TWI303261B - - Google Patents

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Publication number
TWI303261B
TWI303261B TW91109016A TW91109016A TWI303261B TW I303261 B TWI303261 B TW I303261B TW 91109016 A TW91109016 A TW 91109016A TW 91109016 A TW91109016 A TW 91109016A TW I303261 B TWI303261 B TW I303261B
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TW
Taiwan
Prior art keywords
component
group
composition
weight
page
Prior art date
Application number
TW91109016A
Other languages
English (en)
Chinese (zh)
Inventor
Kunihiro Yamada
Kenichi Isobe
Original Assignee
Shinetsu Chemical Co
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Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
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Publication of TWI303261B publication Critical patent/TWI303261B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW91109016A 2001-05-01 2002-04-30 TWI303261B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001133895A JP3580366B2 (ja) 2001-05-01 2001-05-01 熱伝導性シリコーン組成物及び半導体装置

Publications (1)

Publication Number Publication Date
TWI303261B true TWI303261B (https=) 2008-11-21

Family

ID=18981678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91109016A TWI303261B (https=) 2001-05-01 2002-04-30

Country Status (5)

Country Link
US (1) US6649258B2 (https=)
EP (1) EP1254924B1 (https=)
JP (1) JP3580366B2 (https=)
DE (1) DE60200630T2 (https=)
TW (1) TWI303261B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104968728A (zh) * 2013-01-22 2015-10-07 信越化学工业株式会社 导热性有机硅组合物、导热性层和半导体装置
TWI620797B (zh) * 2011-01-26 2018-04-11 道康寧公司 高溫穩定性熱傳導材料
TWI784028B (zh) * 2017-07-24 2022-11-21 日商陶氏東麗股份有限公司 導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060747B2 (en) 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
JP3803058B2 (ja) 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP2004176016A (ja) * 2002-11-29 2004-06-24 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及びその成形体
US6992893B2 (en) * 2003-01-10 2006-01-31 Hewlett-Packard Development Company, L.P. Heat sink attachment
US7645422B2 (en) 2003-04-11 2010-01-12 Therm-O-Disc, Incorporated Vapor sensor and materials therefor
JP2005064291A (ja) * 2003-08-14 2005-03-10 Nissan Motor Co Ltd 絶縁シートおよびこの絶縁シートを用いた半導体装置組立体
JP3932125B2 (ja) * 2003-08-14 2007-06-20 信越化学工業株式会社 熱軟化性熱伝導性部材
JP4154605B2 (ja) * 2004-01-23 2008-09-24 信越化学工業株式会社 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法
US7119143B2 (en) * 2004-03-04 2006-10-10 Laird Technologies, Inc. Silicone pads for electronics thermal management
TWI385246B (zh) 2004-05-21 2013-02-11 信越化學工業股份有限公司 聚矽氧烷潤滑油組成物
US7211637B2 (en) 2004-06-03 2007-05-01 Therm-O-Disc, Incorporated Sterically hindered reagents for use in single component siloxane cure systems
JP4687887B2 (ja) * 2004-10-14 2011-05-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2006143978A (ja) * 2004-11-25 2006-06-08 Ge Toshiba Silicones Co Ltd 熱伝導性シリコーン組成物
US7708947B2 (en) 2005-11-01 2010-05-04 Therm-O-Disc, Incorporated Methods of minimizing temperature cross-sensitivity in vapor sensors and compositions therefor
TWI285675B (en) * 2005-12-16 2007-08-21 Foxconn Tech Co Ltd Heat conductive grease and semiconductor device
