JP3580366B2 - 熱伝導性シリコーン組成物及び半導体装置 - Google Patents

熱伝導性シリコーン組成物及び半導体装置 Download PDF

Info

Publication number
JP3580366B2
JP3580366B2 JP2001133895A JP2001133895A JP3580366B2 JP 3580366 B2 JP3580366 B2 JP 3580366B2 JP 2001133895 A JP2001133895 A JP 2001133895A JP 2001133895 A JP2001133895 A JP 2001133895A JP 3580366 B2 JP3580366 B2 JP 3580366B2
Authority
JP
Japan
Prior art keywords
component
group
package
carbon atoms
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001133895A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002327116A (ja
Inventor
邦弘 山田
憲一 磯部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2001133895A priority Critical patent/JP3580366B2/ja
Priority to EP20020253010 priority patent/EP1254924B1/en
Priority to DE2002600630 priority patent/DE60200630T2/de
Priority to US10/133,312 priority patent/US6649258B2/en
Priority to TW91109016A priority patent/TWI303261B/zh
Publication of JP2002327116A publication Critical patent/JP2002327116A/ja
Application granted granted Critical
Publication of JP3580366B2 publication Critical patent/JP3580366B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2001133895A 2001-05-01 2001-05-01 熱伝導性シリコーン組成物及び半導体装置 Expired - Lifetime JP3580366B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001133895A JP3580366B2 (ja) 2001-05-01 2001-05-01 熱伝導性シリコーン組成物及び半導体装置
EP20020253010 EP1254924B1 (en) 2001-05-01 2002-04-29 Heat conductive silicone composition and semiconductor device
DE2002600630 DE60200630T2 (de) 2001-05-01 2002-04-29 Wärmeleitende Siliconzusammensetzung und Halbleiteranordnung
US10/133,312 US6649258B2 (en) 2001-05-01 2002-04-29 Heat conductive silicone composition and semiconductor device
TW91109016A TWI303261B (https=) 2001-05-01 2002-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001133895A JP3580366B2 (ja) 2001-05-01 2001-05-01 熱伝導性シリコーン組成物及び半導体装置

Publications (2)

Publication Number Publication Date
JP2002327116A JP2002327116A (ja) 2002-11-15
JP3580366B2 true JP3580366B2 (ja) 2004-10-20

Family

ID=18981678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001133895A Expired - Lifetime JP3580366B2 (ja) 2001-05-01 2001-05-01 熱伝導性シリコーン組成物及び半導体装置

Country Status (5)

Country Link
US (1) US6649258B2 (https=)
EP (1) EP1254924B1 (https=)
JP (1) JP3580366B2 (https=)
DE (1) DE60200630T2 (https=)
TW (1) TWI303261B (https=)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064281A (ja) * 2003-08-14 2005-03-10 Shin Etsu Chem Co Ltd 熱軟化性熱伝導性部材
JP2007150349A (ja) * 2007-02-09 2007-06-14 Shin Etsu Chem Co Ltd 熱軟化性熱伝導性部材
JP2014080546A (ja) * 2012-10-18 2014-05-08 Shin Etsu Chem Co Ltd シリコーン組成物
WO2014181657A1 (ja) 2013-05-07 2014-11-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
KR20160028965A (ko) 2014-09-04 2016-03-14 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 조성물
US9481851B2 (en) 2012-04-24 2016-11-01 Shin-Etsu Chemical Co., Ltd. Thermally-curable heat-conductive silicone grease composition
US9698077B2 (en) 2013-01-22 2017-07-04 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device
US9969919B2 (en) 2013-09-20 2018-05-15 Shin-Etsu Chemical Co., Ltd. Silicone composition and method for manufacturing heat-conductive silicone composition
US10023741B2 (en) 2013-05-24 2018-07-17 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone composition
US10689515B2 (en) 2016-01-07 2020-06-23 Shin-Etsu Chemical Co., Ltd. Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction
KR20200135992A (ko) 2018-03-23 2020-12-04 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 조성물
US11041072B2 (en) 2014-11-25 2021-06-22 Shin-Etsu Chemical Co., Ltd. One-pack addition curable silicone composition, method for storing same, and method for curing same
KR20210076046A (ko) 2018-10-12 2021-06-23 신에쓰 가가꾸 고교 가부시끼가이샤 부가 경화형 실리콘 조성물 및 그 제조 방법
KR20210135235A (ko) 2019-03-04 2021-11-12 신에쓰 가가꾸 고교 가부시끼가이샤 비경화형 열전도성 실리콘 조성물
KR20210148140A (ko) 2019-04-01 2021-12-07 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물, 그의 제조방법 및 반도체장치
US11319412B2 (en) 2016-10-31 2022-05-03 Dow Toray Co., Ltd. Thermally conductive silicone compound
KR20220121805A (ko) 2019-12-23 2022-09-01 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물
US11591470B2 (en) 2018-01-15 2023-02-28 Shin-Etsu Chemical Co., Ltd. Silicone composition
WO2023171353A1 (ja) 2022-03-08 2023-09-14 信越化学工業株式会社 ２液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物
WO2023171352A1 (ja) 2022-03-08 2023-09-14 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物
US12104113B2 (en) 2019-09-27 2024-10-01 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition, production method thereof, and semiconductor device

