|
JP3267409B2
(ja)
*
|
1992-11-24 |
2002-03-18 |
株式会社日立製作所 |
半導体集積回路装置
|
|
JP3152834B2
(ja)
*
|
1993-06-24 |
2001-04-03 |
株式会社東芝 |
電子回路装置
|
|
JP3961092B2
(ja)
*
|
1997-06-03 |
2007-08-15 |
株式会社東芝 |
複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
|
|
EP2265101B1
(en)
*
|
1999-09-02 |
2012-08-29 |
Ibiden Co., Ltd. |
Printed circuit board and method of manufacturing printed circuit board
|
|
CN100336426C
(zh)
*
|
2000-02-25 |
2007-09-05 |
揖斐电株式会社 |
多层印刷电路板以及多层印刷电路板的制造方法
|
|
TW575632B
(en)
*
|
2000-07-13 |
2004-02-11 |
Ngk Spark Plug Co |
Paste for filling throughhole and printed wiring board using same
|
|
US20020020898A1
(en)
*
|
2000-08-16 |
2002-02-21 |
Vu Quat T. |
Microelectronic substrates with integrated devices
|
|
US6486549B1
(en)
*
|
2001-11-10 |
2002-11-26 |
Bridge Semiconductor Corporation |
Semiconductor module with encapsulant base
|
|
JP3666591B2
(ja)
*
|
2002-02-01 |
2005-06-29 |
株式会社トッパンＮｅｃサーキットソリューションズ |
半導体チップ搭載用基板の製造方法
|
|
TWI229433B
(en)
*
|
2004-07-02 |
2005-03-11 |
Phoenix Prec Technology Corp |
Direct connection multi-chip semiconductor element structure
|
|
KR100626380B1
(ko)
*
|
2004-07-14 |
2006-09-20 |
삼성전자주식회사 |
반도체 패키지
|
|
JP4534062B2
(ja)
*
|
2005-04-19 |
2010-09-01 |
ルネサスエレクトロニクス株式会社 |
半導体装置
|
|
US7696442B2
(en)
*
|
2005-06-03 |
2010-04-13 |
Ngk Spark Plug Co., Ltd. |
Wiring board and manufacturing method of wiring board
|
|
TWI263313B
(en)
*
|
2005-08-15 |
2006-10-01 |
Phoenix Prec Technology Corp |
Stack structure of semiconductor component embedded in supporting board
|
|
KR100726240B1
(ko)
*
|
2005-10-04 |
2007-06-11 |
삼성전기주식회사 |
전자소자 내장 인쇄회로기판 및 그 제조방법
|
|
TWI276192B
(en)
*
|
2005-10-18 |
2007-03-11 |
Phoenix Prec Technology Corp |
Stack structure of semiconductor component embedded in supporting board and method for fabricating the same
|
|
EP1962569A1
(en)
*
|
2005-12-16 |
2008-08-27 |
Ibiden Co., Ltd. |
Multilayer printed wiring plate, and method for fabricating the same
|
|
JP4824397B2
(ja)
*
|
2005-12-27 |
2011-11-30 |
イビデン株式会社 |
多層プリント配線板
|
|
TWI334747B
(en)
*
|
2006-12-22 |
2010-12-11 |
Unimicron Technology Corp |
Circuit board structure having embedded electronic components
|
|
US20080157316A1
(en)
*
|
2007-01-03 |
2008-07-03 |
Advanced Chip Engineering Technology Inc. |
Multi-chips package and method of forming the same
|
|
US20080197469A1
(en)
*
|
2007-02-21 |
2008-08-21 |
Advanced Chip Engineering Technology Inc. |
Multi-chips package with reduced structure and method for forming the same
|
|
JP5395360B2
(ja)
*
|
2008-02-25 |
2014-01-22 |
新光電気工業株式会社 |
電子部品内蔵基板の製造方法
|
|
JP5005603B2
(ja)
*
|
2008-04-03 |
2012-08-22 |
新光電気工業株式会社 |
半導体装置及びその製造方法
|
