JP2025106147A - 回路基板及びこれを含む半導体パッケージ - Google Patents

回路基板及びこれを含む半導体パッケージ Download PDF

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Publication number
JP2025106147A
JP2025106147A JP2024062029A JP2024062029A JP2025106147A JP 2025106147 A JP2025106147 A JP 2025106147A JP 2024062029 A JP2024062029 A JP 2024062029A JP 2024062029 A JP2024062029 A JP 2024062029A JP 2025106147 A JP2025106147 A JP 2025106147A
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JP
Japan
Prior art keywords
protective layer
insulating
circuit board
layer
build
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024062029A
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English (en)
Japanese (ja)
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JP2025106147A5 (https=
Inventor
イ，スミン
Su Min Lee
ク，デヨン
Dae Young Ku
キム，ジフン
Ji Hoon Kim
ムン，デスン
Dae Sung Moon
ウ，ビュンウク
Byung Wook Woo
ユ，チャンウ
Chang Woo Yoo
イ，サンヒュン
San-Hyun Yi
イ，ジュヒュン
Ju Hyun Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
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Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2025106147A publication Critical patent/JP2025106147A/ja
Publication of JP2025106147A5 publication Critical patent/JP2025106147A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2024062029A 2024-01-02 2024-04-08 回路基板及びこれを含む半導体パッケージ Pending JP2025106147A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020240000322A KR102737071B1 (ko) 2024-01-02 2024-01-02 회로기판 및 이를 포함하는 반도체 패키지 기판
KR10-2024-0000322 2024-01-02

Publications (2)

Publication Number Publication Date
JP2025106147A true JP2025106147A (ja) 2025-07-14
JP2025106147A5 JP2025106147A5 (https=) 2025-10-06

Family

ID=90482227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024062029A Pending JP2025106147A (ja) 2024-01-02 2024-04-08 回路基板及びこれを含む半導体パッケージ

Country Status (6)

Country Link
US (1) US20250218913A1 (https=)
EP (1) EP4583643A1 (https=)
JP (1) JP2025106147A (https=)
KR (1) KR102737071B1 (https=)
CN (1) CN120264626A (https=)
TW (1) TW202529496A (https=)

