1285675 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種導熱膏及使用該導熱膏的電子裝置。 【先前技術】 為解決發熱電子元件的散熱問題，人們通常在發熱電子元件上部 設置散熱器等散熱元件，藉由該散熱元件之較大的散熱面積，將發熱 電子元件產生之熱量散發出去。 為使散熱元件能快速地將發熱電子元件產生之熱量散發出去，發 熱電子元件與散熱元件間需具有良好的熱傳遞，即發熱電子元件與散 熱元件間應具有較小的接觸熱阻，然而，由於生產條件及生產成本的 >限制，發熱電子元件與散熱元件之接觸面並非完全平整的表面，故兩 者貼合時，其接觸面無法完全接觸而存在空氣間隙，而空氣的導熱係 數很低，一般約為a〇25W/(m.°C)左右，嚴重影響整體之散熱效果，為 此，一般於散熱元件與發熱電子元件之間塗佈熱介面材料，以填補散 熱元件與發熱電子元件間的空氣間隙，減小介面熱阻，提昇散熱效果， 以保證發熱電子元件的正常運作。 在現有熱介面材料中，導熱膏由於具有較低的熱阻而被廣泛應 用’然而導熱膏在長期使用下會發生溢油現象，給電子元件的散熱造 成不良影響。 【發明内容】 ^發明以具體實施例說明一種可改善溢油現象的導熱膏及使用該 導熱膏的電子裝置。 一種導熱膏，可填充於一發熱電子元件與一用於對該發熱電子元 件散熱的散熱元件之間，該導熱膏包括佔8~11%質量百分比的基體及 填充於基體内的熱導填充物，該熱導填充物的質量佔導熱膏質量的 =〜92% ’該基體包括含有矽氫鍵的含氫有機聚矽氧烷及含氫聚有機矽 氧烷中至少一種，以及含有烯基的有機聚矽氧烷。 該導熱膏利用含有矽氫鍵的含氫有機聚矽氧烷、含氫聚有機矽氧 1285675 烷及含有烯基的有機聚矽氧烷作為基體，該三種物質在催化劑的作用 下可發生反應，生成交聯成網狀的交聯產物，該交聯產物可降低該導 熱貧在咼溫下的流動現象，並可改善導熱膏的溢油問題。 【實施方式】 下面參照附圖結合實施例對本發明作進一步說明。1285675 IX. Description of the Invention: [Technical Field] The present invention relates to a thermal conductive paste and an electronic device using the same. [Prior Art] In order to solve the heat dissipation problem of the heat-generating electronic component, a heat dissipating component such as a heat sink is usually disposed on the upper portion of the heat-generating electronic component, and the heat generated by the heat-generating electronic component is radiated by the large heat-dissipating area of the heat-dissipating component. In order to enable the heat dissipating component to quickly dissipate the heat generated by the heat-generating electronic component, a good heat transfer between the heat-generating electronic component and the heat-dissipating component is required, that is, there should be a small contact thermal resistance between the heat-generating electronic component and the heat-dissipating component. Due to the limitation of production conditions and production cost, the contact surface of the heat-generating electronic component and the heat-dissipating component is not a completely flat surface, so when the two are bonded, the contact surface cannot be completely contacted and there is an air gap, and the thermal conductivity of the air is very high. Low, generally about a〇25W/(m.°C), which seriously affects the overall heat dissipation effect. For this reason, a thermal interface material is generally applied between the heat dissipating component and the heat generating electronic component to fill the heat dissipating component and the heat generating electron. The air gap between the components reduces the thermal resistance of the interface and improves the heat dissipation effect to ensure the normal operation of the heating electronic components. Among the existing thermal interface materials, the thermal paste is widely used because of its low thermal resistance. However, the thermal grease may cause oil spillage during long-term use, which adversely affects the heat dissipation of the electronic component. SUMMARY OF THE INVENTION The invention describes, by way of specific embodiments, a thermally conductive paste which can improve oil spillage and an electronic device using the same. A thermal conductive paste can be filled between a