JP2017504175A5 - - Google Patents

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Publication number
JP2017504175A5
JP2017504175A5 JP2016563893A JP2016563893A JP2017504175A5 JP 2017504175 A5 JP2017504175 A5 JP 2017504175A5 JP 2016563893 A JP2016563893 A JP 2016563893A JP 2016563893 A JP2016563893 A JP 2016563893A JP 2017504175 A5 JP2017504175 A5 JP 2017504175A5
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JP
Japan
Prior art keywords
charged particle
interest
substrate
region
scanning
Prior art date
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Application number
JP2016563893A
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English (en)
Japanese (ja)
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JP6722114B2 (ja
JP2017504175A (ja
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Priority claimed from US14/153,923 external-priority patent/US9466462B2/en
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Publication of JP2017504175A publication Critical patent/JP2017504175A/ja
Publication of JP2017504175A5 publication Critical patent/JP2017504175A5/ja
Application granted granted Critical
Publication of JP6722114B2 publication Critical patent/JP6722114B2/ja
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JP2016563893A 2014-01-13 2015-01-12 電子ビームシステムを使用した関心領域の検査 Active JP6722114B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/153,923 US9466462B2 (en) 2014-01-13 2014-01-13 Inspection of regions of interest using an electron beam system
US14/153,923 2014-01-13
PCT/US2015/011050 WO2015106212A1 (en) 2014-01-13 2015-01-12 Inspection of regions of interest using an electron beam system

Publications (3)

Publication Number Publication Date
JP2017504175A JP2017504175A (ja) 2017-02-02
JP2017504175A5 true JP2017504175A5 (enExample) 2018-02-22
JP6722114B2 JP6722114B2 (ja) 2020-07-15

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ID=53521944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016563893A Active JP6722114B2 (ja) 2014-01-13 2015-01-12 電子ビームシステムを使用した関心領域の検査

Country Status (5)

Country Link
US (1) US9466462B2 (enExample)
JP (1) JP6722114B2 (enExample)
KR (1) KR101751663B1 (enExample)
TW (1) TWI603364B (enExample)
WO (1) WO2015106212A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9847209B2 (en) 2014-01-13 2017-12-19 Applied Materials Israel Ltd. Inspection of regions of interest using an electron beam system
WO2015191543A1 (en) * 2014-06-10 2015-12-17 Applied Materials Israel, Ltd. Scanning an object using multiple mechanical stages
US10288409B2 (en) * 2015-04-01 2019-05-14 Applied Materials Israel Ltd. Temperature sensitive location error compensation
US10541104B2 (en) 2015-07-09 2020-01-21 Applied Materials Israel Ltd. System and method for scanning an object with an electron beam using overlapping scans and electron beam counter-deflection
US10054551B2 (en) 2016-04-20 2018-08-21 Applied Materials Israel Ltd. Inspection system and method for inspecting a sample by using a plurality of spaced apart beams
US9881765B2 (en) * 2016-04-20 2018-01-30 Applied Materials Israel Ltd. Method and system for scanning an object
US10388489B2 (en) 2017-02-07 2019-08-20 Kla-Tencor Corporation Electron source architecture for a scanning electron microscopy system
JP7043587B2 (ja) * 2017-09-07 2022-03-29 エーエスエムエル ネザーランズ ビー．ブイ． 荷電粒子の複数のビームを用いたサンプル検査の方法
CN111527581B (zh) * 2017-09-29 2023-11-14 Asml荷兰有限公司 利用多个带电粒子束检查样品的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3148353B2 (ja) * 1991-05-30 2001-03-19 ケーエルエー・インストルメンツ・コーポレーション 電子ビーム検査方法とそのシステム
JP3601382B2 (ja) 1998-11-17 2004-12-15 株式会社日立製作所 荷電粒子線を用いた検査装置および検査方法
JP4034500B2 (ja) 2000-06-19 2008-01-16 株式会社日立製作所 半導体装置の検査方法及び検査装置、及びそれを用いた半導体装置の製造方法
JP2004227886A (ja) * 2003-01-22 2004-08-12 Hitachi High-Technologies Corp 走査電子顕微鏡
DE602006020899D1 (de) 2005-09-06 2011-05-05 Applied Materials Israel Ltd Teilchenoptische Anordnung mit teilchenoptischer Komponente
KR101487359B1 (ko) * 2006-01-25 2015-01-29 가부시키가이샤 에바라 세이사꾸쇼 시료 표면 검사방법 및 검사장치
JP5037850B2 (ja) 2006-04-28 2012-10-03 株式会社アドバンテスト 電子ビーム露光装置
JP4997076B2 (ja) * 2007-11-22 2012-08-08 株式会社日立ハイテクノロジーズ 荷電粒子線装置、及び荷電粒子線装置における画像生成方法
US8063363B2 (en) 2008-03-31 2011-11-22 Hermes-Microvision, Inc. Method and apparatus for charged particle beam inspection
TWI415161B (zh) * 2009-03-31 2013-11-11 Hermes Microvision Inc 帶電粒子束成像系統與於連續移動平台上陣列掃描一試片以進行該試片帶電粒子束成像的方法
WO2011102511A1 (ja) 2010-02-22 2011-08-25 株式会社日立ハイテクノロジーズ 回路パターン検査装置
JP2012150065A (ja) * 2011-01-21 2012-08-09 Hitachi High-Technologies Corp 回路パターン検査装置およびその検査方法

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