KR20240157074A - 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물 - Google Patents

열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물 Download PDF

Info

Publication number
KR20240157074A
KR20240157074A KR1020247032876A KR20247032876A KR20240157074A KR 20240157074 A KR20240157074 A KR 20240157074A KR 1020247032876 A KR1020247032876 A KR 1020247032876A KR 20247032876 A KR20247032876 A KR 20247032876A KR 20240157074 A KR20240157074 A KR 20240157074A
Authority
KR
South Korea
Prior art keywords
group
component
thermally conductive
mass
silicone composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247032876A
Other languages
English (en)
Korean (ko)
Inventor
유지 다바타
미츠히로 이와타
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤
Publication of KR20240157074A publication Critical patent/KR20240157074A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3437—Six-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/05—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247032876A 2022-03-08 2023-02-21 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물 Pending KR20240157074A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-035252 2022-03-08
JP2022035252 2022-03-08
PCT/JP2023/006096 WO2023171352A1 (ja) 2022-03-08 2023-02-21 熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物

Publications (1)

Publication Number Publication Date
KR20240157074A true KR20240157074A (ko) 2024-10-31

Family

ID=87936860

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247032876A Pending KR20240157074A (ko) 2022-03-08 2023-02-21 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물

Country Status (7)

Country Link
US (1) US20250188225A1 (https=)
EP (1) EP4491672A4 (https=)
JP (1) JPWO2023171352A1 (https=)
KR (1) KR20240157074A (https=)
CN (1) CN118829691A (https=)
TW (1) TW202403009A (https=)
WO (1) WO2023171352A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4491673A4 (en) * 2022-03-08 2026-03-18 Shinetsu Chemical Co TWO-COMPONENT ADDITION-CURDED THERMOCONDUCTIVE SILICONE COMPOSITION, AND A HARDENED SILICONE OBJECT THEREIN

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913874B1 (https=) 1969-08-29 1974-04-03
JPS4917380B1 (https=) 1970-07-06 1974-04-30
JPS4933094B1 (https=) 1968-12-31 1974-09-04
JPS5233325U (https=) 1975-08-30 1977-03-09
JPS5283346U (https=) 1975-12-17 1977-06-21
JPS5447337U (https=) 1977-09-07 1979-04-02
JPS5553006U (https=) 1978-10-04 1980-04-09
JPS58366B2 (ja) 1973-10-06 1983-01-06 ソニー株式会社 表面材貼付方法
JPS6048416U (ja) 1983-09-13 1985-04-05 住友ベークライト株式会社 板状体のそり直し装置
JP2018123200A (ja) 2017-01-30 2018-08-09 富士高分子工業株式会社 耐熱性熱伝導性シリコーン組成物

