CN108700661A - 在镭射加工系统中的像平面的定位 - Google Patents
在镭射加工系统中的像平面的定位 Download PDFInfo
- Publication number
- CN108700661A CN108700661A CN201780009710.2A CN201780009710A CN108700661A CN 108700661 A CN108700661 A CN 108700661A CN 201780009710 A CN201780009710 A CN 201780009710A CN 108700661 A CN108700661 A CN 108700661A
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- radium
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- intensity distribution
- shape
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Electromagnetism (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662309759P | 2016-03-17 | 2016-03-17 | |
| US62/309,759 | 2016-03-17 | ||
| PCT/US2017/022987 WO2017161284A1 (en) | 2016-03-17 | 2017-03-17 | Location of image plane in a laser processing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108700661A true CN108700661A (zh) | 2018-10-23 |
Family
ID=59851425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780009710.2A Withdrawn CN108700661A (zh) | 2016-03-17 | 2017-03-17 | 在镭射加工系统中的像平面的定位 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10864599B2 (enExample) |
| JP (1) | JP2019512397A (enExample) |
| KR (1) | KR20180118143A (enExample) |
| CN (1) | CN108700661A (enExample) |
| TW (1) | TW201733728A (enExample) |
| WO (1) | WO2017161284A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113751880A (zh) * | 2020-06-05 | 2021-12-07 | Nps株式会社 | 蚀刻装置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11077526B2 (en) | 2015-09-09 | 2021-08-03 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of laser-processing workpieces and related arrangements |
| CN110225829B (zh) * | 2016-12-02 | 2022-05-17 | 录象射流技术公司 | 用于激光标记基底的系统和方法 |
| JP7066368B2 (ja) * | 2017-10-24 | 2022-05-13 | 住友重機械工業株式会社 | レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機 |
| DE102018119313B4 (de) * | 2018-08-08 | 2023-03-30 | Rogers Germany Gmbh | Verfahren zum Bearbeiten eines Metall-Keramik-Substrats und Anlage zum Durchführen des Verfahrens |
| TWI892641B (zh) * | 2019-01-31 | 2025-08-01 | 美商伊雷克托科學工業股份有限公司 | 光學系統 |
| JP7386073B2 (ja) * | 2019-12-24 | 2023-11-24 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| CN115379921A (zh) * | 2020-04-10 | 2022-11-22 | 劳力士有限公司 | 激光车削系统、使用该系统的激光车削方法和该方法获得的组件 |
| US12097558B2 (en) | 2021-04-27 | 2024-09-24 | General Electric Company | Systems and methods for laser processing system characterization and calibration |
| JPWO2023228548A1 (enExample) * | 2022-05-24 | 2023-11-30 | ||
| TWI867380B (zh) * | 2022-12-02 | 2024-12-21 | 新代科技股份有限公司 | 雷射加工機台控制系統及其控制方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994015238A1 (en) * | 1992-12-23 | 1994-07-07 | Bausch & Lomb Incorporated | Method of shaping laser beam |
| JP3209641B2 (ja) * | 1994-06-02 | 2001-09-17 | 三菱電機株式会社 | 光加工装置及び方法 |
| US5847960A (en) | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
| US5751585A (en) | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
| GB9811557D0 (en) * | 1998-05-29 | 1998-07-29 | Exitech Ltd | The use of beam shaping for improving the performance of machines used to laser drill microvia holes in printed circuit (wiring) and other packages |
| US6720519B2 (en) * | 2001-11-30 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | System and method of laser drilling |
| US6815638B2 (en) * | 2002-07-25 | 2004-11-09 | Matsushita Electric Industrial Co., Ltd. | Method of determining a minimum pulse width for a short pulse laser system |
| AU2003267781A1 (en) * | 2002-09-13 | 2004-04-30 | Tamicare Ltd. | Laser modification of complex objects |
| US6706999B1 (en) | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| JP2007229786A (ja) * | 2006-03-02 | 2007-09-13 | Sumitomo Heavy Ind Ltd | レーザ加工装置及び焦点合わせ制御方法 |
| US7605343B2 (en) | 2006-05-24 | 2009-10-20 | Electro Scientific Industries, Inc. | Micromachining with short-pulsed, solid-state UV laser |
| US7659989B2 (en) * | 2007-06-29 | 2010-02-09 | Coherent, Inc. | Focus determination for laser-mask imaging systems |
| US20090242526A1 (en) * | 2008-03-26 | 2009-10-01 | Electro Scientific Industries, Inc. | Laser micromachining through a protective member |
| US8198564B2 (en) | 2008-09-09 | 2012-06-12 | Electro Scientific Industries, Inc. | Adaptive optic beamshaping in laser processing systems |
| US8680430B2 (en) | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| KR101908002B1 (ko) | 2010-10-22 | 2018-12-19 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| KR102283654B1 (ko) * | 2014-11-14 | 2021-07-29 | 가부시키가이샤 니콘 | 조형 장치 및 조형 방법 |
| US10357848B2 (en) * | 2015-01-19 | 2019-07-23 | General Electric Company | Laser machining systems and methods |
| US20160370614A1 (en) * | 2015-06-16 | 2016-12-22 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of laser-processing workpieces and related arrangements |
-
2017
- 2017-03-17 US US16/067,711 patent/US10864599B2/en not_active Expired - Fee Related
- 2017-03-17 KR KR1020187025789A patent/KR20180118143A/ko not_active Ceased
- 2017-03-17 CN CN201780009710.2A patent/CN108700661A/zh not_active Withdrawn
- 2017-03-17 JP JP2018548223A patent/JP2019512397A/ja active Pending
- 2017-03-17 WO PCT/US2017/022987 patent/WO2017161284A1/en not_active Ceased
- 2017-03-17 TW TW106108939A patent/TW201733728A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113751880A (zh) * | 2020-06-05 | 2021-12-07 | Nps株式会社 | 蚀刻装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201733728A (zh) | 2017-10-01 |
| JP2019512397A (ja) | 2019-05-16 |
| US20190001434A1 (en) | 2019-01-03 |
| WO2017161284A1 (en) | 2017-09-21 |
| US10864599B2 (en) | 2020-12-15 |
| KR20180118143A (ko) | 2018-10-30 |
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Application publication date: 20181023 |