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060747B2 (en) 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
JP3803058B2 (ja) 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP2004176016A (ja) * 2002-11-29 2004-06-24 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及びその成形体
US6992893B2 (en) * 2003-01-10 2006-01-31 Hewlett-Packard Development Company, L.P. Heat sink attachment
US7645422B2 (en) 2003-04-11 2010-01-12 Therm-O-Disc, Incorporated Vapor sensor and materials therefor
JP2005064291A (ja) * 2003-08-14 2005-03-10 Nissan Motor Co Ltd 絶縁シートおよびこの絶縁シートを用いた半導体装置組立体
JP4154605B2 (ja) * 2004-01-23 2008-09-24 信越化学工業株式会社 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法
US7119143B2 (en) * 2004-03-04 2006-10-10 Laird Technologies, Inc. Silicone pads for electronics thermal management
TWI385246B (zh) 2004-05-21 2013-02-11 信越化學工業股份有限公司 聚矽氧烷潤滑油組成物
US7211637B2 (en) 2004-06-03 2007-05-01 Therm-O-Disc, Incorporated Sterically hindered reagents for use in single component siloxane cure systems
JP4687887B2 (ja) * 2004-10-14 2011-05-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2006143978A (ja) * 2004-11-25 2006-06-08 Ge Toshiba Silicones Co Ltd 熱伝導性シリコーン組成物
US7708947B2 (en) 2005-11-01 2010-05-04 Therm-O-Disc, Incorporated Methods of minimizing temperature cross-sensitivity in vapor sensors and compositions therefor
TWI285675B (en) * 2005-12-16 2007-08-21 Foxconn Tech Co Ltd Heat conductive grease and semiconductor device
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
EP1878767A1 (en) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
US8012420B2 (en) 2006-07-18 2011-09-06 Therm-O-Disc, Incorporated Robust low resistance vapor sensor materials
JP2008106185A (ja) * 2006-10-27 2008-05-08 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物の接着方法、熱伝導性シリコーン組成物接着用プライマー及び熱伝導性シリコーン組成物の接着複合体の製造方法
US8691390B2 (en) 2007-11-20 2014-04-08 Therm-O-Disc, Incorporated Single-use flammable vapor sensor films
US8106119B2 (en) * 2007-12-04 2012-01-31 Sea-Fue Wang Thermally conductive silicone composition
US20090143522A1 (en) * 2007-12-04 2009-06-04 Sea-Fue Wang Thermally Conductive Silicone Composition
JP2008160126A (ja) * 2007-12-21 2008-07-10 Shin Etsu Chem Co Ltd 電子部品の冷却構造
JP5372388B2 (ja) 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
JP4656340B2 (ja) * 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5182515B2 (ja) * 2008-12-25 2013-04-17 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5111451B2 (ja) * 2009-07-01 2013-01-09 信越化学工業株式会社 熱伝導性シリコーン組成物の接着方法、熱伝導性シリコーン組成物接着用プライマー及び熱伝導性シリコーン組成物の接着複合体の製造方法
JP5365572B2 (ja) 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
CN102234427B (zh) * 2010-04-29 2013-01-30 比亚迪股份有限公司 一种硅橡胶组合物及硅橡胶的制备方法
JP2012077256A (ja) 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
KR101866299B1 (ko) * 2011-01-26 2018-06-12 다우 실리콘즈 코포레이션 고온 안정성 열 전도성 재료
JP5733087B2 (ja) 2011-07-29 2015-06-10 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
CN104136569A (zh) * 2012-03-02 2014-11-05 富士高分子工业株式会社 油灰状传热材料及其制造方法
JP2014003141A (ja) * 2012-06-18 2014-01-09 Shin Etsu Chem Co Ltd 熱伝導性シート及び電子機器
US20150259584A1 (en) * 2014-03-11 2015-09-17 Randall D. Lowe, JR. Integrated heat spreader sealants for microelectronic packaging
JP6023737B2 (ja) * 2014-03-18 2016-11-09 信越化学工業株式会社 ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
EP3199591B1 (en) 2014-09-25 2020-04-29 Shin-Etsu Chemical Co., Ltd. Uv-thickening thermally conductive silicone grease composition
JP6510315B2 (ja) * 2015-05-14 2019-05-08 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材
JP6223590B2 (ja) * 2015-05-22 2017-11-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JP6524879B2 (ja) 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
US10781349B2 (en) * 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
JP6642145B2 (ja) 2016-03-14 2020-02-05 信越化学工業株式会社 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法
JP6874366B2 (ja) * 2016-12-28 2021-05-19 信越化学工業株式会社 シリコーン組成物およびその硬化物
JP6383885B2 (ja) 2017-01-27 2018-08-29 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリオルガノシロキサン組成物
CN110234711B (zh) 2017-01-27 2022-02-11 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
KR102318181B1 (ko) 2017-02-08 2021-10-27 엘켐 실리콘즈 유에스에이 코포레이션 열 관리가 개선된 이차 배터리 팩
CN111051433B (zh) * 2017-07-24 2022-12-30 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
KR20210148204A (ko) 2019-03-29 2021-12-07 다우 도레이 캄파니 리미티드 다성분형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
WO2021079714A1 (ja) * 2019-10-24 2021-04-29 信越化学工業株式会社 熱伝導性シリコーン組成物及びその製造方法
KR102928483B1 (ko) * 2020-03-16 2026-02-23 다우 실리콘즈 코포레이션 열 전도성 실리콘 조성물
KR20230045054A (ko) * 2020-09-07 2023-04-04 와커 헤미 아게 하이드로겐폴리오르가노실록산 및 이의 열전도성 실리콘 조성물