heat-generating electronic component and a heat-dissipating component for dissipating heat to the heat-generating electronic component, wherein the thermal conductive paste comprises a matrix of 8 to 11% by mass and a thermal conductive filler filled in the substrate The mass of the thermal conductive filler is ～92% of the mass of the thermal conductive paste. The substrate comprises at least one of a hydrogen-containing organic polyoxyalkylene containing a hydrogen bond and a hydrogen-containing polyorganosiloxane, and an alkenyl group. Organic polyoxyalkylene. The thermal conductive paste utilizes a hydrogen-containing organic polyoxane containing a hydrogen bond, a hydrogen-containing polyorganofluorene 1285756 alkane, and an alkenyl-containing organopolyoxyalkylene as a matrix, and the three substances can react under the action of a catalyst. The crosslinked product which is crosslinked into a network is formed, and the crosslinked product can reduce the flow phenomenon of the heat conduction and the lean temperature, and can improve the oil spill problem of the thermal paste. [Embodiment] Hereinafter, the present invention will be further described with reference to the accompanying drawings.
如第一圖所示，該使用導熱膏的電子裝置10包括一設於電路板u 上的發熱電子元件12、一用於對該發熱電子元件12散熱的散熱元件 13及填充於發熱電子元件12與散熱元件13間之導熱膏14。該散熱元 件13包括一基板131及設於基板131上的複數散熱鰭片133。該散熱 元件13藉由一固定元件15固定至電路板^上，並向下按壓該導熱膏 14 ’使該導熱膏14充分填充於發熱電子元件12與散熱元件13之基板 131間的空隙内，降低該發熱電子元件12與散熱元件13的接觸熱阻， 使該發熱電子元件12與該散熱元件13間存在良好的熱傳遞。 該導熱膏具有較小的熱阻，包括基體及填充於基體内的熱導填充 物。 基體的質量約佔導熱膏總質量的8~11%，該基體包括含氫有機聚 石夕氧烧（organo-hydrogenpolysiloxane)、含氫聚有機石夕氧院 &〇17〇1^11〇117(11：(^118〖1〇^116)及有機聚發氧烧(〇职11(^〇1)^1〇\〇116)〇其 中’含氫有機聚矽氧烷之結構式可為： 〒3 CH3 — Si一〇_ CH3 一 Η 1 — ch3 1 1 --Si-〇 - 1 • Si-〇 CH3 1— 一 a 1 0¾ ch3 -Si- b 上，結構式中，a〇i<a/(a+b)<0.4，該含氫有機聚矽氧烷包括至少 一個矽氫基(Si-H group)，該H原子位於含氫有機聚矽氧烷之結構式的 側鍵上。 含氫聚有機矽氧烷之結構式為： 1285675 f f H-Si-O-Si-CCUt), Ο Θ 1 l 嘯务§卜|| I 擊 Me He CI>As shown in the first figure, the electronic device 10 using the thermal paste includes a heat-generating electronic component 12 disposed on the circuit board u, a heat dissipating component 13 for dissipating heat to the heat-generating electronic component 12, and a heat-dissipating component 12 Thermal paste 14 between the heat dissipating component 13. The heat dissipating component 13 includes a substrate 131 and a plurality of heat dissipation fins 133 disposed on the substrate 131. The heat dissipating component 13 is fixed to the circuit board by a fixing component 15 and presses the thermal conductive paste 14 ′ downward to fully fill the gap between the heat generating electronic component 12 and the substrate 131 of the heat dissipating component 13 . The thermal resistance of contact between the heat-generating electronic component 12 and the heat-dissipating component 13 is lowered, so that there is good heat transfer between the heat-generating electronic component 12 and the heat-dissipating component 13. The thermal paste has a small thermal resistance, including a substrate and a thermally conductive filler filled in the substrate. The mass of the matrix accounts for about 8-11% of the total mass of the thermal paste. The matrix includes