JP2012178347A5 - - Google Patents
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- Publication number
- JP2012178347A5 JP2012178347A5 JP2012031773A JP2012031773A JP2012178347A5 JP 2012178347 A5 JP2012178347 A5 JP 2012178347A5 JP 2012031773 A JP2012031773 A JP 2012031773A JP 2012031773 A JP2012031773 A JP 2012031773A JP 2012178347 A5 JP2012178347 A5 JP 2012178347A5
- Authority
- JP
- Japan
- Prior art keywords
- ion
- current
- ion beam
- aperture
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000010884 ion-beam technique Methods 0.000 claims 73
- 238000000034 method Methods 0.000 claims 26
- 230000003213 activating effect Effects 0.000 claims 17
- 238000003801 milling Methods 0.000 claims 17
- 239000002245 particle Substances 0.000 claims 13
- 230000008021 deposition Effects 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 3
- 239000011241 protective layer Substances 0.000 claims 2
- 238000003384 imaging method Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161446804P | 2011-02-25 | 2011-02-25 | |
| US61/446,804 | 2011-02-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012178347A JP2012178347A (ja) | 2012-09-13 |
| JP2012178347A5 true JP2012178347A5 (enExample) | 2015-06-11 |
| JP6219019B2 JP6219019B2 (ja) | 2017-10-25 |
Family
ID=45655899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012031773A Active JP6219019B2 (ja) | 2011-02-25 | 2012-02-16 | 荷電粒子ビーム・システムにおいて大電流モードと小電流モードとを高速に切り替える方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9257261B2 (enExample) |
| EP (1) | EP2492950B1 (enExample) |
| JP (1) | JP6219019B2 (enExample) |
| CN (1) | CN102651299B (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2707893B1 (en) * | 2011-05-13 | 2019-01-16 | Fibics Incorporated | Microscopy imaging method and system |
| US9275823B2 (en) | 2012-03-21 | 2016-03-01 | Fei Company | Multiple gas injection system |
| JP5952048B2 (ja) * | 2012-03-23 | 2016-07-13 | 株式会社日立ハイテクサイエンス | イオンビーム装置 |
| JP5743950B2 (ja) * | 2012-04-27 | 2015-07-01 | 株式会社日立ハイテクノロジーズ | 走査電子顕微鏡 |
| US9105438B2 (en) | 2012-05-31 | 2015-08-11 | Fei Company | Imaging and processing for plasma ion source |
| US8502172B1 (en) * | 2012-06-26 | 2013-08-06 | Fei Company | Three dimensional fiducial |
| EP2867915B1 (en) | 2012-06-29 | 2016-07-13 | FEI Company | Multi species ion source |
| US8859982B2 (en) * | 2012-09-14 | 2014-10-14 | Kla-Tencor Corporation | Dual-lens-gun electron beam apparatus and methods for high-resolution imaging with both high and low beam currents |
| US8884247B2 (en) | 2012-09-25 | 2014-11-11 | Fei Company | System and method for ex situ analysis of a substrate |
| US10883303B2 (en) | 2013-01-07 | 2021-01-05 | WexEnergy LLC | Frameless supplemental window for fenestration |
| US8923650B2 (en) | 2013-01-07 | 2014-12-30 | Wexenergy Innovations Llc | System and method of measuring distances related to an object |
| US10196850B2 (en) | 2013-01-07 | 2019-02-05 | WexEnergy LLC | Frameless supplemental window for fenestration |
| US9230339B2 (en) | 2013-01-07 | 2016-01-05 | Wexenergy Innovations Llc | System and method of measuring distances related to an object |
| US9691163B2 (en) | 2013-01-07 | 2017-06-27 | Wexenergy Innovations Llc | System and method of measuring distances related to an object utilizing ancillary objects |
| US9845636B2 (en) | 2013-01-07 | 2017-12-19 | WexEnergy LLC | Frameless supplemental window for fenestration |
| KR20150089393A (ko) | 2014-01-27 | 2015-08-05 | 삼성전자주식회사 | 배터리 충전 제어 방법 및 그 전자 장치 |
| US9378927B2 (en) * | 2014-09-11 | 2016-06-28 | Fei Company | AutoSlice and view undercut method |
| US9619728B2 (en) * | 2015-05-31 | 2017-04-11 | Fei Company | Dynamic creation of backup fiducials |
| JP2017020106A (ja) | 2015-07-02 | 2017-01-26 | エフ・イ−・アイ・カンパニー | 高スループット・パターン形成のための適応ビーム電流 |
