JPWO2023171352A1 - - Google Patents

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Publication number
JPWO2023171352A1
JPWO2023171352A1 JP2024506029A JP2024506029A JPWO2023171352A1 JP WO2023171352 A1 JPWO2023171352 A1 JP WO2023171352A1 JP 2024506029 A JP2024506029 A JP 2024506029A JP 2024506029 A JP2024506029 A JP 2024506029A JP WO2023171352 A1 JPWO2023171352 A1 JP WO2023171352A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024506029A
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Japanese (ja)
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3437—Six-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/05—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2024506029A 2022-03-08 2023-02-21 Pending JPWO2023171352A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022035252 2022-03-08
PCT/JP2023/006096 WO2023171352A1 (ja) 2022-03-08 2023-02-21 熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物

Publications (1)

Publication Number Publication Date
JPWO2023171352A1 true JPWO2023171352A1 (https=) 2023-09-14

Family

ID=87936860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024506029A Pending JPWO2023171352A1 (https=) 2022-03-08 2023-02-21

Country Status (7)

Country Link
US (1) US20250188225A1 (https=)
EP (1) EP4491672A4 (https=)
JP (1) JPWO2023171352A1 (https=)
KR (1) KR20240157074A (https=)
CN (1) CN118829691A (https=)
TW (1) TW202403009A (https=)
WO (1) WO2023171352A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4491673A4 (en) * 2022-03-08 2026-03-18 Shinetsu Chemical Co TWO-COMPONENT ADDITION-CURDED THERMOCONDUCTIVE SILICONE COMPOSITION, AND A HARDENED SILICONE OBJECT THEREIN

Citations (15)

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JPH09176495A (ja) * 1995-12-28 1997-07-08 Furukawa Electric Co Ltd:The 屋外用絶縁高分子材料組成物および屋外用高電圧機器
JP2001247581A (ja) * 2000-03-03 2001-09-11 Dow Corning Asia Ltd 有機ケイ素化合物の製造方法
EP1266903A1 (en) * 2001-06-15 2002-12-18 DOW CORNING ASIA, Ltd. Method of preparing an organosilicon compound
WO2011132419A1 (ja) * 2010-04-22 2011-10-27 日本化薬株式会社 銀変色防止剤、銀変色防止樹脂組成物、銀変色防止方法、及びこれを使用した発光ダイオード
CN103145748A (zh) * 2013-03-08 2013-06-12 山东大学 一种含有8-羟基喹啉有机硅聚合物的金属离子配合物
US20140322651A1 (en) * 2013-04-26 2014-10-30 Chi Mei Corporation Photosensitive polysiloxane composition, protecting film and element having the protecting film
CN104423170A (zh) * 2013-09-10 2015-03-18 奇美实业股份有限公司 感光性聚硅氧烷组合物、保护膜及具有保护膜的组件
US20150234275A1 (en) * 2014-02-18 2015-08-20 Chi Mei Corporation Photosensitive polysiloxane composition, protecting film and element having the protecting film
CN106243704A (zh) * 2016-08-30 2016-12-21 宁波通冠电气自动化设备有限公司 一种led用散热呼吸器尼龙材料及其制备方法
JP2017057290A (ja) * 2015-09-17 2017-03-23 信越化学工業株式会社 蛍光体含有シリコーンフィルム及びその製造方法
CN106702749A (zh) * 2016-12-13 2017-05-24 中山市得高行知识产权中心（有限合伙） 一种纺织面料表面改性处理剂及其制备方法
JP2020529486A (ja) * 2017-08-04 2020-10-08 ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ 貴金属触媒の安定化
WO2022181281A1 (ja) * 2021-02-25 2022-09-01 コニカミノルタ株式会社 封止材組成物、半導体封止材料及び半導体
WO2023171353A1 (ja) * 2022-03-08 2023-09-14 信越化学工業株式会社 ２液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物
JP2024506030A (ja) * 2021-12-31 2024-02-08 寧徳時代新能源科技股▲分▼有限公司 電池加熱システム、方法、給電システム及び電気装置