hydrogen-containing organopolyhydrogen polysiloxane, hydrogen-containing polyorganisms, and 〇17〇1^11〇117 (11: (^118〖1〇^116) and organic polyoxygenation (〇职11(^〇1)^1〇\〇116)) The structural formula of 'hydrogen-containing organopolyoxyalkylene can be: 〒3 CH3 — Si 〇 _ CH3 Η 1 — ch3 1 1 --Si-〇- 1 • Si-〇CH3 1—one a 1 03⁄4 ch3 -Si- b, in the structural formula, a〇i<a / (a + b) < 0.4, the hydrogen-containing organopolyoxyalkylene oxide includes at least one hydrogen group (Si-H group) which is located on a side bond of a structural formula containing a hydrogen-containing organopolyoxyalkylene. The structural formula of the hydrogen-containing polyorganosiloxane is: 1285675 ff H-Si-O-Si-CCUt), Ο Θ 1 l Howling § 卜 || I Click Me He CI>
Ub Me 〇 〇 V Η-Si 令S*-H 1 ! Me Me ^ ^ Me 紐-p-O-’l -(¾令(版》3 -g i 一^^ ai> 0 o Hh-Si，0—Si，H 1 Im m o (鼴> (注：Me為曱基） ’ μ ^ 包㈣三财氮鍵 有機聚矽氧烷之結構式可為 CH=：CH2 MeUb Me 〇〇V Η-Si Let S*-H 1 ! Me Me ^ ^ Me New-pO-'l -(3⁄4令(版)3 -gi一^^ ai> 0 o Hh-Si,0-Si , H 1 Im mo (鼹> (Note: Me is sulfhydryl) ' μ ^ Package (4) The structural formula of the tripolynitrogen bond organopolyoxane can be CH=:CH2 Me
Me—Si — □Me-Si — □
Sr 口 Si ~ Me Π· Me m Me ，中’m大於或等於2 ’使該有機聚魏烧包含至少兩個 ίίΐίΐ基(alkenyl grcup) °m可進行合理的取值，使該有機 r所人ϋ時的枯度為50〜5〇〇〇cps，並使該導熱膏中有機聚魏 的個數與含氯有機聚石夕氧貌及含氫聚有機石夕氧烧中石夕 ίίΓ〃德’制使該錢妙她可與含有魏鍵的含氫 生触•狀應，《交聯成 熱導填充物的質量約佔導熱貧總質量的89〜92%，該熱導填充物包 1285675 括平均粒徑為1〜5μιη的紹粉與平均粒徑為〇1〜1μχη的氧化辞粉末至少 其中一種，當該熱導填充物為鋁粉與氧化鋅粉末的混合物時，它們的 質量比為1:1〜10:1。 該基體内還填充有佔有機聚矽氧烷質量的百萬分之01〜500的催 化劑(catalyst)，該催化劑用於提昇有機聚矽氧烷中的烯基與含氫有機聚 矽氧烷、含氫聚有機矽氧烷中的矽氫鍵間加成反應的速度。該催化劑 包括顧(platinum)或始的化合物(platinum compound)中至少一種，該銘的 化合物可為氯鉑氫酸(chloroplatinic acid)、烯烴鉑錯合物(platinum-olefin complexes)、乙醇始錯合物(platinum-alcoholcomplexes)等。Sr mouth Si ~ Me Π · Me m Me , medium 'm is greater than or equal to 2 ', so that the organic poly-wei burning contains at least two ίίΐίΐ base (alkenyl grcup) °m can be reasonably valued, so that the organic The dryness of ϋ is 50~5〇〇〇cps, and the number of organic poly-wei in the thermal paste is related to the chlorinated organic polychlorite and the hydrogen-containing poly-organic stone igniting in the Xi Shi ίίΓ〃 The system can make the same as the hydrogen-containing contact with the Wei bond. The quality of the cross-linked thermal conductive filler accounts for 89~92% of the total mass of the heat-conducting poor. The thermal conductive filler package is 1,256,675. The powder having an average particle diameter of 1 to 5 μm and at least one of the oxidized powder having an average particle diameter of 〇1 to 1 μχη, when the thermal conductive filler is a mixture of aluminum powder and zinc oxide powder, their mass ratio is 1 :1~10:1. The substrate is further filled with a catalyst of 01 to 500 parts per million by mass of the organic polyoxane, which is used for raising an alkenyl group and a hydrogen-containing organic polyoxane in the organic polyoxane. The rate of addition reaction between hydrazine hydrogen bonds in a hydrogen-containing polyorganosiloxane. The catalyst comprises at least one of a platinum or a platinum compound, which may be a chloroplatinic acid, a platinum-olefin complexes, or an ethanol mismatch. (platinum-alcoholcomplexes) and the like.
