JP2019512397A5 - - Google Patents

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Publication number
JP2019512397A5
JP2019512397A5 JP2018548223A JP2018548223A JP2019512397A5 JP 2019512397 A5 JP2019512397 A5 JP 2019512397A5 JP 2018548223 A JP2018548223 A JP 2018548223A JP 2018548223 A JP2018548223 A JP 2018548223A JP 2019512397 A5 JP2019512397 A5 JP 2019512397A5
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JP
Japan
Prior art keywords
workpiece
shape
features
laser energy
energy beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018548223A
Other languages
English (en)
Japanese (ja)
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JP2019512397A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2017/022987 external-priority patent/WO2017161284A1/en
Publication of JP2019512397A publication Critical patent/JP2019512397A/ja
Publication of JP2019512397A5 publication Critical patent/JP2019512397A5/ja
Pending legal-status Critical Current

Links

JP2018548223A 2016-03-17 2017-03-17 レーザ加工システムにおける像平面の配置 Pending JP2019512397A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662309759P 2016-03-17 2016-03-17
US62/309,759 2016-03-17
PCT/US2017/022987 WO2017161284A1 (en) 2016-03-17 2017-03-17 Location of image plane in a laser processing system

Publications (2)

Publication Number Publication Date
JP2019512397A JP2019512397A (ja) 2019-05-16
JP2019512397A5 true JP2019512397A5 (enExample) 2020-04-23

Family

ID=59851425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018548223A Pending JP2019512397A (ja) 2016-03-17 2017-03-17 レーザ加工システムにおける像平面の配置

Country Status (6)

Country Link
US (1) US10864599B2 (enExample)
JP (1) JP2019512397A (enExample)
KR (1) KR20180118143A (enExample)
CN (1) CN108700661A (enExample)
TW (1) TW201733728A (enExample)
WO (1) WO2017161284A1 (enExample)

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Publication number Priority date Publication date Assignee Title
CN112091421B (zh) * 2015-09-09 2022-12-23 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
US11192389B2 (en) * 2016-12-02 2021-12-07 Alltec Angewandte Laserlicht Technologie Gmbh System and method for laser marking substrates
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
DE102018119313B4 (de) * 2018-08-08 2023-03-30 Rogers Germany Gmbh Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Anlage zum Durchführen des Verfahrens
TWI892641B (zh) * 2019-01-31 2025-08-01 美商伊雷克托科學工業股份有限公司 光學系統
JP7386073B2 (ja) * 2019-12-24 2023-11-24 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2021205030A1 (fr) * 2020-04-10 2021-10-14 Rolex Sa Système de tournage laser, procédé de tournage laser utilisant une tel système, et composant obtenu par un tel procédé
CN113751880A (zh) * 2020-06-05 2021-12-07 Nps株式会社 蚀刻装置
US12097558B2 (en) 2021-04-27 2024-09-24 General Electric Company Systems and methods for laser processing system characterization and calibration
WO2023228548A1 (ja) * 2022-05-24 2023-11-30 ソニーグループ株式会社 ビーム整形装置、および加工装置
TWI867380B (zh) * 2022-12-02 2024-12-21 新代科技股份有限公司 雷射加工機台控制系統及其控制方法

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AU4660293A (en) 1992-12-23 1994-07-19 Bausch & Lomb Incorporated Method of shaping laser beam
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
GB9811557D0 (en) * 1998-05-29 1998-07-29 Exitech Ltd The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages
US6720519B2 (en) * 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
US6815638B2 (en) * 2002-07-25 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of determining a minimum pulse width for a short pulse laser system
CN1795071A (zh) * 2002-09-13 2006-06-28 塔米卡有限公司 复杂物体的激光修整
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
JP2007229786A (ja) * 2006-03-02 2007-09-13 Sumitomo Heavy Ind Ltd レーザ加工装置及び焦点合わせ制御方法
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US7659989B2 (en) * 2007-06-29 2010-02-09 Coherent, Inc. Focus determination for laser-mask imaging systems
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US8198564B2 (en) * 2008-09-09 2012-06-12 Electro Scientific Industries, Inc. Adaptive optic beamshaping in laser processing systems
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US8847113B2 (en) 2010-10-22 2014-09-30 Electro Scientific Industries, Inc. Laser processing systems and methods for beam dithering and skiving
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
KR102283654B1 (ko) * 2014-11-14 2021-07-29 가부시키가이샤 니콘 조형 장치 및 조형 방법
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