003708 ampul Substances 0.000 description 14
- 230000007423 decrease Effects 0.000 description 7
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical class [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/42—Gallium arsenide
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/04—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
- C30B11/06—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt at least one but not all components of the crystal composition being added
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/04—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
- C30B11/08—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt every component of the crystal composition being added during the crystallisation
- C30B11/12—Vaporous components, e.g. vapour-liquid-solid-growth
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6314399A JP3596337B2 (ja) | 1998-03-25 | 1999-03-10 | 化合物半導体結晶の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-77309 | 1998-03-25 | ||
| JP7730998 | 1998-03-25 | ||
| JP6314399A JP3596337B2 (ja) | 1998-03-25 | 1999-03-10 | 化合物半導体結晶の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004177249A Division JP4096919B2 (ja) | 1998-03-25 | 2004-06-15 | 化合物半導体結晶の製造方法および化合物半導体結晶 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11335195A JPH11335195A (ja) | 1999-12-07 |
| JPH11335195A5 JPH11335195A5 (https=) | 2004-07-29 |
| JP3596337B2 true JP3596337B2 (ja) | 2004-12-02 |
Family
ID=13630320
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6314399A Expired - Lifetime JP3596337B2 (ja) | 1998-03-25 | 1999-03-10 | 化合物半導体結晶の製造方法 |
| JP2004177249A Expired - Lifetime JP4096919B2 (ja) | 1998-03-25 | 2004-06-15 | 化合物半導体結晶の製造方法および化合物半導体結晶 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004177249A Expired - Lifetime JP4096919B2 (ja) | 1998-03-25 | 2004-06-15 | 化合物半導体結晶の製造方法および化合物半導体結晶 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US6273947B1 (https=) |
| EP (2) | EP0947609B1 (https=) |
| JP (2) | JP3596337B2 (https=) |
| DE (1) | DE69914820T2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3596337B2 (ja) * | 1998-03-25 | 2004-12-02 | 住友電気工業株式会社 | 化合物半導体結晶の製造方法 |
| CN1543518A (zh) * | 2001-07-05 | 2004-11-03 | Axt | 以坚固支座、碳掺杂和电阻率控制及温度梯度控制来生长半导体晶体的方法和装置 |
| JP5186733B2 (ja) * | 2005-07-29 | 2013-04-24 | 住友電気工業株式会社 | AlN結晶の成長方法 |
| US20080264332A1 (en) * | 2007-04-25 | 2008-10-30 | Fareed Sepehry-Fard | Method, system, and apparatus for doping and for multi-chamber high-throughput solid-phase epitaxy deposition process |
| US7566641B2 (en) * | 2007-05-09 | 2009-07-28 | Axt, Inc. | Low etch pit density (EPD) semi-insulating GaAs wafers |
| US8361225B2 (en) | 2007-05-09 | 2013-01-29 | Axt, Inc. | Low etch pit density (EPD) semi-insulating III-V wafers |
| EP2072645B2 (en) * | 2007-12-19 | 2014-12-24 | Schott AG | Method for producing a monocrystalline or polycrystalline semiconductor material |
| JP5110026B2 (ja) * | 2009-04-03 | 2012-12-26 | 住友電気工業株式会社 | Iii−v族化合物半導体結晶の製造方法 |
