JP3396137B2 - コンデンサおよびその作製方法 - Google Patents

コンデンサおよびその作製方法

Info

Publication number
JP3396137B2
JP3396137B2 JP27453096A JP27453096A JP3396137B2 JP 3396137 B2 JP3396137 B2 JP 3396137B2 JP 27453096 A JP27453096 A JP 27453096A JP 27453096 A JP27453096 A JP 27453096A JP 3396137 B2 JP3396137 B2 JP 3396137B2
Authority
JP
Japan
Prior art keywords
layer
metal
opening
capacitor
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP27453096A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09181258A (ja
Inventor
テリー・ジェイ・ブラバゾン
バディー・エル−カレー
ステュアート・アール・マーティン
マシュー・ジェレミー・ラッタン
カーター・ウェリング・カアンタ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH09181258A publication Critical patent/JPH09181258A/ja
Application granted granted Critical
Publication of JP3396137B2 publication Critical patent/JP3396137B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
JP27453096A 1995-10-27 1996-10-17 コンデンサおよびその作製方法 Expired - Fee Related JP3396137B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/549450 1995-10-27
US08/549,450 US5708559A (en) 1995-10-27 1995-10-27 Precision analog metal-metal capacitor

Publications (2)

Publication Number Publication Date
JPH09181258A JPH09181258A (ja) 1997-07-11
JP3396137B2 true JP3396137B2 (ja) 2003-04-14

Family

ID=24193081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27453096A Expired - Fee Related JP3396137B2 (ja) 1995-10-27 1996-10-17 コンデンサおよびその作製方法

Country Status (3)

Country Link
US (2) US5708559A (fr)
EP (1) EP0771022A3 (fr)
JP (1) JP3396137B2 (fr)

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JP2004266005A (ja) * 2003-02-28 2004-09-24 Renesas Technology Corp 半導体装置の製造方法
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Also Published As

Publication number Publication date
EP0771022A2 (fr) 1997-05-02
US5708559A (en) 1998-01-13
JPH09181258A (ja) 1997-07-11
US6008083A (en) 1999-12-28
EP0771022A3 (fr) 1998-08-12

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