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09176495A (ja) * 1995-12-28 1997-07-08 Furukawa Electric Co Ltd:The 屋外用絶縁高分子材料組成物および屋外用高電圧機器
JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP4678910B2 (ja) * 2000-03-03 2011-04-27 ダウ コーニング コーポレーション 有機ケイ素化合物の製造方法
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
EP1266903B1 (en) * 2001-06-15 2004-09-29 DOW CORNING ASIA, Ltd. Method of preparing an organosilicon compound
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP4656340B2 (ja) 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP4913874B2 (ja) 2010-01-18 2012-04-11 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
CN102906309B (zh) * 2010-04-22 2015-01-14 日本化药株式会社 防银变色剂、防银变色树脂组合物、防银变色方法、及使用该防银变色剂的发光二极管
JP5447337B2 (ja) 2010-10-29 2014-03-19 信越化学工業株式会社 シリコーン構造体の製造方法及び半導体装置
JP5553006B2 (ja) 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
KR101866299B1 (ko) 2011-01-26 2018-06-12 다우 실리콘즈 코포레이션 고온 안정성 열 전도성 재료
CN103145748A (zh) * 2013-03-08 2013-06-12 山东大学 一种含有8-羟基喹啉有机硅聚合物的金属离子配合物
TWI459145B (zh) * 2013-04-26 2014-11-01 Chi Mei Corp 光硬化性聚矽氧烷組成物、保護膜及具有保護膜的元件
TWI506374B (zh) * 2013-09-10 2015-11-01 Chi Mei Corp 感光性聚矽氧烷組成物、保護膜及具有保護膜的元件
TWI540396B (zh) * 2014-02-18 2016-07-01 奇美實業股份有限公司 感光性聚矽氧烷組成物、保護膜及具有保護膜的元件
JP6502809B2 (ja) * 2015-09-17 2019-04-17 信越化学工業株式会社 Ｌｅｄ封止材用蛍光体含有シリコーンフィルム及びその製造方法
CN106243704A (zh) * 2016-08-30 2016-12-21 宁波通冠电气自动化设备有限公司 一种led用散热呼吸器尼龙材料及其制备方法
CN106702749A (zh) * 2016-12-13 2017-05-24 中山市得高行知识产权中心（有限合伙） 一种纺织面料表面改性处理剂及其制备方法
WO2019025002A1 (de) * 2017-08-04 2019-02-07 Wacker Chemie Ag Stabilisierung von edelmetallkatalysatoren
JP6988023B1 (ja) * 2020-09-03 2022-01-05 富士高分子工業株式会社 熱伝導性シリコーン放熱材料
WO2022181281A1 (ja) * 2021-02-25 2022-09-01 コニカミノルタ株式会社 封止材組成物、半導体封止材料及び半導体
CN117157799A (zh) * 2021-12-31 2023-12-01 宁德时代新能源科技股份有限公司 电池加热系统、方法、供电系统和用电装置
EP4491673A4 (en) * 2022-03-08 2026-03-18 Shinetsu Chemical Co TWO-COMPONENT ADDITION-CURDED THERMOCONDUCTIVE SILICONE COMPOSITION, AND A HARDENED SILICONE OBJECT THEREIN

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933094B1 (https=) 1968-12-31 1974-09-04
JPS4913874B1 (https=) 1969-08-29 1974-04-03
JPS4917380B1 (https=) 1970-07-06 1974-04-30
JPS58366B2 (ja) 1973-10-06 1983-01-06 ソニー株式会社 表面材貼付方法
JPS5233325U (https=) 1975-08-30 1977-03-09
JPS5283346U (https=) 1975-12-17 1977-06-21
JPS5447337U (https=) 1977-09-07 1979-04-02
JPS5553006U (https=) 1978-10-04 1980-04-09
JPS6048416U (ja) 1983-09-13 1985-04-05 住友ベークライト株式会社 板状体のそり直し装置
JP2018123200A (ja) 2017-01-30 2018-08-09 富士高分子工業株式会社 耐熱性熱伝導性シリコーン組成物

Also Published As

Publication number Publication date
EP4491672A1 (en) 2025-01-15
TW202403009A (zh) 2024-01-16
US20250188225A1 (en) 2025-06-12
WO2023171352A1 (ja) 2023-09-14
EP4491672A4 (en) 2026-03-18
JPWO2023171352A1 (https=) 2023-09-14
CN118829691A (zh) 2024-10-22

Similar Documents

Publication Publication Date Title
CN106414613B (zh) 导热有机硅组合物和电气电子设备
JP6149831B2 (ja) シリコーン組成物
KR102683945B1 (ko) 실리콘 조성물
JP5832983B2 (ja) シリコーン組成物
KR102806614B1 (ko) 실리콘 조성물
JP5947267B2 (ja) シリコーン組成物及び熱伝導性シリコーン組成物の製造方法
CN115667409B (zh) 导热性加成固化型有机硅组合物及其制备方法
CN114729194B (zh) 导热性加成固化型有机硅组合物及其制造方法
KR20240157075A (ko) 2액형 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물
KR102937544B1 (ko) 열전도성 2액부가경화형 실리콘 조성물 및 그의 제조방법
KR20240157074A (ko) 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물
WO2023021954A1 (ja) 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物
WO2024024503A1 (ja) 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート
KR20260018849A (ko) 열전도성 2액 부가경화형 실리콘 조성물, 경화물 및 시트
TW202547908A (zh) 熱傳導性聚矽氧組合物及硬化物
KR20260017424A (ko) 열전도성 2액 부가 경화형 실리콘 조성물, 경화물 및 시트
JP2025110656A (ja) 熱伝導性付加硬化型シリコーン組成物

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20241002

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application