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
EP1878767A1 (en) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
US8012420B2 (en) 2006-07-18 2011-09-06 Therm-O-Disc, Incorporated Robust low resistance vapor sensor materials
JP2008106185A (ja) * 2006-10-27 2008-05-08 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物の接着方法、熱伝導性シリコーン組成物接着用プライマー及び熱伝導性シリコーン組成物の接着複合体の製造方法
JP2007150349A (ja) * 2007-02-09 2007-06-14 Shin Etsu Chem Co Ltd 熱軟化性熱伝導性部材
US8691390B2 (en) 2007-11-20 2014-04-08 Therm-O-Disc, Incorporated Single-use flammable vapor sensor films
US8106119B2 (en) * 2007-12-04 2012-01-31 Sea-Fue Wang Thermally conductive silicone composition
US20090143522A1 (en) * 2007-12-04 2009-06-04 Sea-Fue Wang Thermally Conductive Silicone Composition
JP2008160126A (ja) * 2007-12-21 2008-07-10 Shin Etsu Chem Co Ltd 電子部品の冷却構造
JP5372388B2 (ja) 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
JP4656340B2 (ja) * 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP5182515B2 (ja) * 2008-12-25 2013-04-17 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5111451B2 (ja) * 2009-07-01 2013-01-09 信越化学工業株式会社 熱伝導性シリコーン組成物の接着方法、熱伝導性シリコーン組成物接着用プライマー及び熱伝導性シリコーン組成物の接着複合体の製造方法
JP5365572B2 (ja) 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
CN102234427B (zh) * 2010-04-29 2013-01-30 比亚迪股份有限公司 一种硅橡胶组合物及硅橡胶的制备方法
JP2012077256A (ja) 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5733087B2 (ja) 2011-07-29 2015-06-10 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
CN104136569A (zh) * 2012-03-02 2014-11-05 富士高分子工业株式会社 油灰状传热材料及其制造方法
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
JP2014003141A (ja) * 2012-06-18 2014-01-09 Shin Etsu Chem Co Ltd 熱伝導性シート及び電子機器
JP5832983B2 (ja) * 2012-10-18 2015-12-16 信越化学工業株式会社 シリコーン組成物
JP5843368B2 (ja) 2013-05-07 2016-01-13 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
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US20150259584A1 (en) * 2014-03-11 2015-09-17 Randall D. Lowe, JR. Integrated heat spreader sealants for microelectronic packaging
JP6023737B2 (ja) * 2014-03-18 2016-11-09 信越化学工業株式会社 ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP6149831B2 (ja) 2014-09-04 2017-06-21 信越化学工業株式会社 シリコーン組成物
EP3199591B1 (en) 2014-09-25 2020-04-29 Shin-Etsu Chemical Co., Ltd. Uv-thickening thermally conductive silicone grease composition
JP6260519B2 (ja) 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
JP6510315B2 (ja) * 2015-05-14 2019-05-08 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材
JP6223590B2 (ja) * 2015-05-22 2017-11-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JP6524879B2 (ja) 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
JP6465037B2 (ja) 2016-01-07 2019-02-06 信越化学工業株式会社 縮合硬化反応と有機過酸化物硬化反応を併用したシリコーン組成物
US10781349B2 (en) * 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
JP6642145B2 (ja) 2016-03-14 2020-02-05 信越化学工業株式会社 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法
JP6531238B2 (ja) 2016-10-31 2019-06-19 ダウ・東レ株式会社 １液硬化型熱伝導性シリコーングリース組成物及び電子・電装部品
JP6874366B2 (ja) * 2016-12-28 2021-05-19 信越化学工業株式会社 シリコーン組成物およびその硬化物
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CN110234711B (zh) 2017-01-27 2022-02-11 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