| US9679742B2 (en) * | 2015-10-30 | 2017-06-13 | Fei Company | Method for optimizing charged particle beams formed by shaped apertures |
| US9881764B2 (en) * | 2016-01-09 | 2018-01-30 | Kla-Tencor Corporation | Heat-spreading blanking system for high throughput electron beam apparatus |
| US9899181B1 (en) | 2017-01-12 | 2018-02-20 | Fei Company | Collision ionization ion source |
| US9941094B1 (en) | 2017-02-01 | 2018-04-10 | Fei Company | Innovative source assembly for ion beam production |
| JP2018152183A (ja) * | 2017-03-10 | 2018-09-27 | 株式会社日立製作所 | 微細構造体の製造方法および製造装置 |
| CA3071106A1 (en) | 2017-05-30 | 2018-12-06 | WexEnergy LLC | Frameless supplemental window for fenestration |
| US10096447B1 (en) * | 2017-08-02 | 2018-10-09 | Kla-Tencor Corporation | Electron beam apparatus with high resolutions |
| US11315754B2 (en) * | 2020-04-27 | 2022-04-26 | Applied Materials Israel Ltd. | Adaptive geometry for optimal focused ion beam etching |
| WO2022016502A1 (en) * | 2020-07-24 | 2022-01-27 | Yangtze Memory Technologies Co., Ltd. | Method of preparing and analyzing thin films |
| JPWO2024134744A1 (enExample) * | 2022-12-20 | 2024-06-27 | ||
| WO2025242376A1 (en) * | 2024-05-22 | 2025-11-27 | Carl Zeiss Smt Gmbh | Semiconductor sample with reduced preparation time |
| CN120480677B (zh) * | 2025-07-21 | 2025-09-16 | 胜科纳米(苏州)股份有限公司 | 一种芯片截面结构研磨中精确定位的无损方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6180744A (ja) * | 1984-09-27 | 1986-04-24 | Hitachi Ltd | イオンマイクロビ−ム装置 |
| JP2765829B2 (ja) * | 1986-09-29 | 1998-06-18 | 株式会社日立製作所 | 集束イオンビーム加工装置 |
| US5149976A (en) * | 1990-08-31 | 1992-09-22 | Hughes Aircraft Company | Charged particle beam pattern generation apparatus and method |
| JP3060613B2 (ja) * | 1991-07-12 | 2000-07-10 | 株式会社日立製作所 | 集束イオンビーム装置、及び集束イオンビームを用いた断面加工方法 |
| JPH1177333A (ja) * | 1997-09-09 | 1999-03-23 | Hitachi Ltd | 集束イオンビーム加工装置及びその方法 |
| EP1526563B1 (en) * | 2003-10-20 | 2018-12-05 | ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle beam device with aperture |
| US7241361B2 (en) | 2004-02-20 | 2007-07-10 | Fei Company | Magnetically enhanced, inductively coupled plasma source for a focused ion beam system |
| JP4338593B2 (ja) * | 2004-06-15 | 2009-10-07 | 株式会社日立ハイテクノロジーズ | 集束イオンビーム装置 |
| ATE532203T1 (de) | 2004-08-27 | 2011-11-15 | Fei Co | Lokalisierte plasmabehandlung |
| JP5033314B2 (ja) * | 2004-09-29 | 2012-09-26 | 株式会社日立ハイテクノロジーズ | イオンビーム加工装置及び加工方法 |
| JP4878135B2 (ja) | 2005-08-31 | 2012-02-15 | エスアイアイ・ナノテクノロジー株式会社 | 荷電粒子ビーム装置及び試料加工方法 |
| JP4571053B2 (ja) * | 2005-09-29 | 2010-10-27 | 株式会社日立ハイテクノロジーズ | 荷電粒子ビーム装置 |
| JP5371142B2 (ja) | 2006-07-14 | 2013-12-18 | エフ・イ−・アイ・カンパニー | マルチソース型のプラズマ集束イオン・ビーム・システム |
| US8303833B2 (en) | 2007-06-21 | 2012-11-06 | Fei Company | High resolution plasma etch |
| WO2009089499A2 (en) | 2008-01-09 | 2009-07-16 | Fei Company | Multibeam system |
| EP2233907A1 (en) | 2009-03-27 | 2010-09-29 | FEI Company | Forming an image while milling a work piece |
| JP5702552B2 (ja) | 2009-05-28 | 2015-04-15 | エフ イー アイ カンパニFei Company | デュアルビームシステムの制御方法 |
| EP2471086B1 (en) | 2009-08-28 | 2013-12-11 | FEI Company | Pattern modification schemes for improved fib patterning |
| US8253118B2 (en) * | 2009-10-14 | 2012-08-28 | Fei Company | Charged particle beam system having multiple user-selectable operating modes |
-
2012
- 2012-02-16 JP JP2012031773A patent/JP6219019B2/ja active Active
- 2012-02-16 EP EP12155691.4A patent/EP2492950B1/en active Active
- 2012-02-24 CN CN201210055385.2A patent/CN102651299B/zh active Active
- 2012-02-27 US US13/406,207 patent/US9257261B2/en active Active
-
2016
- 2016-02-08 US US15/018,354 patent/US10176969B2/en active Active
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