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JPS58366B2 (ja) 1973-10-06 1983-01-06 ソニー株式会社 表面材貼付方法
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JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
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JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP4913874B2 (ja) 2010-01-18 2012-04-11 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5447337B2 (ja) 2010-10-29 2014-03-19 信越化学工業株式会社 シリコーン構造体の製造方法及び半導体装置
JP5553006B2 (ja) 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
KR101866299B1 (ko) 2011-01-26 2018-06-12 다우 실리콘즈 코포레이션 고온 안정성 열 전도성 재료
JP6887815B2 (ja) 2017-01-30 2021-06-16 富士高分子工業株式会社 耐熱性熱伝導性シリコーン組成物
JP6988023B1 (ja) * 2020-09-03 2022-01-05 富士高分子工業株式会社 熱伝導性シリコーン放熱材料

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09176495A (ja) * 1995-12-28 1997-07-08 Furukawa Electric Co Ltd:The 屋外用絶縁高分子材料組成物および屋外用高電圧機器
JP2001247581A (ja) * 2000-03-03 2001-09-11 Dow Corning Asia Ltd 有機ケイ素化合物の製造方法
EP1266903A1 (en) * 2001-06-15 2002-12-18 DOW CORNING ASIA, Ltd. Method of preparing an organosilicon compound
WO2011132419A1 (ja) * 2010-04-22 2011-10-27 日本化薬株式会社 銀変色防止剤、銀変色防止樹脂組成物、銀変色防止方法、及びこれを使用した発光ダイオード
CN103145748A (zh) * 2013-03-08 2013-06-12 山东大学 一种含有8-羟基喹啉有机硅聚合物的金属离子配合物
US20140322651A1 (en) * 2013-04-26 2014-10-30 Chi Mei Corporation Photosensitive polysiloxane composition, protecting film and element having the protecting film
CN104423170A (zh) * 2013-09-10 2015-03-18 奇美实业股份有限公司 感光性聚硅氧烷组合物、保护膜及具有保护膜的组件
US20150234275A1 (en) * 2014-02-18 2015-08-20 Chi Mei Corporation Photosensitive polysiloxane composition, protecting film and element having the protecting film
JP2017057290A (ja) * 2015-09-17 2017-03-23 信越化学工業株式会社 蛍光体含有シリコーンフィルム及びその製造方法
CN106243704A (zh) * 2016-08-30 2016-12-21 宁波通冠电气自动化设备有限公司 一种led用散热呼吸器尼龙材料及其制备方法
CN106702749A (zh) * 2016-12-13 2017-05-24 中山市得高行知识产权中心（有限合伙） 一种纺织面料表面改性处理剂及其制备方法
JP2020529486A (ja) * 2017-08-04 2020-10-08 ワッカー ケミー アクチエンゲゼルシャフトＷａｃｋｅｒ Ｃｈｅｍｉｅ ＡＧ 貴金属触媒の安定化
WO2022181281A1 (ja) * 2021-02-25 2022-09-01 コニカミノルタ株式会社 封止材組成物、半導体封止材料及び半導体
JP2024506030A (ja) * 2021-12-31 2024-02-08 寧徳時代新能源科技股▲分▼有限公司 電池加熱システム、方法、給電システム及び電気装置
WO2023171353A1 (ja) * 2022-03-08 2023-09-14 信越化学工業株式会社 ２液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物

Also Published As

Publication number Publication date
EP4491672A1 (en) 2025-01-15
TW202403009A (zh) 2024-01-16
US20250188225A1 (en) 2025-06-12
WO2023171352A1 (ja) 2023-09-14
KR20240157074A (ko) 2024-10-31
EP4491672A4 (en) 2026-03-18
CN118829691A (zh) 2024-10-22

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