KR102318181B1 (ko) 2017-02-08 2021-10-27 엘켐 실리콘즈 유에스에이 코포레이션 열 관리가 개선된 이차 배터리 팩
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US20210388207A1 (en) 2018-10-12 2021-12-16 Shin-Etsu Chemical Co., Ltd. Addition curing silicone composition and method for manufacturing same
JP6959950B2 (ja) 2019-03-04 2021-11-05 信越化学工業株式会社 非硬化型熱伝導性シリコーン組成物
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JP7027368B2 (ja) 2019-04-01 2022-03-01 信越化学工業株式会社 熱伝導性シリコーン組成物、その製造方法及び半導体装置
WO2021059936A1 (ja) 2019-09-27 2021-04-01 信越化学工業株式会社 熱伝導性シリコーン組成物及びその製造方法、並びに半導体装置
WO2021079714A1 (ja) * 2019-10-24 2021-04-29 信越化学工業株式会社 熱伝導性シリコーン組成物及びその製造方法
JP7325324B2 (ja) 2019-12-23 2023-08-14 信越化学工業株式会社 熱伝導性シリコーン組成物
KR102928483B1 (ko) * 2020-03-16 2026-02-23 다우 실리콘즈 코포레이션 열 전도성 실리콘 조성물
KR20230045054A (ko) * 2020-09-07 2023-04-04 와커 헤미 아게 하이드로겐폴리오르가노실록산 및 이의 열전도성 실리콘 조성물
CN116368195B (zh) * 2020-09-23 2026-03-10 陶氏环球技术有限责任公司 具有低分配粘度、分配后具有低竖向流动且固化后具有低热阻抗的热界面材料
KR102873150B1 (ko) * 2020-09-29 2025-10-17 주식회사 엘지에너지솔루션 경화성 조성물 및 2액형 수지 조성물
KR102873146B1 (ko) * 2020-09-29 2025-10-17 주식회사 엘지에너지솔루션 경화성 조성물 및 2액형 수지 조성물
CN116997613A (zh) 2022-01-28 2023-11-03 瓦克化学股份公司 含铝导热膏
JP7644726B2 (ja) 2022-01-31 2025-03-12 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物、及びその硬化物
US20250129216A1 (en) 2022-02-28 2025-04-24 Shin-Etsu Chemical Co., Ltd. Thermal conductive silicone composition
EP4491673A4 (en) 2022-03-08 2026-03-18 Shinetsu Chemical Co TWO-COMPONENT ADDITION-CURDED THERMOCONDUCTIVE SILICONE COMPOSITION, AND A HARDENED SILICONE OBJECT THEREIN
JPWO2023171352A1 (https=) 2022-03-08 2023-09-14
JP7630895B2 (ja) * 2022-05-25 2025-02-18 信越化学工業株式会社 絶縁性熱伝導シート
WO2025118170A1 (en) * 2023-12-06 2025-06-12 Henkel Ag & Co. Kgaa Thermally conductive silicone adhesive composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61157569A (ja) 1984-12-28 1986-07-17 Shin Etsu Polymer Co Ltd 熱伝導性接着組成物
US4845164A (en) 1986-03-03 1989-07-04 Dow Corning Corporation Liquid curable polyorganosiloxane compositions
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
CA2035964A1 (en) * 1990-03-06 1991-09-07 Carl R. Kessel Solventless silicon release coating
JP3592809B2 (ja) * 1995-09-13 2004-11-24 東レ・ダウコーニング・シリコーン株式会社 フッ素樹脂被覆定着ロール用シリコーンゴム組成物およびフッ素樹脂被覆定着ロール
JPH08208993A (ja) 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
US6069201A (en) * 1997-09-12 2000-05-30 Shin-Etsu Chemical Co., Ltd. Zinc oxide-filled addition-curable silicone rubber compositions
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
JP4639361B2 (ja) * 2000-05-26 2011-02-23 東レ・ダウコーニング株式会社 剥離性硬化皮膜形成用シリコーン組成物
JP3580358B2 (ja) * 2000-06-23 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
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TWI620797B (zh) * 2011-01-26 2018-04-11 道康寧公司 高溫穩定性熱傳導材料
CN104968728A (zh) * 2013-01-22 2015-10-07 信越化学工业株式会社 导热性有机硅组合物、导热性层和半导体装置
CN104968728B (zh) * 2013-01-22 2017-09-22 信越化学工业株式会社 导热性有机硅组合物、导热性层和半导体装置
TWI784028B (zh) * 2017-07-24 2022-11-21 日商陶氏東麗股份有限公司 導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體

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JP2002327116A (ja) 2002-11-15
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