CN116368195B (zh) * 2020-09-23 2026-03-10 陶氏环球技术有限责任公司 具有低分配粘度、分配后具有低竖向流动且固化后具有低热阻抗的热界面材料
KR102873150B1 (ko) * 2020-09-29 2025-10-17 주식회사 엘지에너지솔루션 경화성 조성물 및 2액형 수지 조성물
KR102873146B1 (ko) * 2020-09-29 2025-10-17 주식회사 엘지에너지솔루션 경화성 조성물 및 2액형 수지 조성물
CN116997613A (zh) 2022-01-28 2023-11-03 瓦克化学股份公司 含铝导热膏
JP7644726B2 (ja) 2022-01-31 2025-03-12 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及びその硬化物
US20250129216A1 (en) 2022-02-28 2025-04-24 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition
JP7630895B2 (ja) * 2022-05-25 2025-02-18 信越化学工業株式会社 絶縁性熱伝導シート
WO2025118170A1 (en) * 2023-12-06 2025-06-12 Henkel Ag & Co. Kgaa Thermally conductive silicone adhesive composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61157569A (ja) 1984-12-28 1986-07-17 Shin Etsu Polymer Co Ltd 熱伝導性接着組成物
US4845164A (en) 1986-03-03 1989-07-04 Dow Corning Corporation Liquid curable polyorganosiloxane compositions
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
CA2035964A1 (en) * 1990-03-06 1991-09-07 Carl R. Kessel Solventless silicon release coating
JP3592809B2 (ja) * 1995-09-13 2004-11-24 東レ・ダウコーニング・シリコーン株式会社 フッ素樹脂被覆定着ロール用シリコーンゴム組成物およびフッ素樹脂被覆定着ロール
JPH08208993A (ja) 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
US6069201A (en) * 1997-09-12 2000-05-30 Shin-Etsu Chemical Co., Ltd. Zinc oxide-filled addition-curable silicone rubber compositions
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP4639361B2 (ja) * 2000-05-26 2011-02-23 東レ・ダウコーニング株式会社 剥離性硬化皮膜形成用シリコーン組成物
JP3580358B2 (ja) * 2000-06-23 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064281A (ja) * 2003-08-14 2005-03-10 Shin Etsu Chem Co Ltd 熱軟化性熱伝導性部材
JP2007150349A (ja) * 2007-02-09 2007-06-14 Shin Etsu Chem Co Ltd 熱軟化性熱伝導性部材
US9481851B2 (en) 2012-04-24 2016-11-01 Shin-Etsu Chemical Co., Ltd. Thermally-curable heat-conductive silicone grease composition
JP2014080546A (ja) * 2012-10-18 2014-05-08 Shin Etsu Chem Co Ltd シリコーン組成物
US9698077B2 (en) 2013-01-22 2017-07-04 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device
KR20160006689A (ko) 2013-05-07 2016-01-19 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물 및 그 경화물
US9481818B2 (en) 2013-05-07 2016-11-01 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition and a cured product of same
WO2014181657A1 (ja) 2013-05-07 2014-11-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
US10023741B2 (en) 2013-05-24 2018-07-17 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone composition
US9969919B2 (en) 2013-09-20 2018-05-15 Shin-Etsu Chemical Co., Ltd. Silicone composition and method for manufacturing heat-conductive silicone composition
US10202529B2 (en) 2013-09-20 2019-02-12 Shin-Etsu Chemical Co., Ltd. Silicone composition and method for manufacturing heat-conductive silicone composition
US9394470B2 (en) 2014-09-04 2016-07-19 Shin-Etsu Chemical Co., Ltd. Silicone composition
KR20160028965A (ko) 2014-09-04 2016-03-14 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 조성물
US11041072B2 (en) 2014-11-25 2021-06-22 Shin-Etsu Chemical Co., Ltd. One-pack addition curable silicone composition, method for storing same, and method for curing same
US10689515B2 (en) 2016-01-07 2020-06-23 Shin-Etsu Chemical Co., Ltd. Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction
US11319412B2 (en) 2016-10-31 2022-05-03 Dow Toray Co., Ltd. Thermally conductive silicone compound
US11591470B2 (en) 2018-01-15 2023-02-28 Shin-Etsu Chemical Co., Ltd. Silicone composition
KR20200135992A (ko) 2018-03-23 2020-12-04 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 조성물
US11773264B2 (en) 2018-03-23 2023-10-03 Shin-Etsu Chemical Co., Ltd. Silicone composition
KR20210076046A (ko) 2018-10-12 2021-06-23 신에쓰 가가꾸 고교 가부시끼가이샤 부가 경화형 실리콘 조성물 및 그 제조 방법
KR20210135235A (ko) 2019-03-04 2021-11-12 신에쓰 가가꾸 고교 가부시끼가이샤 비경화형 열전도성 실리콘 조성물
US11912869B2 (en) 2019-03-04 2024-02-27 Shin-Etsu Chemical Co., Ltd. Non-curable thermal-conductive silicone composition
KR20210148140A (ko) 2019-04-01 2021-12-07 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물, 그의 제조방법 및 반도체장치
US12180368B2 (en) 2019-04-01 2024-12-31 Shin-Etsu Chemical Co., Ltd. Thermal-conductive silicone composition, production method therefor, and semiconductor device
US12104113B2 (en) 2019-09-27 2024-10-01 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone composition, production method thereof, and semiconductor device
KR20220121805A (ko) 2019-12-23 2022-09-01 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물
US12391860B2 (en) 2019-12-23 2025-08-19 Shin-Etsu Chemical Co., Ltd. Thermal-conductive silicone composition
WO2023171353A1 (ja) 2022-03-08 2023-09-14 信越化学工業株式会社 ２液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物
WO2023171352A1 (ja) 2022-03-08 2023-09-14 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物