| JP6411952B2 (ja) | 2015-06-09 | 2018-10-24 | 信越化学工業株式会社 | 熱分解窒化ほう素容器の製造方法 |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4083748A (en) | 1975-10-30 | 1978-04-11 | Western Electric Company, Inc. | Method of forming and growing a single crystal of a semiconductor compound |
| US4404172A (en) | 1981-01-05 | 1983-09-13 | Western Electric Company, Inc. | Method and apparatus for forming and growing a single crystal of a semiconductor compound |
| US4521272A (en) | 1981-01-05 | 1985-06-04 | At&T Technologies, Inc. | Method for forming and growing a single crystal of a semiconductor compound |
| JPS5914440B2 (ja) | 1981-09-18 | 1984-04-04 | 住友電気工業株式会社 | CaAs単結晶への硼素のド−ピング方法 |
| JPS5954699A (ja) | 1982-09-22 | 1984-03-29 | Toshiba Corp | 単結晶の製造方法 |
| JP2529934B2 (ja) | 1984-02-21 | 1996-09-04 | 住友電気工業株式会社 | 単結晶の製造方法 |
| US5256381A (en) | 1984-02-21 | 1993-10-26 | Sumitomo Electric Industries, Ltd. | Apparatus for growing single crystals of III-V compound semiconductors |
| JPS60210599A (ja) * | 1984-04-03 | 1985-10-23 | Nec Corp | 半絶縁性GaAs結晶の成長方法 |
| JPS60264390A (ja) | 1984-06-08 | 1985-12-27 | Sumitomo Electric Ind Ltd | 単結晶の育成方法 |
| JPS6437833A (en) * | 1987-08-03 | 1989-02-08 | Nippon Mining Co | Semi-insulating gaas single crystal |
| JPS6437833U (https=) | 1987-09-01 | 1989-03-07 | ||
| JPS6479087A (en) | 1987-09-21 | 1989-03-24 | Hitachi Cable | Gallium arsenide single crystal having low dislocation density and its production |
| JPH01239089A (ja) | 1987-11-30 | 1989-09-25 | Toshiba Corp | 化合物半導体単結晶の製造方法及び製造装置 |
| JPH0234597A (ja) * | 1988-07-26 | 1990-02-05 | Sumitomo Electric Ind Ltd | 水平ブリッジマン法によるGaAs単結晶の成長方法 |
| JPH0772120B2 (ja) | 1988-08-05 | 1995-08-02 | 日立電線株式会社 | Crドープ半絶縁性砒化ガリウム結晶の製造方法 |
| JPH08758B2 (ja) | 1988-09-08 | 1996-01-10 | 日立電線株式会社 | クロムドープ半絶縁性ガリウム・ヒ素単結晶の製造方法 |
| US4923561A (en) | 1988-09-23 | 1990-05-08 | American Telephone And Telegraph Company | Crystal growth method |
| US5057287A (en) * | 1988-11-01 | 1991-10-15 | Sfa, Inc. | Liquid encapsulated zone melting crystal growth method and apparatus |
| JP3122097B2 (ja) | 1988-12-20 | 2001-01-09 | 富士通株式会社 | 文書読み上げ制御装置および文書読み上げ方法 |
| US4946544A (en) | 1989-02-27 | 1990-08-07 | At&T Bell Laboratories | Crystal growth method |
| US5259916A (en) | 1989-06-20 | 1993-11-09 | Texas Instruments Incorporated | Process for improved doping of semiconductor crystals |
| US5186784A (en) | 1989-06-20 | 1993-02-16 | Texas Instruments Incorporated | Process for improved doping of semiconductor crystals |
| US4999082A (en) | 1989-09-14 | 1991-03-12 | Akzo America Inc. | Process for producing monocrystalline group II-IV or group III-V compounds and products thereof |
| US5131975A (en) | 1990-07-10 | 1992-07-21 | The Regents Of The University Of California | Controlled growth of semiconductor crystals |
| JPH04104989A (ja) | 1990-08-25 | 1992-04-07 | Sumitomo Electric Ind Ltd | 液相エピタキシャル成長方法および装置 |
| US5342475A (en) | 1991-06-07 | 1994-08-30 | The Furukawa Electric Co., Ltd. | Method of growing single crystal of compound semiconductor |