該導熱膏利用含氫有機聚矽氧烷、含氫聚有機矽氧烷及有機聚矽 氧烷作為基體，該有機聚矽氧烷中的烯基在催化劑的作用下可與含氫 有機聚矽氧烷及含氫聚有機矽氧烷中的矽氫鍵反應，將有機聚矽氧 -烷、含氫有機聚矽氧烷及含氫聚有機矽氧烷連接起來，生成交聯成網 狀的交聯產物，該交聯產物呈網狀結構，可降低該導熱膏在高溫下的 ' 流動現象，並可改善導熱膏的溢油(bleeding)問題。 可以理解地，該含氳有機聚矽氧烷、含氫聚有機矽氧烷及有機聚 矽氧烷中的甲基可替換為烷基、芳基、芳烷基、烯基等烃基，且該等 烃基中之氫原子可被鹵素取代，而形成齒代烃基。該基體中包含含氫 有機聚矽氧烷與含氫聚有機矽氧烷中任一種及有機聚矽氧烷亦可改善 導熱膏的溢油問題。 【圖式簡單說明】 第一圖為本發明電子裝置的示意圖。 【主要元件符號說明】 電子裝置 10 電路板 11 發熱電子元件 12 散熱元件 13 基板 131 散熱鰭片 133 導熱膏 14 固定元件 15 9 ⑧The thermal conductive paste utilizes a hydrogen-containing organopolysiloxane, a hydrogen-containing polyorganosiloxane and an organic polyoxyalkylene as a matrix, and the alkenyl group in the organopolyoxane can react with a hydrogen-containing organic polycondensate under the action of a catalyst. The hydrazine hydrogen bond reaction between oxane and hydrogen-containing polyorganosiloxane, linking the organopolyoxy-alkane, the hydrogen-containing organopolyoxyalkylene and the hydrogen-containing polyorganosiloxane to form a crosslinked network The crosslinked product has a network structure, which can reduce the 'flow phenomenon of the thermal conductive paste at a high temperature, and can improve the problem of the bleeding of the thermal conductive paste. It is understood that the methyl group in the ruthenium-containing organopolyoxane, the hydrogen-containing polyorganosiloxane and the organopolyoxane can be replaced by a hydrocarbon group such as an alkyl group, an aryl group, an aralkyl group or an alkenyl group, and the The hydrogen atom in the hydrocarbyl group may be substituted by a halogen to form a hydrocarbyl group. The inclusion of either hydrogen-containing polyorganosiloxane and hydrogen-containing polyorganosiloxane in the matrix and the organopolyoxane can also improve the oil spill problem of the thermal paste. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of an electronic device of the present invention. [Description of main components] Electronic device 10 Circuit board 11 Heated electronic components 12 Heat dissipating components 13 Substrate 131 Heat sink fins 133 Thermal paste 14 Fixing components 15 9 8