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3267409B2 (ja) * 1992-11-24 2002-03-18 株式会社日立製作所 半導体集積回路装置
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
JP3961092B2 (ja) * 1997-06-03 2007-08-15 株式会社東芝 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
EP2265101B1 (en) * 1999-09-02 2012-08-29 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
CN100336426C (zh) * 2000-02-25 2007-09-05 揖斐电株式会社 多层印刷电路板以及多层印刷电路板的制造方法
TW575632B (en) * 2000-07-13 2004-02-11 Ngk Spark Plug Co Paste for filling throughhole and printed wiring board using same
US20020020898A1 (en) * 2000-08-16 2002-02-21 Vu Quat T. Microelectronic substrates with integrated devices
US6486549B1 (en) * 2001-11-10 2002-11-26 Bridge Semiconductor Corporation Semiconductor module with encapsulant base
JP3666591B2 (ja) * 2002-02-01 2005-06-29 株式会社トッパンＮｅｃサーキットソリューションズ 半導体チップ搭載用基板の製造方法
TWI229433B (en) * 2004-07-02 2005-03-11 Phoenix Prec Technology Corp Direct connection multi-chip semiconductor element structure
KR100626380B1 (ko) * 2004-07-14 2006-09-20 삼성전자주식회사 반도체 패키지
JP4534062B2 (ja) * 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
US7696442B2 (en) * 2005-06-03 2010-04-13 Ngk Spark Plug Co., Ltd. Wiring board and manufacturing method of wiring board
TWI263313B (en) * 2005-08-15 2006-10-01 Phoenix Prec Technology Corp Stack structure of semiconductor component embedded in supporting board
KR100726240B1 (ko) * 2005-10-04 2007-06-11 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
TWI276192B (en) * 2005-10-18 2007-03-11 Phoenix Prec Technology Corp Stack structure of semiconductor component embedded in supporting board and method for fabricating the same
EP1962569A1 (en) * 2005-12-16 2008-08-27 Ibiden Co., Ltd. Multilayer printed wiring plate, and method for fabricating the same
JP4824397B2 (ja) * 2005-12-27 2011-11-30 イビデン株式会社 多層プリント配線板
TWI334747B (en) * 2006-12-22 2010-12-11 Unimicron Technology Corp Circuit board structure having embedded electronic components
US20080157316A1 (en) * 2007-01-03 2008-07-03 Advanced Chip Engineering Technology Inc. Multi-chips package and method of forming the same
US20080197469A1 (en) * 2007-02-21 2008-08-21 Advanced Chip Engineering Technology Inc. Multi-chips package with reduced structure and method for forming the same
JP5395360B2 (ja) * 2008-02-25 2014-01-22 新光電気工業株式会社 電子部品内蔵基板の製造方法
JP5005603B2 (ja) * 2008-04-03 2012-08-22 新光電気工業株式会社 半導体装置及びその製造方法
TWI363411B (en) * 2008-07-22 2012-05-01 Advanced Semiconductor Eng Embedded chip substrate and fabrication method thereof
JP5187148B2 (ja) * 2008-11-12 2013-04-24 富士通株式会社 半導体装置及びその製造方法
US8227904B2 (en) * 2009-06-24 2012-07-24 Intel Corporation Multi-chip package and method of providing die-to-die interconnects in same
JP5826532B2 (ja) * 2010-07-15 2015-12-02 新光電気工業株式会社 半導体装置及びその製造方法
KR101775150B1 (ko) * 2010-07-30 2017-09-05 삼성전자주식회사 다층 라미네이트 패키지 및 그 제조방법
US8901435B2 (en) * 2012-08-14 2014-12-02 Bridge Semiconductor Corporation Hybrid wiring board with built-in stopper, interposer and build-up circuitry
US8927417B2 (en) * 2012-12-18 2015-01-06 Freescale Semiconductor, Inc. Semiconductor package signal routing using conductive vias
KR20150065029A (ko) * 2013-12-04 2015-06-12 삼성전기주식회사 인쇄회로기판, 그 제조방법 및 반도체 패키지
US10056267B2 (en) * 2014-02-14 2018-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design for semiconductor packages and method of forming same
US9527723B2 (en) * 2014-03-13 2016-12-27 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming microelectromechanical systems (MEMS) package
KR102163039B1 (ko) * 2015-04-07 2020-10-08 삼성전기주식회사 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
JP2016207952A (ja) * 2015-04-28 2016-12-08 富士通株式会社 部品内蔵基板