Also Published As

Publication number Publication date
US6649258B2 (en) 2003-11-18
DE60200630T2 (de) 2005-06-30
EP1254924A1 (en) 2002-11-06
JP2002327116A (ja) 2002-11-15
EP1254924B1 (en) 2004-06-16
US20030049466A1 (en) 2003-03-13
DE60200630D1 (de) 2004-07-22
TWI303261B (https=) 2008-11-21

Similar Documents

Publication Publication Date Title
JP3580366B2 (ja) 熱伝導性シリコーン組成物及び半導体装置
JP3580358B2 (ja) 熱伝導性シリコーン組成物及び半導体装置
JP5233325B2 (ja) 熱伝導性硬化物及びその製造方法
JP5182515B2 (ja) 熱伝導性シリコーングリース組成物
JP4656340B2 (ja) 熱伝導性シリコーングリース組成物
JP3803058B2 (ja) 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP5843368B2 (ja) 熱伝導性シリコーン組成物及びその硬化物
JP2008038137A (ja) 熱伝導性シリコーングリース組成物およびその硬化物
CN101544089A (zh) 导热层压材料及其制造方法
JP5105308B2 (ja) 低温加熱時における硬化速度を促進した熱伝導性シリコーン組成物
KR20080006482A (ko) 열전도성 실리콘 그리스 조성물 및 그의 경화물
TW201943768A (zh) 熱傳導性矽酮組成物及其硬化物
WO2022230600A1 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
TW201940657A (zh) 熱傳導性薄膜狀硬化物及其製造方法，以及熱傳導性構件
EP4349915A1 (en) Heat-conductive silicone composition
JP4162955B2 (ja) 放熱部材用粘着性シリコーン組成物
JP5047505B2 (ja) 放熱性に優れる電子装置およびその製造方法
JP2011138857A (ja) 放熱性及びリワーク性に優れる電子装置の製造方法及び電子装置
JP7771898B2 (ja) 熱伝導性シリコーン組成物
JP4725708B2 (ja) 放熱部品
JP2012102340A (ja) 熱伝導部材

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040421

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040519

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040602

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040630

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040713

R150 Certificate of patent or registration of utility model

Ref document number: 3580366

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100730

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130730

Year of fee payment: 9

EXPY Cancellation because of completion of term