| DE69230962T2 (de) | 1991-08-22 | 2000-10-05 | Raytheon Co., Lexington | Kristallzüchtungsverfahren zur Herstellung von grossflächigen GaAs und damit hergestellte Infrarot-Fenster/Kuppel |
| JPH0570288A (ja) | 1991-09-09 | 1993-03-23 | Toshiba Corp | 化合物半導体単結晶の製造方法及び製造装置 |
| JPH05139886A (ja) | 1991-11-21 | 1993-06-08 | Toshiba Corp | 砒素化合物単結晶の製造方法 |
| JP2781097B2 (ja) | 1992-01-30 | 1998-07-30 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JPH06128096A (ja) | 1992-10-20 | 1994-05-10 | Furukawa Electric Co Ltd:The | 化合物半導体多結晶の製造方法 |
| JPH06239691A (ja) | 1993-02-12 | 1994-08-30 | Japan Energy Corp | 単結晶の成長方法 |
| JP3015656B2 (ja) * | 1994-03-23 | 2000-03-06 | 株式会社東芝 | 半絶縁性GaAs単結晶の製造方法および製造装置 |
| WO1995033873A1 (en) * | 1994-06-02 | 1995-12-14 | Kabushiki Kaisha Kobe Seiko Sho | Compound monocrystal manufacturing method and apparatus |
| JPH0930887A (ja) | 1995-07-17 | 1997-02-04 | Hitachi Cable Ltd | 炭素添加GaAs結晶の製造方法 |
| JP3201305B2 (ja) * | 1996-04-26 | 2001-08-20 | 住友電気工業株式会社 | Iii−v族化合物半導体結晶の製造方法 |
| JPH09309791A (ja) * | 1996-05-22 | 1997-12-02 | Komatsu Electron Metals Co Ltd | 半導体単結晶の製造方法 |
| JP4120016B2 (ja) | 1996-12-12 | 2008-07-16 | 住友電気工業株式会社 | 半絶縁性GaAs単結晶の製造方法 |
| JP3969865B2 (ja) | 1997-10-24 | 2007-09-05 | キヤノン株式会社 | フッ化物結晶の製造方法 |
| JPH11147785A (ja) | 1997-11-11 | 1999-06-02 | Hitachi Cable Ltd | 単結晶の製造方法 |
| JP4135239B2 (ja) * | 1997-12-26 | 2008-08-20 | 住友電気工業株式会社 | 半導体結晶およびその製造方法ならびに製造装置 |
| JP3596337B2 (ja) * | 1998-03-25 | 2004-12-02 | 住友電気工業株式会社 | 化合物半導体結晶の製造方法 |
-
1999
- 1999-03-10 JP JP6314399A patent/JP3596337B2/ja not_active Expired - Lifetime
- 1999-03-22 US US09/274,286 patent/US6273947B1/en not_active Expired - Lifetime
- 1999-03-23 DE DE69914820T patent/DE69914820T2/de not_active Expired - Lifetime
- 1999-03-23 EP EP99105861A patent/EP0947609B1/en not_active Expired - Lifetime
- 1999-03-23 EP EP04003550.3A patent/EP1428912B1/en not_active Expired - Lifetime
-
2001
- 2001-01-19 US US09/765,557 patent/US6485563B2/en not_active Ceased
-
2003
- 2003-08-13 US US10/640,430 patent/USRE40662E1/en not_active Expired - Lifetime
-
2004
- 2004-06-15 JP JP2004177249A patent/JP4096919B2/ja not_active Expired - Lifetime
-
2008
- 2008-12-22 US US12/341,876 patent/USRE42279E1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| USRE40662E1 (en) | 2009-03-17 |
| EP0947609B1 (en) | 2004-02-18 |
| EP1428912A2 (en) | 2004-06-16 |
| EP1428912A3 (en) | 2004-06-23 |
| USRE42279E1 (en) | 2011-04-12 |
| DE69914820T2 (de) | 2004-07-29 |
| EP1428912A9 (en) | 2004-09-08 |
| JPH11335195A (ja) | 1999-12-07 |
| US6485563B2 (en) | 2002-11-26 |
| EP1428912B1 (en) | 2014-11-05 |
| DE69914820D1 (de) | 2004-03-25 |
| EP0947609A3 (en) | 2002-02-06 |
| US6273947B1 (en) | 2001-08-14 |
| JP4096919B2 (ja) | 2008-06-04 |
| US20010006040A1 (en) | 2001-07-05 |
| EP0947609A2 (en) | 1999-10-06 |
| JP2004256392A (ja) | 2004-09-16 |
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