JP2019530201A5 - - Google Patents

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JP2019530201A5
JP2019530201A5 JP2018564747A JP2018564747A JP2019530201A5 JP 2019530201 A5 JP2019530201 A5 JP 2019530201A5 JP 2018564747 A JP2018564747 A JP 2018564747A JP 2018564747 A JP2018564747 A JP 2018564747A JP 2019530201 A5 JP2019530201 A5 JP 2019530201A5
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Japan
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transfer
support
microdevices
transfer body
adhesive layer
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JP2018564747A
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Japanese (ja)
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JP2019530201A (ja
JP6976972B2 (ja
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Priority claimed from PCT/US2017/036804 external-priority patent/WO2017214540A1/en
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JP2018564747A 2016-06-10 2017-06-09 マイクロデバイスのマスクレス並列ピックアンドプレース移載 Active JP6976972B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662348691P 2016-06-10 2016-06-10
US62/348,691 2016-06-10
PCT/US2017/036804 WO2017214540A1 (en) 2016-06-10 2017-06-09 Maskless parallel pick-and-place transfer of micro-devices

Publications (3)

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JP2019530201A JP2019530201A (ja) 2019-10-17
JP2019530201A5 true JP2019530201A5 (enExample) 2020-07-16
JP6976972B2 JP6976972B2 (ja) 2021-12-08

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JP2018564747A Active JP6976972B2 (ja) 2016-06-10 2017-06-09 マイクロデバイスのマスクレス並列ピックアンドプレース移載

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US (5) US10217793B2 (enExample)
EP (1) EP3469424A4 (enExample)
JP (1) JP6976972B2 (enExample)
KR (1) KR102427231B1 (enExample)
CN (2) CN116047871A (enExample)
TW (2) TWI723178B (enExample)
WO (1) WO2017214540A1 (enExample)

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