|
TWI363411B
(en)
*
|
2008-07-22 |
2012-05-01 |
Advanced Semiconductor Eng |
Embedded chip substrate and fabrication method thereof
|
|
JP5187148B2
(ja)
*
|
2008-11-12 |
2013-04-24 |
富士通株式会社 |
半導体装置及びその製造方法
|
|
US8227904B2
(en)
*
|
2009-06-24 |
2012-07-24 |
Intel Corporation |
Multi-chip package and method of providing die-to-die interconnects in same
|
|
JP5826532B2
(ja)
*
|
2010-07-15 |
2015-12-02 |
新光電気工業株式会社 |
半導体装置及びその製造方法
|
|
KR101775150B1
(ko)
*
|
2010-07-30 |
2017-09-05 |
삼성전자주식회사 |
다층 라미네이트 패키지 및 그 제조방법
|
|
US8901435B2
(en)
*
|
2012-08-14 |
2014-12-02 |
Bridge Semiconductor Corporation |
Hybrid wiring board with built-in stopper, interposer and build-up circuitry
|
|
US8927417B2
(en)
*
|
2012-12-18 |
2015-01-06 |
Freescale Semiconductor, Inc. |
Semiconductor package signal routing using conductive vias
|
|
KR20150065029A
(ko)
*
|
2013-12-04 |
2015-06-12 |
삼성전기주식회사 |
인쇄회로기판, 그 제조방법 및 반도체 패키지
|
|
US10056267B2
(en)
*
|
2014-02-14 |
2018-08-21 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Substrate design for semiconductor packages and method of forming same
|
|
US9527723B2
(en)
*
|
2014-03-13 |
2016-12-27 |
STATS ChipPAC Pte. Ltd. |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package
|
|
KR102163039B1
(ko)
*
|
2015-04-07 |
2020-10-08 |
삼성전기주식회사 |
인쇄회로기판, 그 제조방법, 및 전자부품 모듈
|
|
JP2016207952A
(ja)
*
|
2015-04-28 |
2016-12-08 |
富士通株式会社 |
部品内蔵基板
|
|
KR101666757B1
(ko)
*
|
2015-07-13 |
2016-10-24 |
앰코 테크놀로지 코리아 주식회사 |
반도체 패키지
|
|
US9686866B2
(en)
*
|
2015-08-23 |
2017-06-20 |
Unimicron Technology Corp. |
Package structure and manufacturing method thereof
|
|
KR101933408B1
(ko)
*
|
2015-11-10 |
2018-12-28 |
삼성전기 주식회사 |
전자부품 패키지 및 이를 포함하는 전자기기
|
|
JP6669513B2
(ja)
*
|
2016-02-03 |
2020-03-18 |
富士ゼロックス株式会社 |
回路基板および回路基板の製造方法
|
|
KR101952864B1
(ko)
*
|
2016-09-30 |
2019-02-27 |
삼성전기주식회사 |
팬-아웃 반도체 패키지
|
|
WO2018063316A1
(en)
*
|
2016-09-30 |
2018-04-05 |
Robert Alan May |
Device and method of very high density routing used with embedded multi-die interconnect bridge
|
|
TWI620356B
(zh)
*
|
2016-10-07 |
2018-04-01 |
欣興電子股份有限公司 |
封裝結構及其製作方法
|
|
EP3355349B1
(en)
*
|
2017-01-26 |
2022-05-11 |
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft |
Efficient heat removal from component carrier with embedded diode
|
|
KR20180098009A
(ko)
*
|
2017-02-24 |
2018-09-03 |
삼성전자주식회사 |
인쇄회로기판 및 이를 가지는 반도체 패키지
|
|
MY202342A
(en)
*
|
2017-06-08 |
2024-04-24 |
Intel Corp |
Over-molded ic package with in-mold capacitor
|
|
JP2019016683A
(ja)
*
|
2017-07-06 |
2019-01-31 |
新光電気工業株式会社 |
配線基板及びその製造方法、半導体パッケージ
|
|
WO2019146252A1
(ja)
*
|
2018-01-23 |
2019-08-01 |
株式会社村田製作所 |
基板接合構造、および基板の接合方法
|
|
US10999939B2
