CN120264626A - 电路板和具有该电路板的半导体封装 - Google Patents

电路板和具有该电路板的半导体封装 Download PDF

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Publication number
CN120264626A
CN120264626A CN202411381770.5A CN202411381770A CN120264626A CN 120264626 A CN120264626 A CN 120264626A CN 202411381770 A CN202411381770 A CN 202411381770A CN 120264626 A CN120264626 A CN 120264626A
Authority
CN
China
Prior art keywords
protective layer
circuit board
insulating
semiconductor device
vertical direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202411381770.5A
Other languages
English (en)
Chinese (zh)
Inventor
李洙敃
具大煐
金志勳
文大成
禹炳旭
刘昌佑
李尙炫
李周炫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN120264626A publication Critical patent/CN120264626A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN202411381770.5A 2024-01-02 2024-09-30 电路板和具有该电路板的半导体封装 Pending CN120264626A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020240000322A KR102737071B1 (ko) 2024-01-02 2024-01-02 회로기판 및 이를 포함하는 반도체 패키지 기판
KR10-2024-0000322 2024-01-02

Publications (1)

Publication Number Publication Date
CN120264626A true CN120264626A (zh) 2025-07-04

Family

ID=90482227

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202411381770.5A Pending CN120264626A (zh) 2024-01-02 2024-09-30 电路板和具有该电路板的半导体封装

Country Status (6)

Country Link
US (1) US20250218913A1 (https=)
EP (1) EP4583643A1 (https=)
JP (1) JP2025106147A (https=)
KR (1) KR102737071B1 (https=)
CN (1) CN120264626A (https=)
TW (1) TW202529496A (https=)