KR101666757B1 (ko) * 2015-07-13 2016-10-24 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9686866B2 (en) * 2015-08-23 2017-06-20 Unimicron Technology Corp. Package structure and manufacturing method thereof
KR101933408B1 (ko) * 2015-11-10 2018-12-28 삼성전기 주식회사 전자부품 패키지 및 이를 포함하는 전자기기
JP6669513B2 (ja) * 2016-02-03 2020-03-18 富士ゼロックス株式会社 回路基板および回路基板の製造方法
KR101952864B1 (ko) * 2016-09-30 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지
WO2018063316A1 (en) * 2016-09-30 2018-04-05 Robert Alan May Device and method of very high density routing used with embedded multi-die interconnect bridge
TWI620356B (zh) * 2016-10-07 2018-04-01 欣興電子股份有限公司 封裝結構及其製作方法
EP3355349B1 (en) * 2017-01-26 2022-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Efficient heat removal from component carrier with embedded diode
KR20180098009A (ko) * 2017-02-24 2018-09-03 삼성전자주식회사 인쇄회로기판 및 이를 가지는 반도체 패키지
MY202342A (en) * 2017-06-08 2024-04-24 Intel Corp Over-molded ic package with in-mold capacitor
JP2019016683A (ja) * 2017-07-06 2019-01-31 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
WO2019146252A1 (ja) * 2018-01-23 2019-08-01 株式会社村田製作所 基板接合構造、および基板の接合方法
US10999939B2 (en) * 2018-06-08 2021-05-04 Unimicron Technology Corp. Circuit carrier board and manufacturing method thereof
US10888001B2 (en) * 2018-06-08 2021-01-05 Unimicron Technology Corp. Circuit carrier board structure and manufacturing method thereof
KR102059815B1 (ko) * 2018-07-09 2019-12-27 삼성전기주식회사 안테나 기판 및 이를 포함하는 안테나 모듈
US11018082B2 (en) * 2018-07-30 2021-05-25 Dyi-chung Hu Space transformer and manufacturing method thereof
US11462463B2 (en) * 2018-09-27 2022-10-04 Intel Corporation Microelectronic assemblies having an integrated voltage regulator chiplet
KR102524812B1 (ko) * 2018-11-06 2023-04-24 삼성전자주식회사 반도체 패키지
KR20200086157A (ko) * 2019-01-08 2020-07-16 삼성전자주식회사 반도체 패키지
US11164814B2 (en) * 2019-03-14 2021-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
WO2020248174A1 (zh) * 2019-06-12 2020-12-17 宏启胜精密电子(秦皇岛)有限公司 封装结构及其制造方法
US11367628B2 (en) * 2019-07-16 2022-06-21 Advanced Micro Devices, Inc. Molded chip package with anchor structures
KR102789025B1 (ko) * 2019-12-16 2025-04-01 삼성전기주식회사 전자부품 내장기판
KR102776266B1 (ko) * 2019-12-16 2025-03-07 삼성전기주식회사 전자부품 내장기판
KR102764370B1 (ko) * 2019-12-26 2025-02-07 삼성전자주식회사 반도체 패키지
JP7421357B2 (ja) * 2020-02-05 2024-01-24 新光電気工業株式会社 部品内蔵基板及び部品内蔵基板の製造方法
KR102854182B1 (ko) * 2020-07-06 2025-09-03 삼성전기주식회사 전자부품 내장기판
US20250063668A1 (en) * 2021-04-02 2025-02-20 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers
US11735575B2 (en) * 2021-05-27 2023-08-22 International Business Machines Corporation Bonding of bridge to multiple semiconductor chips
KR102933074B1 (ko) * 2021-07-30 2026-03-05 엘지이노텍 주식회사 회로기판
KR20230031614A (ko) * 2021-08-27 2023-03-07 삼성전자주식회사 반도체 패키지
KR20230082278A (ko) * 2021-12-01 2023-06-08 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20230145844A (ko) * 2022-04-11 2023-10-18 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지
KR20230161818A (ko) * 2022-05-19 2023-11-28 삼성전자주식회사 반도체 패키지, 및 이를 가지는 패키지 온 패키지
KR20230163605A (ko) * 2022-05-23 2023-12-01 엘지이노텍 주식회사 회로기판 및 이를 포함하는 반도체 패키지
KR20240010631A (ko) * 2022-07-14 2024-01-24 삼성전자주식회사 반도체 패키지
KR20240020092A (ko) * 2022-08-05 2024-02-14 삼성전자주식회사 반도체 패키지
US20250118648A1 (en) * 2023-10-05 2025-04-10 Qorvo Us, Inc. Multilevel system-in-package module with embedded die and redistribution bottom features

Also Published As

Publication number Publication date
CN120264626A (zh) 2025-07-04
TW202529496A (zh) 2025-07-16
EP4583643A1 (en) 2025-07-09
KR102737071B1 (ko) 2024-12-03
US20250218913A1 (en) 2025-07-03

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