(en)
*
|
2018-06-08 |
2021-05-04 |
Unimicron Technology Corp. |
Circuit carrier board and manufacturing method thereof
|
|
US10888001B2
(en)
*
|
2018-06-08 |
2021-01-05 |
Unimicron Technology Corp. |
Circuit carrier board structure and manufacturing method thereof
|
|
KR102059815B1
(ko)
*
|
2018-07-09 |
2019-12-27 |
삼성전기주식회사 |
안테나 기판 및 이를 포함하는 안테나 모듈
|
|
US11018082B2
(en)
*
|
2018-07-30 |
2021-05-25 |
Dyi-chung Hu |
Space transformer and manufacturing method thereof
|
|
US11462463B2
(en)
*
|
2018-09-27 |
2022-10-04 |
Intel Corporation |
Microelectronic assemblies having an integrated voltage regulator chiplet
|
|
KR102524812B1
(ko)
*
|
2018-11-06 |
2023-04-24 |
삼성전자주식회사 |
반도체 패키지
|
|
KR20200086157A
(ko)
*
|
2019-01-08 |
2020-07-16 |
삼성전자주식회사 |
반도체 패키지
|
|
US11164814B2
(en)
*
|
2019-03-14 |
2021-11-02 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Package structure and method of manufacturing the same
|
|
WO2020248174A1
(zh)
*
|
2019-06-12 |
2020-12-17 |
宏启胜精密电子(秦皇岛)有限公司 |
封装结构及其制造方法
|
|
US11367628B2
(en)
*
|
2019-07-16 |
2022-06-21 |
Advanced Micro Devices, Inc. |
Molded chip package with anchor structures
|
|
KR102789025B1
(ko)
*
|
2019-12-16 |
2025-04-01 |
삼성전기주식회사 |
전자부품 내장기판
|
|
KR102776266B1
(ko)
*
|
2019-12-16 |
2025-03-07 |
삼성전기주식회사 |
전자부품 내장기판
|
|
KR102764370B1
(ko)
*
|
2019-12-26 |
2025-02-07 |
삼성전자주식회사 |
반도체 패키지
|
|
JP7421357B2
(ja)
*
|
2020-02-05 |
2024-01-24 |
新光電気工業株式会社 |
部品内蔵基板及び部品内蔵基板の製造方法
|
|
KR102854182B1
(ko)
*
|
2020-07-06 |
2025-09-03 |
삼성전기주식회사 |
전자부품 내장기판
|
|
US20250063668A1
(en)
*
|
2021-04-02 |
2025-02-20 |
At&S Austria Technologie & Systemtechnik Aktiengesellschaft |
Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers
|
|
US11735575B2
(en)
*
|
2021-05-27 |
2023-08-22 |
International Business Machines Corporation |
Bonding of bridge to multiple semiconductor chips
|
|
KR102933074B1
(ko)
*
|
2021-07-30 |
2026-03-05 |
엘지이노텍 주식회사 |
회로기판
|
|
KR20230031614A
(ko)
*
|
2021-08-27 |
2023-03-07 |
삼성전자주식회사 |
반도체 패키지
|
|
KR20230082278A
(ko)
*
|
2021-12-01 |
2023-06-08 |
삼성전기주식회사 |
인쇄회로기판 및 그 제조방법
|
|
KR20230145844A
(ko)
*
|
2022-04-11 |
2023-10-18 |
엘지이노텍 주식회사 |
회로기판 및 이를 포함하는 반도체 패키지
|
|
KR20230161818A
(ko)
*
|
2022-05-19 |
2023-11-28 |
삼성전자주식회사 |
반도체 패키지, 및 이를 가지는 패키지 온 패키지
|
|
KR20230163605A
(ko)
*
|
2022-05-23 |
2023-12-01 |
엘지이노텍 주식회사 |
회로기판 및 이를 포함하는 반도체 패키지
|
|
KR20240010631A
(ko)
*
|
2022-07-14 |
2024-01-24 |
삼성전자주식회사 |
반도체 패키지
|
|
KR20240020092A
(ko)
*
|
2022-08-05 |
2024-02-14 |
삼성전자주식회사 |
반도체 패키지
|
|
US20250118648A1
(en)
*
|
2023-10-05 |
2025-04-10 |
Qorvo Us, Inc. |
Multilevel system-in-package module with embedded die and redistribution bottom features
|