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3267409B2 (ja) * 1992-11-24 2002-03-18 株式会社日立製作所 半導体集積回路装置
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JP3961092B2 (ja) * 1997-06-03 2007-08-15 株式会社東芝 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
EP2265101B1 (en) * 1999-09-02 2012-08-29 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
CN100336426C (zh) * 2000-02-25 2007-09-05 揖斐电株式会社 多层印刷电路板以及多层印刷电路板的制造方法
TW575632B (en) * 2000-07-13 2004-02-11 Ngk Spark Plug Co Paste for filling throughhole and printed wiring board using same
US20020020898A1 (en) * 2000-08-16 2002-02-21 Vu Quat T. Microelectronic substrates with integrated devices
US6486549B1 (en) * 2001-11-10 2002-11-26 Bridge Semiconductor Corporation Semiconductor module with encapsulant base
JP3666591B2 (ja) * 2002-02-01 2005-06-29 株式会社トッパンＮｅｃサーキットソリューションズ 半導体チップ搭載用基板の製造方法
TWI229433B (en) * 2004-07-02 2005-03-11 Phoenix Prec Technology Corp Direct connection multi-chip semiconductor element structure
KR100626380B1 (ko) * 2004-07-14 2006-09-20 삼성전자주식회사 반도체 패키지
JP4534062B2 (ja) * 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
US7696442B2 (en) * 2005-06-03 2010-04-13 Ngk Spark Plug Co., Ltd. Wiring board and manufacturing method of wiring board
TWI263313B (en) * 2005-08-15 2006-10-01 Phoenix Prec Technology Corp Stack structure of semiconductor component embedded in supporting board
KR100726240B1 (ko) * 2005-10-04 2007-06-11 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
TWI276192B (en) * 2005-10-18 2007-03-11 Phoenix Prec Technology Corp Stack structure of semiconductor component embedded in supporting board and method for fabricating the same
EP1962569A1 (en) * 2005-12-16 2008-08-27 Ibiden Co., Ltd. Multilayer printed wiring plate, and method for fabricating the same
JP4824397B2 (ja) * 2005-12-27 2011-11-30 イビデン株式会社 多層プリント配線板
TWI334747B (en) * 2006-12-22 2010-12-11 Unimicron Technology Corp Circuit board structure having embedded electronic components
US20080157316A1 (en) * 2007-01-03 2008-07-03 Advanced Chip Engineering Technology Inc. Multi-chips package and method of forming the same
US20080197469A1 (en) * 2007-02-21 2008-08-21 Advanced Chip Engineering Technology Inc. Multi-chips package with reduced structure and method for forming the same
JP5395360B2 (ja) * 2008-02-25 2014-01-22 新光電気工業株式会社 電子部品内蔵基板の製造方法
JP5005603B2 (ja) * 2008-04-03 2012-08-22 新光電気工業株式会社 半導体装置及びその製造方法
TWI363411B (en) * 2008-07-22 2012-05-01 Advanced Semiconductor Eng Embedded chip substrate and fabrication method thereof
JP5187148B2 (ja) * 2008-11-12 2013-04-24 富士通株式会社 半導体装置及びその製造方法
US8227904B2 (en) * 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
JP5826532B2 (ja) * 2010-07-15 2015-12-02 新光電気工業株式会社 半導体装置及びその製造方法
KR101775150B1 (ko) * 2010-07-30 2017-09-05 삼성전자주식회사 다층 라미네이트 패키지 및 그 제조방법
US8901435B2 (en) * 2012-08-14 2014-12-02 Bridge Semiconductor Corporation Hybrid wiring board with built-in stopper, interposer and build-up circuitry
US8927417B2 (en) * 2012-12-18 2015-01-06 Freescale Semiconductor, Inc. Semiconductor package signal routing using conductive vias
KR20150065029A (ko) * 2013-12-04 2015-06-12 삼성전기주식회사 인쇄회로기판, 그 제조방법 및 반도체 패키지
US10056267B2 (en) * 2014-02-14 2018-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
US9527723B2 (en) * 2014-03-13 2016-12-27 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming microelectromechanical systems (MEMS) package
KR102163039B1 (ko) * 2015-04-07 2020-10-08 삼성전기주식회사 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
JP2016207952A (ja) * 2015-04-28 2016-12-08 富士通株式会社 部品内蔵基板
KR101666757B1 (ko) * 2015-07-13 2016-10-24 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9686866B2 (en) * 2015-08-23 2017-06-20 Unimicron Technology Corp. Package structure and manufacturing method thereof
KR101933408B1 (ko) * 2015-11-10 2018-12-28 삼성전기 주식회사 전자부품 패키지 및 이를 포함하는 전자기기
JP6669513B2 (ja) * 2016-02-03 2020-03-18 富士ゼロックス株式会社 回路基板および回路基板の製造方法
KR101952864B1 (ko) * 2016-09-30 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지
WO2018063316A1 (en) * 2016-09-30 2018-04-05 Robert Alan May Device and method of very high density routing used with embedded multi-die interconnect bridge
TWI620356B (zh) * 2016-10-07 2018-04-01 欣興電子股份有限公司 封裝結構及其製作方法
EP3355349B1 (en) * 2017-01-26 2022-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Efficient heat removal from component carrier with embedded diode
KR20180098009A (ko) * 2017-02-24 2018-09-03 삼성전자주식회사 인쇄회로기판 및 이를 가지는 반도체 패키지
MY202342A (en) * 2017-06-08 2024-04-24 Intel Corp Over-molded ic package with in-mold capacitor
JP2019016683A (ja) * 2017-07-06 2019-01-31 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
WO2019146252A1 (ja) * 2018-01-23 2019-08-01 株式会社村田製作所 基板接合構造、および基板の接合方法
US10999939B2 (en) * 2018-06-08 2021-05-04 Unimicron Technology Corp. Circuit carrier board and manufacturing method thereof
US10888001B2 (en) * 2018-06-08 2021-01-05 Unimicron Technology Corp. Circuit carrier board structure and manufacturing method thereof
KR102059815B1 (ko) * 2018-07-09 2019-12-27 삼성전기주식회사 안테나 기판 및 이를 포함하는 안테나 모듈
US11018082B2 (en) * 2018-07-30 2021-05-25 Dyi-chung Hu Space transformer and manufacturing method thereof
US11462463B2 (en) * 2018-09-27 2022-10-04 Intel Corporation Microelectronic assemblies having an integrated voltage regulator chiplet
KR102524812B1 (ko) * 2018-11-06 2023-04-24 삼성전자주식회사 반도체 패키지
KR20200086157A (ko) * 2019-01-08 2020-07-16 삼성전자주식회사 반도체 패키지
US11164814B2 (en) * 2019-03-14 2021-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
WO2020248174A1 (zh) * 2019-06-12 2020-12-17 宏启胜精密电子(秦皇岛)有限公司 封装结构及其制造方法
US11367628B2 (en) * 2019-07-16 2022-06-21 Advanced Micro Devices, Inc. Molded chip package with anchor structures
KR102789025B1 (ko) * 2019-12-16 2025-04-01 삼성전기주식회사 전자부품 내장기판
KR102776266B1 (ko) * 2019-12-16 2025-03-07 삼성전기주식회사 전자부품 내장기판
KR102764370B1 (ko) * 2019-12-26 2025-02-07 삼성전자주식회사 반도체 패키지
JP7421357B2 (ja) * 2020-02-05 2024-01-24 新光電気工業株式会社 部品内蔵基板及び部品内蔵基板の製造方法
KR102854182B1 (ko) * 2020-07-06 2025-09-03 삼성전기주식회사 전자부품 내장기판
US20250063668A1 (en) * 2021-04-02 2025-02-20 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers
US11735575B2 (en) * 2021-05-27 2023-08-22 International Business Machines Corporation Bonding of bridge to multiple semiconductor chips
KR102933074B1 (ko) * 2021-07-30 2026-03-05 엘지이노텍 주식회사 회로기판
KR20230031614A (ko) * 2021-08-27 2023-03-07 삼성전자주식회사 반도체 패키지
KR20230082278A (ko) * 2021-12-01 2023-06-08 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20230145844A (ko) * 2022-04-11 2023-10-18 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지
KR20230161818A (ko) * 2022-05-19 2023-11-28 삼성전자주식회사 반도체 패키지, 및 이를 가지는 패키지 온 패키지
KR20230163605A (ko) * 2022-05-23 2023-12-01 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지
KR20240010631A (ko) * 2022-07-14 2024-01-24 삼성전자주식회사 반도체 패키지
KR20240020092A (ko) * 2022-08-05 2024-02-14 삼성전자주식회사 반도체 패키지
US20250118648A1 (en) * 2023-10-05 2025-04-10 Qorvo Us, Inc. Multilevel system-in-package module with embedded die and redistribution bottom features

Also Published As

Publication number Publication date
JP2025106147A (ja) 2025-07-14
TW202529496A (zh) 2025-07-16
EP4583643A1 (en) 2025-07-09
KR102737071B1 (ko) 2024-12-03
US20250218913A1 (en) 2025-07-03

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