JP2019512397A - レーザ加工システムにおける像平面の配置 - Google Patents

レーザ加工システムにおける像平面の配置 Download PDF

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Publication number
JP2019512397A
JP2019512397A JP2018548223A JP2018548223A JP2019512397A JP 2019512397 A JP2019512397 A JP 2019512397A JP 2018548223 A JP2018548223 A JP 2018548223A JP 2018548223 A JP2018548223 A JP 2018548223A JP 2019512397 A JP2019512397 A JP 2019512397A
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JP
Japan
Prior art keywords
workpiece
intensity distribution
shape
spatial intensity
laser
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018548223A
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English (en)
Japanese (ja)
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JP2019512397A5 (enExample
Inventor
リウ，ユアン
フー，ホンファ
ブルックハイザー，ジム
リー，グゥアンギュー
ビリアン，ブランドン
イートン，カート
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド, エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2019512397A publication Critical patent/JP2019512397A/ja
Publication of JP2019512397A5 publication Critical patent/JP2019512397A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
JP2018548223A 2016-03-17 2017-03-17 レーザ加工システムにおける像平面の配置 Pending JP2019512397A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662309759P 2016-03-17 2016-03-17
US62/309,759 2016-03-17
PCT/US2017/022987 WO2017161284A1 (en) 2016-03-17 2017-03-17 Location of image plane in a laser processing system

Publications (2)

Publication Number Publication Date
JP2019512397A true JP2019512397A (ja) 2019-05-16
JP2019512397A5 JP2019512397A5 (enExample) 2020-04-23

Family

ID=59851425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018548223A Pending JP2019512397A (ja) 2016-03-17 2017-03-17 レーザ加工システムにおける像平面の配置

Country Status (6)

Country Link
US (1) US10864599B2 (enExample)
JP (1) JP2019512397A (enExample)
KR (1) KR20180118143A (enExample)
CN (1) CN108700661A (enExample)
TW (1) TW201733728A (enExample)
WO (1) WO2017161284A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021098223A (ja) * 2019-12-24 2021-07-01 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
JP2021533564A (ja) * 2018-08-08 2021-12-02 ロジャーズ ジャーマニー ゲーエムベーハーRogers Germany GmbH 金属セラミック基板を処理する方法、該方法を行うためのシステム、および該方法によって生成された金属セラミック基板
WO2023228548A1 (ja) * 2022-05-24 2023-11-30 ソニーグループ株式会社 ビーム整形装置、および加工装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112091421B (zh) * 2015-09-09 2022-12-23 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
US11192389B2 (en) * 2016-12-02 2021-12-07 Alltec Angewandte Laserlicht Technologie Gmbh System and method for laser marking substrates
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
TWI892641B (zh) * 2019-01-31 2025-08-01 美商伊雷克托科學工業股份有限公司 光學系統
WO2021205030A1 (fr) * 2020-04-10 2021-10-14 Rolex Sa Système de tournage laser, procédé de tournage laser utilisant une tel système, et composant obtenu par un tel procédé
CN113751880A (zh) * 2020-06-05 2021-12-07 Nps株式会社 蚀刻装置
US12097558B2 (en) 2021-04-27 2024-09-24 General Electric Company Systems and methods for laser processing system characterization and calibration
TWI867380B (zh) * 2022-12-02 2024-12-21 新代科技股份有限公司 雷射加工機台控制系統及其控制方法

Citations (4)

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JPH0847790A (ja) * 1994-06-02 1996-02-20 Mitsubishi Electric Corp 光加工装置及び方法
JP2002517315A (ja) * 1998-05-29 2002-06-18 エクシテック リミテッド 電気回路配線パッケージにマイクロビアホールを穿孔するための装置及び方法
JP2007229786A (ja) * 2006-03-02 2007-09-13 Sumitomo Heavy Ind Ltd レーザ加工装置及び焦点合わせ制御方法
US20090002687A1 (en) * 2007-06-29 2009-01-01 Thomas Wenzel Focus determination for laser-mask imaging systems

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US5751585A (en) 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US6720519B2 (en) * 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
US6815638B2 (en) * 2002-07-25 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of determining a minimum pulse width for a short pulse laser system
CN1795071A (zh) * 2002-09-13 2006-06-28 塔米卡有限公司 复杂物体的激光修整
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
US7605343B2 (en) 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
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US8198564B2 (en) * 2008-09-09 2012-06-12 Electro Scientific Industries, Inc. Adaptive optic beamshaping in laser processing systems
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US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
KR102283654B1 (ko) * 2014-11-14 2021-07-29 가부시키가이샤 니콘 조형 장치 및 조형 방법
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0847790A (ja) * 1994-06-02 1996-02-20 Mitsubishi Electric Corp 光加工装置及び方法
JP2002517315A (ja) * 1998-05-29 2002-06-18 エクシテック リミテッド 電気回路配線パッケージにマイクロビアホールを穿孔するための装置及び方法
JP2007229786A (ja) * 2006-03-02 2007-09-13 Sumitomo Heavy Ind Ltd レーザ加工装置及び焦点合わせ制御方法
US20090002687A1 (en) * 2007-06-29 2009-01-01 Thomas Wenzel Focus determination for laser-mask imaging systems

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021533564A (ja) * 2018-08-08 2021-12-02 ロジャーズ ジャーマニー ゲーエムベーハーRogers Germany GmbH 金属セラミック基板を処理する方法、該方法を行うためのシステム、および該方法によって生成された金属セラミック基板
JP7073578B2 (ja) 2018-08-08 2022-05-23 ロジャーズ ジャーマニー ゲーエムベーハー 金属セラミック基板を処理する方法、該方法を行うためのシステム、および該方法によって生成された金属セラミック基板
JP2021098223A (ja) * 2019-12-24 2021-07-01 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7386073B2 (ja) 2019-12-24 2023-11-24 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2023228548A1 (ja) * 2022-05-24 2023-11-30 ソニーグループ株式会社 ビーム整形装置、および加工装置

Also Published As

Publication number Publication date
KR20180118143A (ko) 2018-10-30
US10864599B2 (en) 2020-12-15
WO2017161284A1 (en) 2017-09-21
US20190001434A1 (en) 2019-01-03
CN108700661A (zh) 2018-10-23
TW201733728A (zh) 2017-10-01

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